{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,8,14]],"date-time":"2024-08-14T11:52:27Z","timestamp":1723636347694},"reference-count":27,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,3]]},"DOI":"10.23919\/date.2019.8715033","type":"proceedings-article","created":{"date-parts":[[2019,5,16]],"date-time":"2019-05-16T21:29:07Z","timestamp":1558042147000},"source":"Crossref","is-referenced-by-count":3,"title":["Enhancing Two-Phase Cooling Efficiency through Thermal-Aware Workload Mapping for Power-Hungry Servers"],"prefix":"10.23919","author":[{"given":"Arman","family":"Iranfar","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ali","family":"Pahlevan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Marina","family":"Zapater","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"David","family":"Atienza","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-7124-1"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1115\/1.2202882"},{"key":"ref12","author":"khalaj","year":"2017","journal-title":"A review on efficient thermal management of air-and liquid-cooled data centers From chip to the cooling system"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.energy.2012.04.037"},{"key":"ref14","author":"leonard","year":"2005","journal-title":"The thermal bus opportunity-a quantum leap in data center cooling potential"},{"key":"ref15","author":"ong","year":"2017","journal-title":"Two-phase mini-thermosyphon for cooling of data-centers Experiments modeling and simulations"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2016.7517602"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/GREENCOMP.2010.5598306"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/2333660.2333753"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2768417"},{"key":"ref4","article-title":"Uptime institute 2012 data center industry survey","author":"stansberry","year":"2013","journal-title":"White Paper"},{"key":"ref27","author":"cochran","year":"2011","journal-title":"Pack & cap adaptive dvfs and thread packing under power caps"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2760517"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/SEMI-THERM.2017.7896926"},{"key":"ref5","article-title":"Cisco unified computing system site planning guide: Data center power and cooling","year":"0"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2018.8419531"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2011.2164540"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.enbuild.2016.12.057"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2007.364540"},{"key":"ref1","article-title":"Growth in data center electricity use 2005 to 2010","author":"koomey","year":"2011","journal-title":"A report by Analytical Press at the request of The New York Times"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/SAMOS.2017.8344642"},{"key":"ref22","year":"0"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5653749"},{"key":"ref24","article-title":"Benchmarking modern multiprocessors","author":"bienia","year":"2011","journal-title":"Ph D Dissertation"},{"key":"ref23","article-title":"Intel xeon processor e5 v4 product family datasheet, volume one: Electrical","year":"2016"},{"key":"ref26","year":"0"},{"key":"ref25","article-title":"Optimizing resource provisioning in shared cloud systems","author":"delimitrou","year":"2014","journal-title":"Tech Rep"}],"event":{"name":"2019 Design, Automation & Test in Europe Conference & Exhibition (DATE)","location":"Florence, Italy","start":{"date-parts":[[2019,3,25]]},"end":{"date-parts":[[2019,3,29]]}},"container-title":["2019 Design, Automation & Test in Europe Conference & Exhibition (DATE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8704855\/8714721\/08715033.pdf?arnumber=8715033","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,6,3]],"date-time":"2019-06-03T23:50:23Z","timestamp":1559605823000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8715033\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,3]]},"references-count":27,"URL":"https:\/\/doi.org\/10.23919\/date.2019.8715033","relation":{},"subject":[],"published":{"date-parts":[[2019,3]]}}}