{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,15]],"date-time":"2026-01-15T22:45:07Z","timestamp":1768517107127,"version":"3.49.0"},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,3,31]],"date-time":"2025-03-31T00:00:00Z","timestamp":1743379200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,3,31]],"date-time":"2025-03-31T00:00:00Z","timestamp":1743379200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,3,31]]},"DOI":"10.23919\/date64628.2025.10992849","type":"proceedings-article","created":{"date-parts":[[2025,5,21]],"date-time":"2025-05-21T17:36:35Z","timestamp":1747848995000},"page":"1-7","source":"Crossref","is-referenced-by-count":4,"title":["SynDCIM: A Performance-Aware Digital Computing-in-Memory Compiler with Multi-Spec-Oriented Subcircuit Synthesis"],"prefix":"10.23919","author":[{"given":"Kunming","family":"Shao","sequence":"first","affiliation":[{"name":"The Hong Kong University of Science and Technology,Hong Kong SAR,China"}]},{"given":"Fengshi","family":"Tian","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology,Hong Kong SAR,China"}]},{"given":"Xiaomeng","family":"Wang","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology,Hong Kong SAR,China"}]},{"given":"Jiakun","family":"Zheng","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology,Hong Kong SAR,China"}]},{"given":"Jia","family":"Chen","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology,Hong Kong SAR,China"}]},{"given":"Jingyu","family":"He","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology,Hong Kong SAR,China"}]},{"given":"Hui","family":"Wu","sequence":"additional","affiliation":[{"name":"Westlake University,Hangzhou,China"}]},{"given":"Jinbo","family":"Chen","sequence":"additional","affiliation":[{"name":"Westlake University,Hangzhou,China"}]},{"given":"Xihao","family":"Guan","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology,Hong Kong SAR,China"}]},{"given":"Yi","family":"Deng","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology,Hong Kong SAR,China"}]},{"given":"Fengbin","family":"Tu","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology,Hong Kong SAR,China"}]},{"given":"Jie","family":"Yang","sequence":"additional","affiliation":[{"name":"Westlake University,Hangzhou,China"}]},{"given":"Mohamad","family":"Sawan","sequence":"additional","affiliation":[{"name":"Westlake University,Hangzhou,China"}]},{"given":"Tim Kwang-Ting","family":"Cheng","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology,Hong Kong SAR,China"}]},{"given":"Chi-Ying","family":"Tsui","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology,Hong Kong SAR,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365766"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731754"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067555"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454556"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/DAC56929.2023.10247976"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED58423.2023.10244608"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/3649329.3656229"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.23919\/DATE58400.2024.10546676"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2022.3222059"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC55480.2022.9911382"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/3676536.3676751"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/3489517.3530399"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD57390.2023.10323889"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2024.3355944"}],"event":{"name":"2025 Design, Automation & Test in Europe Conference (DATE)","location":"Lyon, France","start":{"date-parts":[[2025,3,31]]},"end":{"date-parts":[[2025,4,2]]}},"container-title":["2025 Design, Automation & Test in Europe Conference (DATE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10992638\/10992588\/10992849.pdf?arnumber=10992849","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,22]],"date-time":"2025-05-22T05:53:40Z","timestamp":1747893220000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10992849\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,3,31]]},"references-count":14,"URL":"https:\/\/doi.org\/10.23919\/date64628.2025.10992849","relation":{},"subject":[],"published":{"date-parts":[[2025,3,31]]}}}