{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,23]],"date-time":"2025-05-23T04:05:29Z","timestamp":1747973129637,"version":"3.41.0"},"reference-count":25,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,3,31]],"date-time":"2025-03-31T00:00:00Z","timestamp":1743379200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,3,31]],"date-time":"2025-03-31T00:00:00Z","timestamp":1743379200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,3,31]]},"DOI":"10.23919\/date64628.2025.10992721","type":"proceedings-article","created":{"date-parts":[[2025,5,21]],"date-time":"2025-05-21T17:36:35Z","timestamp":1747848995000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["Multi-Partner Project: Twinning for Excellence in Reliable Electronics (TWIN-RELECT)"],"prefix":"10.23919","author":[{"given":"Marko","family":"Andjelkovic","sequence":"first","affiliation":[{"name":"IHP - Leibniz-Institut für innovative Mikroelektronik,Frankfurt (Oder),Germany"}]},{"given":"Fabian","family":"Vargas","sequence":"additional","affiliation":[{"name":"IHP - Leibniz-Institut für innovative Mikroelektronik,Frankfurt (Oder),Germany"}]},{"given":"Milos","family":"Krstic","sequence":"additional","affiliation":[{"name":"IHP - Leibniz-Institut für innovative Mikroelektronik,Frankfurt (Oder),Germany"}]},{"given":"Luigi","family":"Dilillo","sequence":"additional","affiliation":[{"name":"CNRS - Centre National de la Recherche Scientifique,Montpellier,France"}]},{"given":"Alain","family":"Michez","sequence":"additional","affiliation":[{"name":"CNRS - Centre National de la Recherche Scientifique,Montpellier,France"}]},{"given":"Frederic","family":"Wrobel","sequence":"additional","affiliation":[{"name":"CNRS - Centre National de la Recherche Scientifique,Montpellier,France"}]},{"given":"Davide","family":"Bertozzi","sequence":"additional","affiliation":[{"name":"University of Manchester,Manchester,United Kingdom"}]},{"given":"Mikel","family":"Lujan","sequence":"additional","affiliation":[{"name":"University of Manchester,Manchester,United Kingdom"}]},{"given":"Christos","family":"Georgakidis","sequence":"additional","affiliation":[{"name":"University of Thessaly,Volos,Greece"}]},{"given":"Nikolaos","family":"Chatzivangelis","sequence":"additional","affiliation":[{"name":"University of Thessaly,Volos,Greece"}]},{"given":"Katerina","family":"Tsilingiri","sequence":"additional","affiliation":[{"name":"University of Thessaly,Volos,Greece"}]},{"given":"Nikolaos","family":"Zazatis","sequence":"additional","affiliation":[{"name":"University of Thessaly,Volos,Greece"}]},{"given":"Georgios Ioanis","family":"Paliaroutis","sequence":"additional","affiliation":[{"name":"University of Thessaly,Volos,Greece"}]},{"given":"Pelopidas","family":"Tsoumanis","sequence":"additional","affiliation":[{"name":"University of Thessaly,Volos,Greece"}]},{"given":"Christos","family":"Sotiriou","sequence":"additional","affiliation":[{"name":"University of Thessaly,Volos,Greece"}]}],"member":"263","reference":[{"journal-title":"European Chips Act.","key":"ref1"},{"journal-title":"High Reliability Semiconductor Market","key":"ref2"},{"volume-title":"Reliability Risk Arise as Chip Technology Advances","key":"ref3"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2013.2262002"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2014.7001394"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2019.06.033"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.23919\/DATE54114.2022.9774541"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICSICT55466.2022.9963318"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS50870.2020.9159750"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.micpro.2015.06.003"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2015.04.008"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2011.07.086"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2013.2289874"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3069664"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2906155"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.23919\/SISPAD.2017.8085281"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2021.3113884"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-019-05796-x"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.53106\/160792642023032402005"},{"journal-title":"Incisive Functional Safety Simulator (IFSS)","key":"ref20"},{"journal-title":"SoCFIT: SoC-level Soft Error Analysis Tool","key":"ref21"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/DFT59622.2023.10313533"},{"journal-title":"IHP Open Process Development Kit (PDK)","key":"ref23"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2015.2449281"},{"key":"ref25","article-title":"Modeling and Prediction of Single Event Transient and Single Event Upset","volume-title":"Presented at 18th International School on the Effects of Radiation on Embedded Systems for Space Applications (SERESSA)","author":"Wrobel","year":"2022"}],"event":{"name":"2025 Design, Automation & Test in Europe Conference (DATE)","start":{"date-parts":[[2025,3,31]]},"location":"Lyon, France","end":{"date-parts":[[2025,4,2]]}},"container-title":["2025 Design, Automation & Test in Europe Conference (DATE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10992638\/10992588\/10992721.pdf?arnumber=10992721","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,22]],"date-time":"2025-05-22T06:06:00Z","timestamp":1747893960000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10992721\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,3,31]]},"references-count":25,"URL":"https:\/\/doi.org\/10.23919\/date64628.2025.10992721","relation":{},"subject":[],"published":{"date-parts":[[2025,3,31]]}}}