{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T06:00:29Z","timestamp":1780639229416,"version":"3.54.1"},"reference-count":43,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,4,20]],"date-time":"2026-04-20T00:00:00Z","timestamp":1776643200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,4,20]],"date-time":"2026-04-20T00:00:00Z","timestamp":1776643200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100018693","name":"Horizon Europe","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100018693","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100006470","name":"Aristotle University of Thessaloniki","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100006470","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,4,20]]},"DOI":"10.23919\/date69613.2026.11539293","type":"proceedings-article","created":{"date-parts":[[2026,6,4]],"date-time":"2026-06-04T19:53:10Z","timestamp":1780602790000},"page":"1-7","source":"Crossref","is-referenced-by-count":0,"title":["Sensor Placement and Transformer-Based Thermal Map Generation for Reusable Interposers"],"prefix":"10.23919","author":[{"given":"Aristotelis","family":"Tsekouras","sequence":"first","affiliation":[{"name":"Aristotle University of Thessaloniki,Greece"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Theodoros","family":"Papavasileiou","sequence":"additional","affiliation":[{"name":"Aristotle University of Thessaloniki,Greece"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Panagiotis C.","family":"Petrantonakis","sequence":"additional","affiliation":[{"name":"Aristotle University of Thessaloniki,Greece"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Georgios","family":"Keramidas","sequence":"additional","affiliation":[{"name":"Aristotle University of Thessaloniki,Greece"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Vasilis F.","family":"Pavlidis","sequence":"additional","affiliation":[{"name":"Aristotle University of Thessaloniki,Greece"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/2830772.2830808"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2021.3111386"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI-TSA51926.2021.9440082"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC56328.2022.10013234"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1038\/s41377-021-00549-y"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2017.8203849"},{"key":"ref7","first-page":"1","article-title":"Gia: a reusable general interposer architecture for agile chiplet integration","volume-title":"IEEE\/ACM International Conference On Computer Aided Design","author":"Li"},{"key":"ref8","first-page":"1","article-title":"Resipi: a reconfigurable silicon-photonic 2.5d chiplet network with pcms for energy-efficient interposer communication","volume-title":"IEEE\/ACM International Conference On Computer Aided Design","author":"Taheri"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/EuroSimE48426.2020.9152630"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2022.3203430"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.23919\/DATE51398.2021.9474011"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.3390\/electronics12071604"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2024.123612"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/2024716.2024718"},{"key":"ref15","first-page":"469","article-title":"McPAT: An Integrated Power, Area, and Timing Modeling Framework for Multicore and Manycore Architectures","volume-title":"Proceedings of the Annual IEEE\/ACM International Symposium on Microarchitecture","author":"Li"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2008.915538"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/1837274.1837291"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2015.2395423"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI-DAT.2017.7939679"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2022.3143476"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/MSP.2007.914731"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS48785.2022.9937996"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS58744.2024.10558360"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2020.3012833"},{"key":"ref26","first-page":"1","article-title":"Full-chip thermal map estimation for commercial multi-core cpus with generative adversarial learning","volume-title":"IEEE\/ACM International Conference On Computer Aided Design","author":"Jin"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC52403.2022.9712583"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2021.3086112"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD57390.2023.10323817"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ICTA60488.2023.10363782"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/ISPASS.2018.00028"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2710042"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1016\/j.nlp.2023.100048"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1016\/j.cosrev.2025.100768"},{"key":"ref35","article-title":"A time series is worth 64 words: long-term forecasting with transformers","author":"Nie","year":"2022"},{"key":"ref36","article-title":"Attention is all you need","author":"Vaswani","year":"2017","journal-title":"Neural Information Processing Systems"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1007\/s00521-022-07366-3"},{"key":"ref38","article-title":"8-bit numerical formats for deep neural networks","author":"Noune","year":"2022"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1145\/3292500.3330701"},{"key":"ref40","article-title":"Tree-structured parzen estimator: understanding its algorithm components and their roles for better empirical performance","author":"Watanabe","year":"2023"},{"key":"ref41","article-title":"Deep learning tuning playbook","author":"Godbole","year":"2023"},{"key":"ref42","article-title":"Adam: a method for stochastic optimization","author":"Kingma","year":"2014","journal-title":"CoRR"},{"key":"ref43","article-title":"Pytorch: an imperative style, high-performance deep learning library","author":"Paszke","year":"2019"}],"event":{"name":"2026 Design, Automation & Test in Europe Conference (DATE)","location":"Verona, Italy","start":{"date-parts":[[2026,4,20]]},"end":{"date-parts":[[2026,4,22]]}},"container-title":["2026 Design, Automation & Test in Europe Conference (DATE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11539023\/11539024\/11539293.pdf?arnumber=11539293","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T05:07:15Z","timestamp":1780636035000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11539293\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,4,20]]},"references-count":43,"URL":"https:\/\/doi.org\/10.23919\/date69613.2026.11539293","relation":{},"subject":[],"published":{"date-parts":[[2026,4,20]]}}}