{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,5]],"date-time":"2026-02-05T07:55:51Z","timestamp":1770278151507,"version":"3.49.0"},"reference-count":20,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"11","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Trans. Fundamentals"],"published-print":{"date-parts":[[2021,11,1]]},"DOI":"10.1587\/transfun.2020kep0012","type":"journal-article","created":{"date-parts":[[2021,5,11]],"date-time":"2021-05-11T22:07:49Z","timestamp":1620770869000},"page":"1451-1460","source":"Crossref","is-referenced-by-count":4,"title":["Analysis on Multi-Stage LC Ladder Matching Circuits with Complex Terminated LC and CL Circuits"],"prefix":"10.1587","volume":"E104.A","author":[{"given":"Satoshi","family":"TANAKA","sequence":"first","affiliation":[{"name":"Murata Manufacturing Co., Ltd."}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"crossref","unstructured":"[1] J.P. Young and N. Cheng, \u201cMultimode multiband power amplifier optimization for mobile applications,\u201d VLS-TSA pp.1-3, April 2013. 10.1109\/vlsi-tsa.2013.6545576","DOI":"10.1109\/VLSI-TSA.2013.6545576"},{"key":"2","doi-asserted-by":"crossref","unstructured":"[2] T. Gillenwater and M. Schindler, \u201cTechnology trends in mobile handsets,\u201d IEEE IWS pp.1-4, April 2013. 10.1109\/ieee-iws.2013.6616852","DOI":"10.1109\/IEEE-IWS.2013.6616852"},{"key":"3","doi-asserted-by":"crossref","unstructured":"[3] J. Jeon, J. Oh, J. Jung, and S. Paek, \u201cMultimode multiband power amplifier module integrated duplexer for mobile applications,\u201d IEEE RFIT pp.110-112, Aug. 2017. 10.1109\/rfit.2017.8048219","DOI":"10.1109\/RFIT.2017.8048219"},{"key":"4","doi-asserted-by":"publisher","unstructured":"[4] S. Tanaka, \u201cProgress of the linear RF power amplifier for mobile phones,\u201d IEICE Trans. Fundamentals, vol.E101-A, no.2, pp.385-395, Feb. 2018. 10.1587\/transfun.e101.a.385","DOI":"10.1587\/transfun.E101.A.385"},{"key":"5","doi-asserted-by":"crossref","unstructured":"[5] C.-W.P. Huang, M. Doherty, L.R. Lam, A. Quaglietta, M. Johnson, and B. Vaillancourt, \u201cA compact 5-6GHz T\/R module based on SiGe BiCMOS and SOI that enhances 256 QAM 802.11ac WLAN radio front-end designs,\u201d IEEE, WAMICON, pp.1-3, April 2014. 10.1109\/wamicon.2014.6857790","DOI":"10.1109\/WAMICON.2014.6857790"},{"key":"6","doi-asserted-by":"publisher","unstructured":"[6] A. Tombak, D.C. Dening, M.S. Carroll, J. Costa, and E. Spears, \u201cHigh-efficiency cellular power amplifiers based on a modied LDMOS process on bulk silicon and silicon-on-insulator substrates with integrated power management circuitry,\u201d IEEE Trans. Microw. Theory Techn., vol.60, no.6, pp.1862-1869, June 2012. 10.1109\/tmtt.2012.2191975","DOI":"10.1109\/TMTT.2012.2191975"},{"key":"7","unstructured":"[7] Y. Cho, D. Kang, D. Kim, J. Kim, B. Park, and B. Kim, \u201cLow idle current LTE power amplifier with 2nd harmonic control,\u201d EuMIC, pp.337-340, Oct. 2012."},{"key":"8","doi-asserted-by":"crossref","unstructured":"[8] K. Moon, Y. Cho, J. Kim, B. Park, H. Jin, J. Shin, and B. Kim, \u201cOptimization of idle current in envelope tracking power amplifier for efficiency and linearity,\u201d EuMIC, pp.141-144, Oct. 2016. 10.1109\/eumic.2016.7777510","DOI":"10.1109\/EuMIC.2016.7777510"},{"key":"9","doi-asserted-by":"publisher","unstructured":"[9] K. Mori, S. Shinjo, F. Kitabayashi, A. Ohta, Y. Ikeda, and O. Ishida, \u201cAn L-band high-efficiency and low-distortion power amplifier using HPF\/LPF combined inter-stage matching circuit,\u201d IEEE Trans. Microw. Theory Techn., vol.48, no.12, pp.2560-2566, Dec. 2000. 10.1109\/22.899013","DOI":"10.1109\/22.899013"},{"key":"10","unstructured":"[10] Y. Konishi, Introduction to Wireless Communication Circuits, Sogo-Shuppan-Sha, Aug. 1995."},{"key":"11","doi-asserted-by":"publisher","unstructured":"[11] S. Tanaka, \u201cA new decomposition method of LC-ladder matching circuits with negative components,\u201d IEICE Trans. Fundamentals, vol.E103-A, no.9, pp.1011-1017, Sept. 2020. 10.1587\/transfun.2019kep0004","DOI":"10.1587\/transfun.2019KEP0004"},{"key":"12","doi-asserted-by":"crossref","unstructured":"[12] S. Tanaka, \u201cA study on output matching circuits of power amplifiers for multi-band mobile phone terminals,\u201d IEEE RFIT 2020, pp.78-80, Sept. 2020. 10.1109\/rfit49453.2020.9226223","DOI":"10.1109\/RFIT49453.2020.9226223"},{"key":"13","unstructured":"[13] S. Tanaka, \u201cA parameter analysis on LC-matching circuits for mobile phone applications,\u201d IEICE Technical Report, CAS2019-25, Oct. 2019."},{"key":"14","doi-asserted-by":"crossref","unstructured":"[14] S. Tanaka, \u201cA study on output matching circuits of power amplifier for mobile phone terminals,\u201d IEICE Technical Report, CAS2019-97, Jan. 2020.","DOI":"10.1109\/RFIT49453.2020.9226223"},{"key":"15","doi-asserted-by":"publisher","unstructured":"[15] D.C. Fielder, \u201cBroad-band matching between load and source systems,\u201d IRE Trans. Circuit Theory, vol.8, no.2, pp.138-152 June 1961. 10.1109\/tct.1961.1086762","DOI":"10.1109\/TCT.1961.1086762"},{"key":"16","doi-asserted-by":"publisher","unstructured":"[16] H. Dedieu, C. Dehollain, J. Neirynck, and G. Rhodes, \u201cA new method for solving broadband matching problems,\u201d IEEE Trans. Circuits Syst. I, Fundam. Theory Appl., vol.41, no.9, pp.561-571, Sept. 1994. 10.1109\/81.317955","DOI":"10.1109\/81.317955"},{"key":"17","doi-asserted-by":"publisher","unstructured":"[17] A. Kilinc and B.S. Yarman, \u201cHigh precision LC ladder synthesis Part I: Lowpass ladder synthesis via parametric approach,\u201d IEEE Trans. Circuits Syst. I, Reg. Papers, vol.60, no.8, pp.2074-2083, Aug. 2013. 10.1109\/tcsi.2013.2239163","DOI":"10.1109\/TCSI.2013.2239163"},{"key":"18","doi-asserted-by":"publisher","unstructured":"[18] B.S. Yarman and A. Kilinc, \u201cHigh precision LC ladder synthesis Part II: Immittance synthesis with transmission zeros at DC and infinity,\u201d IEEE Trans. Circuits Syst. I, Reg. Papers, vol.60, no.10, pp.2719-2729, Oct. 2013. 10.1109\/tcsi.2013.2244315","DOI":"10.1109\/TCSI.2013.2244315"},{"key":"19","doi-asserted-by":"publisher","unstructured":"[19] Y. Okada, T. Kawai, and A. Enokihara, \u201cDesign method for multiband WPDs using multisection LC-ladder circuits,\u201d IEEE Microw. Compon. Lett., vol.27, no.10, pp.894-896, Oct. 2017. 10.1109\/lmwc.2017.2746681","DOI":"10.1109\/LMWC.2017.2746681"},{"key":"20","doi-asserted-by":"crossref","unstructured":"[20] S. Tanaka, \u201cA study on wideband multi-stage LC matching circuits of power amplifiers for mobile phone terminals,\u201d IEICE Technical Report, CAS2019-123, Feb. 2020.","DOI":"10.1109\/RFIT49453.2020.9226223"}],"container-title":["IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/transfun\/E104.A\/11\/E104.A_2020KEP0012\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,11,6]],"date-time":"2021-11-06T03:19:39Z","timestamp":1636168779000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/transfun\/E104.A\/11\/E104.A_2020KEP0012\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,11,1]]},"references-count":20,"journal-issue":{"issue":"11","published-print":{"date-parts":[[2021]]}},"URL":"https:\/\/doi.org\/10.1587\/transfun.2020kep0012","relation":{},"ISSN":["0916-8508","1745-1337"],"issn-type":[{"value":"0916-8508","type":"print"},{"value":"1745-1337","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021,11,1]]},"article-number":"2020KEP0012"}}