{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,13]],"date-time":"2026-02-13T21:22:37Z","timestamp":1771017757759,"version":"3.50.1"},"reference-count":31,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,3,31]],"date-time":"2025-03-31T00:00:00Z","timestamp":1743379200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,3,31]],"date-time":"2025-03-31T00:00:00Z","timestamp":1743379200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62304133,62350610271"],"award-info":[{"award-number":["62304133,62350610271"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,3,31]]},"DOI":"10.23919\/date64628.2025.10992777","type":"proceedings-article","created":{"date-parts":[[2025,5,21]],"date-time":"2025-05-21T13:36:35Z","timestamp":1747834595000},"page":"1-7","source":"Crossref","is-referenced-by-count":0,"title":["SEDG: Stitch-Compatible End-to-End Layout Decomposition Based on Graph Neural Network"],"prefix":"10.23919","author":[{"given":"Yifan","family":"Guo","sequence":"first","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China"}]},{"given":"Jiawei","family":"Chen","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China"}]},{"given":"Yexin","family":"Li","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China"}]},{"given":"Yunxiang","family":"Zhang","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China"}]},{"given":"Qing","family":"Zhang","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China"}]},{"given":"Yuhang","family":"Zhang","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China"}]},{"given":"Yongfu","family":"Li","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-20385-0"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/3386263.3406937"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2022.02.010"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1007\/s11432-022-3755-y"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1088\/1674-4926\/45\/5\/052303"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/2744769.2747940"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/DAC56929.2023.10247883"},{"key":"ref8","first-page":"1","article-title":"Layout decomposition for quadruple patterning lithography and beyond","volume-title":"Proceedings of the Annual Design Automation Conference","author":"Yu"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/1514932.1514958"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.3042175"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI-SoC.2017.8203477"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2011.6105297"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-13075-0_29"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2681068"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2015.7059020"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488818"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2022.3140729"},{"key":"ref18","first-page":"601","article-title":"GREMA: graph reduction based efficient mask assignment for double patterning technology","volume-title":"IEEE\/ACM International Conference on Computer-Aided Design - Digest of Technical Papers","author":"Xu"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2013.6691114"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1145\/2897937.2898048"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/S0031-3203(01)00232-1"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TNNLS.2020.2978386"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-40245-7_10"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.physd.2019.132306"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.4249\/scholarpedia.1888"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.24963\/ijcai.2021\/595"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1145\/3535101"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.3389\/fgene.2021.690049"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1145\/2554797.2554831"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2006.100"},{"key":"ref31","article-title":"Pytorch: an imperative style, high-performance deep learning library","volume":"32","author":"Paszke","year":"2019","journal-title":"Advances in Neural Information Processing Systems"}],"event":{"name":"2025 Design, Automation &amp; Test in Europe Conference (DATE)","location":"Lyon, France","start":{"date-parts":[[2025,3,31]]},"end":{"date-parts":[[2025,4,2]]}},"container-title":["2025 Design, Automation &amp;amp; Test in Europe Conference (DATE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10992638\/10992588\/10992777.pdf?arnumber=10992777","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,2,13]],"date-time":"2026-02-13T20:46:26Z","timestamp":1771015586000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10992777\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,3,31]]},"references-count":31,"URL":"https:\/\/doi.org\/10.23919\/date64628.2025.10992777","relation":{},"subject":[],"published":{"date-parts":[[2025,3,31]]}}}