{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,20]],"date-time":"2025-09-20T20:10:16Z","timestamp":1758399016290},"reference-count":30,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"8","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Trans. Fundamentals"],"published-print":{"date-parts":[[2024,8,1]]},"DOI":"10.1587\/transfun.2023eap1102","type":"journal-article","created":{"date-parts":[[2024,2,14]],"date-time":"2024-02-14T22:14:42Z","timestamp":1707948882000},"page":"1345-1354","source":"Crossref","is-referenced-by-count":2,"title":["A Combination Method for Impedance Extraction of SMD Electronic Components Based on Full-Wave Simulation and De-Embedding Technique"],"prefix":"10.1587","volume":"E107.A","author":[{"given":"Yang","family":"XIAO","sequence":"first","affiliation":[{"name":"Research Center of Electromagnetic Environment Effect, Southeast University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhongyuan","family":"ZHOU","sequence":"additional","affiliation":[{"name":"Research Center of Electromagnetic Environment Effect, Southeast University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mingjie","family":"SHENG","sequence":"additional","affiliation":[{"name":"Research Center of Electromagnetic Environment Effect, Southeast University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qi","family":"ZHOU","sequence":"additional","affiliation":[{"name":"Research Center of Electromagnetic Environment Effect, Southeast University"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"532","reference":[{"key":"1","unstructured":"[1] H. Tohya, \u201cNew technologies doing much for solving the EMC problem in the high performance digital PCBs and equipment,\u201d IEICE Trans. Fundamentals, vol.E82-A, no.3, pp.450-456, March 1999."},{"key":"2","doi-asserted-by":"publisher","unstructured":"[2] Y. Xiao, Z. Zhou, X. Zhou, Q. Zhou, M. Sheng, Y. Gu, and M. Yang, \u201cExperimental investigation on electromagnetic immunity and conduction immunity of digital control circuit based on ARM,\u201d IEICE Trans. Commun., vol.E106-B, no.10, pp.969-978, Oct. 2023. 10.1587\/transcom.2023EBP3003","DOI":"10.1587\/transcom.2023EBP3003"},{"key":"3","doi-asserted-by":"publisher","unstructured":"[4] N. Azuma, S. Shimazaki, N. Miura, M. Nagata, T. Kitamura, S. Takahashi, M. Murakami, K. Hori, A. Nakamura, K. Tsukamoto, M. Iwanami, E. Hankui, S. Muroga, Y. Endo, S. Tanaka, and M. Yamaguchi, \u201cChip level simulation of substrate noise coupling and interference in RF ICs with CMOS digital noise emulator,\u201d IEICE Trans. Electron., vol.E97-C, no.6, pp.546-556, June 2014. 10.1587\/transele.e97.c.546","DOI":"10.1587\/transele.E97.C.546"},{"key":"4","doi-asserted-by":"publisher","unstructured":"[5] Y. Xiao, Z. Zhou, C. Tang, J. Ren, M. Sheng, and Z. Xu, \u201cSimulation research on low frequency magnetic radiation emission of shipboard equipment.\u201d IEICE Trans. Electron., vol.E106-C, no.2, pp.41-49, Feb. 2023. 10.1587\/transele.2022ecp5001","DOI":"10.1587\/transele.2022ECP5001"},{"key":"5","doi-asserted-by":"publisher","unstructured":"[6] R. Chen, J.D. van Wyk, S. Wang, and W.G. Odendaal, \u201cImproving the characteristics of integrated EMI filters by embedded conductive layers,\u201d IEEE Trans. Power Electron., vol.20, no.3, pp.611-619, May 2005. 10.1109\/tpel.2005.846526","DOI":"10.1109\/TPEL.2005.846526"},{"key":"6","doi-asserted-by":"publisher","unstructured":"[7] S.F.-C. Tseng, W.-T.K. Chien, E. Gong, and B.-C. Cai, \u201cA cost-effective wafer-level reliability test system for integrated circuit makers,\u201d IEEE Trans. Instrum. Meas., vol.52, no.5, pp.1458-1467, Oct. 2003. 10.1109\/tim.2003.818543","DOI":"10.1109\/TIM.2003.818543"},{"key":"7","doi-asserted-by":"publisher","unstructured":"[8] D. Baderna, A. Cabrini, and G. Torelli, \u201cThermal regulator for IC temperature characterization using a microprobe station,\u201d IEEE Trans. Instrum. Meas., vol.55, no.3, pp.754-760, June 2006. 10.1109\/tim.2006.870102","DOI":"10.1109\/TIM.2006.870102"},{"key":"8","doi-asserted-by":"publisher","unstructured":"[9] T. Li, D.J. Pommerenke, J. Zhang, and K. Hu, \u201cA current probe for measuring the individual ball current in a ball-grid-array packaged device,\u201d IEEE Trans. Instrum. Meas., vol.62, no.12, pp.3323-3332, Dec. 2013. 10.1109\/tim.2013.2272863","DOI":"10.1109\/TIM.2013.2272863"},{"key":"9","doi-asserted-by":"publisher","unstructured":"[10] F. de Paulis, S. Piersanti, Q. Wang, J. Cho, N. Erickson, B. Achkir, J. Fan, J. Drewniak, and A. Orlandi, \u201cTEM-like launch geometries and simplified de-embedding for accurate through silicon via characterization,\u201d IEEE Trans. Instrum. Meas., vol.66, no.4, pp.792-800, April 2017. 10.1109\/tim.2017.2654068","DOI":"10.1109\/TIM.2017.2654068"},{"key":"10","doi-asserted-by":"publisher","unstructured":"[11] J. Cheng, C. Zhou, D. Yu, Z. Xu, and D. Zhang, \u201cAn ICIM-CI-T model for EMI prediction of IO element on typical FPGA with temperature effect considered,\u201d IEEE Trans. Electromagn. Compat., vol.62, no.3, pp.755-764, June 2020. 10.1109\/temc.2019.2919710","DOI":"10.1109\/TEMC.2019.2919710"},{"key":"11","doi-asserted-by":"publisher","unstructured":"[12] A. Llamazares, M. Garc\u00eda-Gracia, and S. Mart\u00edn-Arroyo, \u201cCharacterization of parasitic impedance in PCB using a flexible test probe based on a curve-fitting method,\u201d IEEE Access, vol.9, pp.40695-40705, 2021. 10.1109\/access.2021.3064190","DOI":"10.1109\/ACCESS.2021.3064190"},{"key":"12","doi-asserted-by":"publisher","unstructured":"[13] B.W. Nelson, A.N. Lemmon, B.T. DeBoi, and T.J. Freeborn, \u201cModeling and validation of fixture-induced error for impedance measurements,\u201d IEEE Trans. Instrum. Meas., vol.68, no.1, pp.129-137, Jan. 2019. 10.1109\/tim.2018.2838858","DOI":"10.1109\/TIM.2018.2838858"},{"key":"13","doi-asserted-by":"publisher","unstructured":"[14] R.F. Bauer and P. Penfield, \u201cDe-embedding and unterminating,\u201d IEEE Trans. Microw. Theory Techn., vol.MTT-22, no.3, pp.282-288, March 1974. 10.1109\/tmtt.1974.1128212","DOI":"10.1109\/TMTT.1974.1128212"},{"key":"14","doi-asserted-by":"publisher","unstructured":"[15] B.-W. Liu, X.-C. Wei, and C.-X. Xv, \u201cA hybrid de-embedding method for low loss and reciprocal PCB fixtures,\u201d IEEE Trans. Instrum. Meas., vol.71, pp.1-8, April 2022. 10.1109\/tim.2022.3169162","DOI":"10.1109\/TIM.2022.3169162"},{"key":"15","doi-asserted-by":"publisher","unstructured":"[16] P.C. Sharma and K.C. Gupta, \u201cA generalized method for de-embedding of multiport networks,\u201d IEEE Trans. Instrum. Meas., vol.IM-30, no.4, pp.305-307, Dec. 1981. 10.1109\/tim.1981.6312418","DOI":"10.1109\/TIM.1981.6312418"},{"key":"16","doi-asserted-by":"publisher","unstructured":"[17] J. Wu, A. Boyer, J. Li, B. Vrignon, S.B. Dhia, E. Sicard, and R. Shen, \u201cModeling and simulation of LDO voltage regulator susceptibility to conducted EMI,\u201d IEEE Trans. Electromagn. Compat., vol.56, no.3, pp.726-735, June 2014. 10.1109\/temc.2013.2294951","DOI":"10.1109\/TEMC.2013.2294951"},{"key":"17","doi-asserted-by":"publisher","unstructured":"[18] C. Liu, A. Wu, C. Li, and N. Ridler, \u201cA new SOLT calibration method for leaky on-wafer measurements using a 10-term error model,\u201d IEEE Trans. Microw. Theory Techn., vol.66, no.8, pp.3894-3900, Aug. 2018. 10.1109\/tmtt.2018.2832052","DOI":"10.1109\/TMTT.2018.2832052"},{"key":"18","doi-asserted-by":"publisher","unstructured":"[19] L. Wan, Q. Li, Z. Wang, and J. Wu, \u201cImproved multimode TRL calibration method for characterization of homogeneous differential discontinuities,\u201d IEEE Trans. Instrum. Meas., vol.64, no.3, pp.694-703, March 2015. 10.1109\/tim.2014.2351311","DOI":"10.1109\/TIM.2014.2351311"},{"key":"19","doi-asserted-by":"publisher","unstructured":"[20] W. Zhao and Y. Wang, \u201cA reformulation and sensitivity analysis of TRL,\u201d IEEE Trans. Instrum. Meas., vol.69, no.7, pp.5107-5115, July 2020. 10.1109\/tim.2019.2950825","DOI":"10.1109\/TIM.2019.2950825"},{"key":"20","doi-asserted-by":"publisher","unstructured":"[21] L. Ye, C. Li, X. Sun, S. Jin, B. Chen, X. Ye, and J. Fan, \u201cThru-reflect-line calibration technique: Error analysis for characteristic impedance variations in the line standards,\u201d IEEE Trans. Electromagn. Compat., vol.59, no.3, pp.779-788, June 2017. 10.1109\/temc.2016.2623813","DOI":"10.1109\/TEMC.2016.2623813"},{"key":"21","doi-asserted-by":"publisher","unstructured":"[22] X. Wang, W. Wang, Y. Liang, and R. Jin, \u201c1-Thru deembedding method for one-port microwave device characterization,\u201d IEEE Microw. Wireless Compon. Lett., vol.32, no.4, pp.355-358, April 2022. 10.1109\/lmwc.2021.3128251","DOI":"10.1109\/LMWC.2021.3128251"},{"key":"22","doi-asserted-by":"crossref","unstructured":"[23] N. Takayama, K. Matsushita, S. Ito, N. Li, K. Bunsen, K. Okada, and A. Matsuzawa, \u201cA multi-line de-embedding technique for mm-wave CMOS circuits,\u201d 2009 Asia Pacific Microwave Conference, Singapore, pp.143-146, 2009, doi: 10.1109\/APMC.2009.5385333. 10.1109\/apmc.2009.5385333","DOI":"10.1109\/APMC.2009.5385333"},{"key":"23","doi-asserted-by":"publisher","unstructured":"[24] B. Pu, J. Fan, and W. Nah, \u201cImmunity enhancement of the power distribution network in integrated circuits with coplanar meander lines in package,\u201d IEEE Trans. Electromagn. Compat., vol.62, no.5, pp.2238-2246, Oct. 2020. 10.1109\/temc.2019.2962096","DOI":"10.1109\/TEMC.2019.2962096"},{"key":"24","unstructured":"[25] Agilent Technologies, \u201cUltra-low impedance measurements using2-port measurements,\u201d Agilent Technologies, Santa Clara, USA, 2007."},{"key":"25","unstructured":"[26] Agilent Technologies, \u201cDe-embedding and Embedding S-Parameter Networks Using a Vector Network Analyzer Application Note,\u201d Application Notes 1364-1."},{"key":"26","unstructured":"[27] IEEE Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50GHz, IEEE Std 370-2020, pp.1-147, Jan. 2021. 10.1109\/ieeestd.2021.9316329"},{"key":"27","doi-asserted-by":"crossref","unstructured":"[28] S. Kawai, K.K. Tokgoz, K. Okada, and A. Matsuzawa, \u201cL-2L de-embedding method with double-T-type PAD model for millimeter-wave amplifier design,\u201d 2015 IEEE 15th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, San Diego, CA, USA, pp.43-45, 2015. 10.1109\/sirf.2015.7119869","DOI":"10.1109\/SIRF.2015.7119869"},{"key":"28","doi-asserted-by":"crossref","unstructured":"[29] I. Abdo, K.K. Tokgoz, T. Fujimura, K. Okada, and A. Matsuzawa, \u201cComparison between L-2L and thru-reflect-line de-embedding methods for W-band CMOS amplifier design,\u201d 2017 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT), Seoul, Korea (South), pp.34-36, 2017. 10.1109\/rfit.2017.8048281","DOI":"10.1109\/RFIT.2017.8048281"},{"key":"29","doi-asserted-by":"publisher","unstructured":"[30] K.K. Tokgoz, K. Lim, S. Kawai, N. Fajri, K. Okada, and A. Matsuzawa, \u201cCharacterization of crossing transmission line using two-port measurements for millimeter-wave CMOS circuit design.\u201d IEICE Trans. Electron., vol.E98-C, no.1, pp.35-44, Jan. 2015. 10.1587\/transele.e98.c.35","DOI":"10.1587\/transele.E98.C.35"},{"key":"30","doi-asserted-by":"crossref","unstructured":"[31] X. Ye, J. Fan, B. Chen, J.L. Drewniak, and Q.B. Chen, \u201cAccurate characterization of PCB transmission lines for high speed interconnect,\u201d Proc. Asia-Pacific Symp. Electromagn. Compat., pp.16-19, 2015. 10.1109\/apemc.2015.7175382","DOI":"10.1109\/APEMC.2015.7175382"}],"container-title":["IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/transfun\/E107.A\/8\/E107.A_2023EAP1102\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,8,3]],"date-time":"2024-08-03T03:27:47Z","timestamp":1722655667000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/transfun\/E107.A\/8\/E107.A_2023EAP1102\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,8,1]]},"references-count":30,"journal-issue":{"issue":"8","published-print":{"date-parts":[[2024]]}},"URL":"https:\/\/doi.org\/10.1587\/transfun.2023eap1102","relation":{},"ISSN":["0916-8508","1745-1337"],"issn-type":[{"type":"print","value":"0916-8508"},{"type":"electronic","value":"1745-1337"}],"subject":[],"published":{"date-parts":[[2024,8,1]]},"article-number":"2023EAP1102"}}