{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T01:26:47Z","timestamp":1729646807265,"version":"3.28.0"},"reference-count":23,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,3]]},"DOI":"10.23919\/date.2017.7926986","type":"proceedings-article","created":{"date-parts":[[2017,5,15]],"date-time":"2017-05-15T16:34:41Z","timestamp":1494866081000},"page":"220-225","source":"Crossref","is-referenced-by-count":3,"title":["Recovery-aware proactive TSV repair for electromigration in 3D ICs"],"prefix":"10.23919","author":[{"given":"Shengcheng","family":"Wang","sequence":"first","affiliation":[]},{"given":"Hongyang","family":"Zhao","sequence":"additional","affiliation":[]},{"given":"Sheldon X.-D.","family":"Tan","sequence":"additional","affiliation":[]},{"given":"Mehdi B.","family":"Tahoori","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","first-page":"559","article-title":"On effective through-silicon via repair for 3D-stacked ICs","volume":"32","author":"jiang","year":"2013","journal-title":"TCAD"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2012.6165053"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS.2012.6313847"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2107924"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1007\/3-540-36494-3_51"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228545"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1145\/1120725.1120787"},{"journal-title":"Systems and methods utilizing redundancy in semiconductor chip interconnects","year":"2013","author":"laisne","key":"ref17"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-0784-4"},{"journal-title":"Open Cores Standard","year":"0","key":"ref19"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/DFT.2013.6653610"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488824"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2012.6241869"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2016.7428018"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/2429384.2429451"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2013.6615556"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2012.06.021"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.136"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2980080"},{"journal-title":"NANGATE","year":"0","key":"ref20"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2011.6139179"},{"key":"ref21","first-page":"293","article-title":"Design issues and considerations for low-cost 3D TSV IC technology","volume":"46","author":"van der plas","year":"2011","journal-title":"JSSC"},{"key":"ref23","doi-asserted-by":"crossref","DOI":"10.1145\/2228360.2228477","article-title":"Optimizing energy efficiency of 3D multicore systems with stacked DRAM under power and thermal constraints","author":"meng","year":"2012","journal-title":"DAC"}],"event":{"name":"2017 Design, Automation & Test in Europe Conference & Exhibition (DATE)","start":{"date-parts":[[2017,3,27]]},"location":"Lausanne, Switzerland","end":{"date-parts":[[2017,3,31]]}},"container-title":["Design, Automation & Test in Europe Conference & Exhibition (DATE), 2017"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7919927\/7926947\/07926986.pdf?arnumber=7926986","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,9,24]],"date-time":"2019-09-24T13:37:53Z","timestamp":1569332273000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7926986\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,3]]},"references-count":23,"URL":"https:\/\/doi.org\/10.23919\/date.2017.7926986","relation":{},"subject":[],"published":{"date-parts":[[2017,3]]}}}