{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T15:50:18Z","timestamp":1781884218484,"version":"3.54.5"},"reference-count":33,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,3,31]],"date-time":"2025-03-31T00:00:00Z","timestamp":1743379200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,3,31]],"date-time":"2025-03-31T00:00:00Z","timestamp":1743379200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000001","name":"U.S. National Science Foundation","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,3,31]]},"DOI":"10.23919\/date64628.2025.10992734","type":"proceedings-article","created":{"date-parts":[[2025,5,21]],"date-time":"2025-05-21T17:36:35Z","timestamp":1747848995000},"page":"1-7","source":"Crossref","is-referenced-by-count":1,"title":["Improving Chip Design Enablement for Universities in Europe \u2013 A Position Paper"],"prefix":"10.23919","author":[{"given":"Lukas","family":"Krupp","sequence":"first","affiliation":[{"name":"RPTU University of Kaiserslautern-Landau"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ian","family":"O'Connor","sequence":"additional","affiliation":[{"name":"École Centrale de Lyon"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Luca","family":"Benini","sequence":"additional","affiliation":[{"name":"ETH Zurich"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Christoph","family":"Studer","sequence":"additional","affiliation":[{"name":"ETH Zurich"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Joachim","family":"Rodrigues","sequence":"additional","affiliation":[{"name":"Lund University"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Norbert","family":"Wehn","sequence":"additional","affiliation":[{"name":"RPTU University of Kaiserslautern-Landau"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","article-title":"Commission Staff Working Document - Strategic dependencies and capacities","volume-title":"European Commission","year":"2021"},{"key":"ref2","article-title":"Strengthening the global semiconductor supply chain in an uncertain era","volume":"2021","author":"Varas","year":"2024","journal-title":"Semiconductor Industry Association (SIA)"},{"key":"ref3","article-title":"Von Chips zu Chancen - Die Bedeutung und Wirtschaftlichkeit der Mikroelektronikf\u00f6rderung","volume-title":"German Electro and Digital Industry Association (ZVEI)","author":"Schadt","year":"2024"},{"key":"ref4","article-title":"Europe\u2019s urgent need to invest in a leading-edge semiconductor ecosystem","volume-title":"A.T. Kearny","author":"Aurik","year":"2024"},{"key":"ref5","article-title":"Skills Strategy 2024 - Addressing the talent gap in the EU semiconductor ecosystem","volume-title":"European Chips Skills Academy","author":"Beaujeu","year":"2024"},{"key":"ref6","article-title":"Yearly Monitoring Report 2023","volume-title":"MicroElectronics Training Industry and Skills (METIS)","author":"Saint-Martin","year":"2023"},{"key":"ref7","article-title":"NSF Integrated Circuit Research, Education and Workforce Development Workshop Final Report","volume-title":"National Science Foundation","author":"Guthaus","year":"2023"},{"key":"ref8","article-title":"Activity Report 2023\u20132024","volume-title":"EUROPRACTICE","year":"2024"},{"key":"ref9","article-title":"The lack of semiconductor manufacturing in Europe - Why the 2nm fab is a bad investment","volume-title":"Stiftung Neue Verantwortung","author":"Kleinhans","year":"2021"},{"key":"ref10","article-title":"EUROPRACTICE","volume-title":"Membership List","year":"2024"},{"key":"ref11","article-title":"ETH Zurich","volume-title":"Neue Schweizer Chip-Initiative gestartet","year":"2024"},{"key":"ref12","article-title":"Chips-IT","volume-title":"Fondazione Chips-IT","year":"2025"},{"key":"ref13","article-title":"Chipdesign Germany","volume-title":"Chipdesign Germany - Das Netzwerk f\u00fcr Chipdesign in Deutschland","year":"2025"},{"key":"ref14","article-title":"PEPR Electronique","volume-title":"Programme et Equipment Prioritaires de Recherche en Electronique","year":"2025"},{"key":"ref15","article-title":"Chalmers University of Technology","volume-title":"ClassIC - creating a Swedish hub in semiconductor chip design","year":"2023"},{"key":"ref16","article-title":"European Commission","volume-title":"European Chips Act","year":"2023"},{"key":"ref17","article-title":"Recommendations and Roadmap for Open-Source EDA in Europe","volume-title":"The FOSSi Foundation","author":"Benini","year":"2024"},{"key":"ref18","article-title":"PULP Platform","volume-title":"PULP Platform - Open hardware, the way it should be!","year":"2025"},{"key":"ref19","article-title":"IEEE Solid-State Circuits Society","volume-title":"SSCS PICO Program","year":"2025"},{"key":"ref20","article-title":"VDE Association for Electrical, Electronic & Information Technologies","volume-title":"Invent a Chip","year":"2025"},{"key":"ref21","article-title":"ChipQuest Challenge","volume-title":"SEMI","year":"2025"},{"key":"ref22","article-title":"TinyTapeout","volume-title":"TinyTapeout","year":"2025"},{"key":"ref23","article-title":"VDE Association for Electrical, Electronic & Information Technologies","volume-title":"Fewer and fewer students are studying electrical engineering: A series of image studies identifies reasons and possible solutions","year":"2023"},{"key":"ref24","article-title":"GlobalFoundries GF180MCU Open Source PDK","volume-title":"Google","year":"2025"},{"key":"ref25","article-title":"SkyWater Open Source PDK","volume-title":"Google","year":"2025"},{"key":"ref26","article-title":"OpenROAD","volume-title":"OpenROAD","year":"2025"},{"key":"ref27","article-title":"Research, Entrepreneurship, Training, IP-exchange & Chip pLatform of EUROPRACTICE Services (RETICLES)","volume-title":"European Union","year":"2024"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2023.3276941"},{"key":"ref29","article-title":"FPGAWars - Exploring the open side of the FPGAs","volume-title":"FPGAWars","year":"2021"},{"key":"ref30","article-title":"U.S. National Science Foundation and Department of Commerce Solutions Offering for the Network Coordination Hub for the National Network for Microelectronics Education Program","volume-title":"U.S. General Services Administration","year":"2024"},{"key":"ref31","article-title":"Efabless Open MPW Program","volume-title":"Efabless","year":"2024"},{"key":"ref32","article-title":"Enabling Access to the Semiconductor Chip Ecosystem for Design, Fabrication, and Training","volume-title":"U.S. National Science Foundation","year":"2023"},{"key":"ref33","article-title":"IHP Open Source PDK","volume-title":"IHP GmbH","year":"2025"}],"event":{"name":"2025 Design, Automation & Test in Europe Conference (DATE)","location":"Lyon, France","start":{"date-parts":[[2025,3,31]]},"end":{"date-parts":[[2025,4,2]]}},"container-title":["2025 Design, Automation & Test in Europe Conference (DATE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10992638\/10992588\/10992734.pdf?arnumber=10992734","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,22]],"date-time":"2025-05-22T05:32:52Z","timestamp":1747891972000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10992734\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,3,31]]},"references-count":33,"URL":"https:\/\/doi.org\/10.23919\/date64628.2025.10992734","relation":{},"subject":[],"published":{"date-parts":[[2025,3,31]]}}}