{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,18]],"date-time":"2026-03-18T06:51:44Z","timestamp":1773816704968,"version":"3.50.1"},"reference-count":19,"publisher":"Zhejiang University Press","issue":"4","license":[{"start":{"date-parts":[[2013,4,1]],"date-time":"2013-04-01T00:00:00Z","timestamp":1364774400000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["J. Zhejiang Univ. - Sci. C"],"published-print":{"date-parts":[[2013,4]]},"DOI":"10.1631\/jzus.c12mnt01","type":"journal-article","created":{"date-parts":[[2013,4,9]],"date-time":"2013-04-09T01:16:26Z","timestamp":1365470186000},"page":"235-243","source":"Crossref","is-referenced-by-count":0,"title":["Electrical characterization of integrated passive devices using thin film technology for 3D integration"],"prefix":"10.1631","volume":"14","author":[{"given":"Xin","family":"Sun","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yun-hui","family":"Zhu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhen-hua","family":"Liu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qing-hu","family":"Cui","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sheng-lin","family":"Ma","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jing","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Min","family":"Miao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu-feng","family":"Jin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"635","published-online":{"date-parts":[[2013,4,10]]},"reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/19.746613"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/4.485838"},{"key":"ref3","volume-title":"Polymeric Materials for 3DIC & Wafer-Level Packaging Applications (Sample Presentation).","author":"Baron","year":"2012"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/eptc.2008.4763408"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/icept.2011.6066788"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/33.159877"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/22.275248"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/tadvp.2008.2005472"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/tcapt.2004.831780"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ectc.2012.6249087"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/jproc.2008.2007458"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/eumc.2008.4751525"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/esscirc.2010.5619857"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/icept.2011.6066918"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT.2010.5582360"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ectc.2010.5490751"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ectc.2012.6248840"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ectc.2012.6248883"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/3dic.2010.5751425"}],"container-title":["Journal of Zhejiang University SCIENCE C"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1631\/jzus.C12MNT01.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/article\/10.1631\/jzus.C12MNT01\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1631\/jzus.C12MNT01","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,3,18]],"date-time":"2026-03-18T05:52:59Z","timestamp":1773813179000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1631\/jzus.C12MNT01"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,4]]},"references-count":19,"journal-issue":{"issue":"4","published-print":{"date-parts":[[2013,4]]}},"alternative-id":["1392"],"URL":"https:\/\/doi.org\/10.1631\/jzus.c12mnt01","relation":{},"ISSN":["1869-1951","1869-196X"],"issn-type":[{"value":"1869-1951","type":"print"},{"value":"1869-196X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2013,4]]}}}