{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,6]],"date-time":"2025-06-06T05:06:51Z","timestamp":1749186411228,"version":"3.28.0"},"reference-count":15,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,3]]},"DOI":"10.23919\/date.2018.8342251","type":"proceedings-article","created":{"date-parts":[[2018,4,23]],"date-time":"2018-04-23T23:20:11Z","timestamp":1524525611000},"page":"1500-1503","source":"Crossref","is-referenced-by-count":9,"title":["Accurate prediction of smartphones' skin temperature by considering exothermic components"],"prefix":"10.23919","author":[{"given":"Jihoon","family":"Park","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Seokjun","family":"Lee","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hojung","family":"Cha","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"Trepn power profiler","year":"0","key":"ref10"},{"journal-title":"Iperf- the ultimate speed test tool for tcp udp and sctp","year":"0","author":"jon dugan","key":"ref11"},{"key":"ref12","doi-asserted-by":"crossref","first-page":"1097","DOI":"10.1109\/TC.2012.293","article-title":"An effective gray-box identification procedure for multicore thermal modeling","volume":"63","author":"beneventi","year":"2014","journal-title":"IEEE Transactions on Computers"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2012.117"},{"key":"ref14","first-page":"264","article-title":"Temperature minim ization using power redistribution in embedded systems","author":"ahmed","year":"2014","journal-title":"Proc of ICEST'2014"},{"key":"ref15","article-title":"AppScope: A pplication Energy Metering Framework for Android Smartphone U sing Kernel Activity Monitoring","author":"yoon","year":"2012","journal-title":"Proc of USENIX"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/2627369.2627641"},{"key":"ref3","first-page":"1088","article-title":"Development of algorithms for real-ti me estimation of smartphone surface temperature using embedded processor","author":"ishii","year":"2017","journal-title":"Proc of ITherm 2017"},{"journal-title":"Qualcomm Snapdragon 835","year":"0","key":"ref6"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2015.0148"},{"journal-title":"CPU Load Generator","year":"0","key":"ref8"},{"journal-title":"COX cx1000 thermal imaging camera","year":"0","key":"ref7"},{"journal-title":"Warning issued over ‘smartphone burns’ and other dangers","year":"0","key":"ref2"},{"journal-title":"Our test finds new iPad hits 116 degrees while running games","year":"0","key":"ref1"},{"journal-title":"M Software Hard Intensive GPU Benchmark","year":"0","key":"ref9"}],"event":{"name":"2018 Design, Automation & Test in Europe Conference & Exhibition (DATE)","start":{"date-parts":[[2018,3,19]]},"location":"Dresden, Germany","end":{"date-parts":[[2018,3,23]]}},"container-title":["2018 Design, Automation & Test in Europe Conference & Exhibition (DATE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8337149\/8341968\/08342251.pdf?arnumber=8342251","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,5,8]],"date-time":"2018-05-08T18:32:59Z","timestamp":1525804379000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8342251\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,3]]},"references-count":15,"URL":"https:\/\/doi.org\/10.23919\/date.2018.8342251","relation":{},"subject":[],"published":{"date-parts":[[2018,3]]}}}