{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,3,24]],"date-time":"2025-03-24T05:59:55Z","timestamp":1742795995287,"version":"3.28.0"},"reference-count":31,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,3]]},"DOI":"10.23919\/date48585.2020.9116351","type":"proceedings-article","created":{"date-parts":[[2020,6,15]],"date-time":"2020-06-15T23:28:37Z","timestamp":1592263717000},"page":"406-411","source":"Crossref","is-referenced-by-count":3,"title":["Lightweight Thermal Monitoring in Optical Networks-on-Chip via Router Reuse"],"prefix":"10.23919","author":[{"given":"Mengquan","family":"Li","sequence":"first","affiliation":[]},{"given":"Jun","family":"Zhou","sequence":"additional","affiliation":[]},{"given":"Weichen","family":"Liu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref31","first-page":"206","article-title":"11.4 1650 ?m2 thermal-diffusivity sensors with inaccuracies down to ±0.75°C in 40nm CMOS","author":"s\u00f6nmez","year":"2016","journal-title":"ISSCC IEEE"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2598765"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2019.8714844"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/LPT.2013.2243427"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2016.2597870"},{"key":"ref13","doi-asserted-by":"crossref","DOI":"10.1145\/3362099","article-title":"Hardware-software collaborative thermal sensing in optical network-on-chip-based manycore systems","author":"li","year":"2019","journal-title":"ACM TECS"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2015.2494060"},{"key":"ref15","first-page":"om2h-2","article-title":"35-Gb\/s VCSELbased optical link using 32-nm SOI CMOS circuits","author":"proesel","year":"2013","journal-title":"Proc OSA OFC\/NFOEC"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/GROUP4.2006.1708205"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/LPT.2013.2285171"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1364\/OE.16.015915"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/LPT.2016.2518869"},{"key":"ref28","first-page":"314","article-title":"A thermal-diffusivity-based temperature sensor with an untrimmed inaccuracy of ±0.2°C (3?) from -55°C to 125°C","author":"van vroonhoven","year":"2010","journal-title":"ISSCC IEEE"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2740306"},{"year":"0","key":"ref27","article-title":"INTERCONNECT"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2012.6237013"},{"key":"ref6","doi-asserted-by":"crossref","first-page":"1120","DOI":"10.7873\/DATE.2015.0479","article-title":"Thermal Aware Design Method for VCSEL-Based On-Chip Optical Interconnect","author":"hui li","year":"2015","journal-title":"Design Automation Test in Europe Conference Exhibition (DATE)"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2035553"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2017.8203863"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1515\/nanoph-2013-0013"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2011.5749722"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/3287624.3287650"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/3060403.3060457"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-9335-9"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1364\/OE.19.020258"},{"key":"ref22","first-page":"1617","article-title":"Accurate temperature estimation using noisy thermal sensors for gaussian and non-gaussian cases","volume":"19","author":"zhang","year":"2010","journal-title":"IEEE TVLSI"},{"key":"ref21","first-page":"3","article-title":"A low-power fat tree-based optical network-on-chip for multiprocessor system-on-chip","author":"gu","year":"2009","journal-title":"DATE IEEE"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2009.19"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1364\/OFC.2013.OW4J.3"},{"year":"0","key":"ref26","article-title":"FDTD Solutions"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1364\/JOCN.9.000351"}],"event":{"name":"2020 Design, Automation & Test in Europe Conference & Exhibition (DATE)","start":{"date-parts":[[2020,3,9]]},"location":"Grenoble, France","end":{"date-parts":[[2020,3,13]]}},"container-title":["2020 Design, Automation & Test in Europe Conference & Exhibition (DATE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9112295\/9116186\/09116351.pdf?arnumber=9116351","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,10,28]],"date-time":"2022-10-28T19:38:56Z","timestamp":1666985936000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9116351\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,3]]},"references-count":31,"URL":"https:\/\/doi.org\/10.23919\/date48585.2020.9116351","relation":{},"subject":[],"published":{"date-parts":[[2020,3]]}}}