{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,23]],"date-time":"2025-05-23T04:05:28Z","timestamp":1747973128537,"version":"3.41.0"},"reference-count":19,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,3,31]],"date-time":"2025-03-31T00:00:00Z","timestamp":1743379200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,3,31]],"date-time":"2025-03-31T00:00:00Z","timestamp":1743379200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key R&D Program of China","doi-asserted-by":"publisher","award":["2020YFA0711900,2020YFA0711901"],"award-info":[{"award-number":["2020YFA0711900,2020YFA0711901"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62474050,62304052,62141407,92473207,62474051,92373207,62090025"],"award-info":[{"award-number":["62474050,62304052,62141407,92473207,62474051,92373207,62090025"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003347","name":"Fudan University","doi-asserted-by":"publisher","award":["SKLICS-Z202404"],"award-info":[{"award-number":["SKLICS-Z202404"]}],"id":[{"id":"10.13039\/501100003347","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,3,31]]},"DOI":"10.23919\/date64628.2025.10992711","type":"proceedings-article","created":{"date-parts":[[2025,5,21]],"date-time":"2025-05-21T17:36:35Z","timestamp":1747848995000},"page":"1-7","source":"Crossref","is-referenced-by-count":0,"title":["DAMIL-DCIM: A Digital CIM Layout Synthesis Framework with Dataflow-Aware Floorplan and MILP-Based Detailed Placement"],"prefix":"10.23919","author":[{"given":"Chuyu","family":"Wang","sequence":"first","affiliation":[{"name":"School of Microelectronics, Fudan University,State Key Laboratory of Integrated Chips and Systems,Shanghai,China"}]},{"given":"Ke","family":"Hu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Fudan University,State Key Laboratory of Integrated Chips and Systems,Shanghai,China"}]},{"given":"Fan","family":"Yang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Fudan University,State Key Laboratory of Integrated Chips and Systems,Shanghai,China"}]},{"given":"Keren","family":"Zhu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Fudan University,State Key Laboratory of Integrated Chips and Systems,Shanghai,China"}]},{"given":"Xuan","family":"Zeng","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Fudan University,State Key Laboratory of Integrated Chips and Systems,Shanghai,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3064189"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2980098"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/DAC56929.2023.10247976"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD51958.2021.9643494"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2018.8357061"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/3394885.3431625"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2000.896484"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2233862"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228498"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/2717764.2717775"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1049\/iet-cds.2016.0249"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2019.8702071"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD51958.2021.9643441"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18074.2021.9586294"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/3505170.3506723"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD57390.2023.10323742"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365766"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731754"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/DAC56929.2023.10248014"}],"event":{"name":"2025 Design, Automation & Test in Europe Conference (DATE)","start":{"date-parts":[[2025,3,31]]},"location":"Lyon, France","end":{"date-parts":[[2025,4,2]]}},"container-title":["2025 Design, Automation & Test in Europe Conference (DATE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10992638\/10992588\/10992711.pdf?arnumber=10992711","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,22]],"date-time":"2025-05-22T05:57:18Z","timestamp":1747893438000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10992711\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,3,31]]},"references-count":19,"URL":"https:\/\/doi.org\/10.23919\/date64628.2025.10992711","relation":{},"subject":[],"published":{"date-parts":[[2025,3,31]]}}}