{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T06:01:03Z","timestamp":1780639263799,"version":"3.54.1"},"reference-count":33,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,4,20]],"date-time":"2026-04-20T00:00:00Z","timestamp":1776643200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,4,20]],"date-time":"2026-04-20T00:00:00Z","timestamp":1776643200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100018693","name":"Horizon Europe","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100018693","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,4,20]]},"DOI":"10.23919\/date69613.2026.11539078","type":"proceedings-article","created":{"date-parts":[[2026,6,4]],"date-time":"2026-06-04T19:53:10Z","timestamp":1780602790000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["Multi-Partner Project: COIN-3D \u2013 Collaborative Innovation in 3D VLSI Reliability"],"prefix":"10.23919","author":[{"given":"George Rafael","family":"Gourdoumanis","sequence":"first","affiliation":[{"name":"University of Thessaly,Department of Electrical and Computer Engineering,Greece"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Fotoini","family":"Oikonomou","sequence":"additional","affiliation":[{"name":"University of Thessaly,Department of Electrical and Computer Engineering,Greece"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Maria","family":"Pantazi-Kypraiou","sequence":"additional","affiliation":[{"name":"University of Thessaly,Department of Electrical and Computer Engineering,Greece"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Pavlos","family":"Stoikos","sequence":"additional","affiliation":[{"name":"University of Thessaly,Department of Electrical and Computer Engineering,Greece"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Olympia","family":"Axelou","sequence":"additional","affiliation":[{"name":"University of Thessaly,Department of Electrical and Computer Engineering,Greece"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Athanasios","family":"Tziouvaras","sequence":"additional","affiliation":[{"name":"University of Thessaly,Department of Electrical and Computer Engineering,Greece"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Georgios","family":"Karakonstantis","sequence":"additional","affiliation":[{"name":"University of Thessaly,Department of Electrical and Computer Engineering,Greece"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tahani","family":"Aladwani","sequence":"additional","affiliation":[{"name":"University of Glasgow,School of Computing Science,UK"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Christos","family":"Anagnostopoulos","sequence":"additional","affiliation":[{"name":"University of Glasgow,School of Computing Science,UK"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yixian","family":"Shen","sequence":"additional","affiliation":[{"name":"University of Amsterdam,The Netherlands"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Anuj","family":"Pathania","sequence":"additional","affiliation":[{"name":"University of Amsterdam,The Netherlands"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Alberto","family":"Garcia-Ortiz","sequence":"additional","affiliation":[{"name":"University of Bremen,Institute of Electrodynamics and Microelectronics,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"George","family":"Floros","sequence":"additional","affiliation":[{"name":"University of Thessaly,Department of Electrical and Computer Engineering,Greece"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD66269.2025.11240655"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/2717764.2717779"},{"key":"ref3","doi-asserted-by":"crossref","DOI":"10.1145\/3400302.3415767","article-title":"Intelligent design automation for 2.5\/3D heterogeneous SoC integration","volume-title":"Proceedings of the 39th International Conference on Computer-Aided Design","author":"Jiang"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2967013"},{"key":"ref5","first-page":"1","article-title":"Regulation (eu) 2023\/1781 of the european parliament and of the council of 13 september 2023 establishing a framework of measures for strengthening europe\u2019s semiconductor ecosystem and amending regulation (eu) 2021\/694 (chips act)","volume-title":"Official Journal of the European Union, L 229, 18 September 2023","year":"2023"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MDAT.2016.2544837"},{"key":"ref7","article-title":"Seamless monolithic three-dimensional integration of single-crystalline films by growth","author":"Kim","year":"2023"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.3390\/electronics11193013"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2002.1008295"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1088\/0957-4484\/22\/25\/254006"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2010.2062811"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2011.2174640"},{"key":"ref13","article-title":"Open3DBench: Open-source benchmark for 3D-IC backend implementation and PPA evaluation","author":"Shi","year":"2025"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2023.3342753"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/3698364.3709127"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ICDCSW63273.2025.00091"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2004.1310781"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/3532185"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5653749"},{"key":"ref20","first-page":"469","article-title":"Mcpat: An integrated power, area, and timing modeling framework for multicore and manycore architectures","volume-title":"2009 42nd Annual IEEE\/ACM International Symposium on Microarchitecture (MICRO)","author":"Li"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1145\/2629677"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1145\/2024716.2024718"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/SMACD58065.2023.10192229"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD65941.2025.00031"},{"key":"ref25","doi-asserted-by":"crossref","DOI":"10.1145\/3316781.3326334","article-title":"Toward an open-source digital flow: First learnings from the openroad project","volume-title":"Proceedings of the 56th Annual Design Automation Conference 2019","author":"Ajayi"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2017.2746660"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1145\/2451916.2451925"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1063\/1.354073"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/ICDCSW63273.2025.00094"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/MOCAST65744.2025.11083905"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1145\/2939672.2939785"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/ICDCSW63273.2025.00089"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/LES.2018.2866594"}],"event":{"name":"2026 Design, Automation & Test in Europe Conference (DATE)","location":"Verona, Italy","start":{"date-parts":[[2026,4,20]]},"end":{"date-parts":[[2026,4,22]]}},"container-title":["2026 Design, Automation & Test in Europe Conference (DATE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11539023\/11539024\/11539078.pdf?arnumber=11539078","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T05:10:14Z","timestamp":1780636214000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11539078\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,4,20]]},"references-count":33,"URL":"https:\/\/doi.org\/10.23919\/date69613.2026.11539078","relation":{},"subject":[],"published":{"date-parts":[[2026,4,20]]}}}