{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T06:01:27Z","timestamp":1780639287855,"version":"3.54.1"},"reference-count":24,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,4,20]],"date-time":"2026-04-20T00:00:00Z","timestamp":1776643200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,4,20]],"date-time":"2026-04-20T00:00:00Z","timestamp":1776643200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,4,20]]},"DOI":"10.23919\/date69613.2026.11539319","type":"proceedings-article","created":{"date-parts":[[2026,6,4]],"date-time":"2026-06-04T19:53:10Z","timestamp":1780602790000},"page":"1-7","source":"Crossref","is-referenced-by-count":0,"title":["3D Integration of Hybrid IGZO\/Si and IGZO eDRAMs for High-Density\/High-Performance On-Chip Memory"],"prefix":"10.23919","author":[{"given":"Munhyeon","family":"Kim","sequence":"first","affiliation":[{"name":"Seoul National University of Science and Technology,Department of Electrical and Information Engineering"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sukhyun","family":"Choi","sequence":"additional","affiliation":[{"name":"Seoul National University,Department of Electrical and Computer Engineering"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yulhwa","family":"Kim","sequence":"additional","affiliation":[{"name":"Sungkyunkwan University,Department of Semiconductor Systems Engineering"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jae-Joon","family":"Kim","sequence":"additional","affiliation":[{"name":"Seoul National University,Department of Electrical and Computer Engineering"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/3079856.3080246"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA52012.2021.00010"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063111"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/HCS55958.2022.9895479"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2014.58"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/3007787.3001140"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870334"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2168729"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2128150"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993506"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19574.2021.9720596"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830271"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM45741.2023.10413790"},{"key":"ref14","doi-asserted-by":"crossref","DOI":"10.1145\/3649329.3655965","article-title":"4-transistor ternary content addressable memory cell design using stacked hybrid igzo\/si transistors","volume-title":"Proceedings of the 61st ACM\/IEEE Design Automation Conference, DAC \u201924","author":"Kim"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46783.2024.10631344"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.892185"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2939682"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2023.3326798"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/2366231.2337164"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISPASS48437.2020.00016"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2018.00286"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2016.90"},{"key":"ref23","article-title":"An image is worth 16x16 words: Transformers for image recognition at scale","volume-title":"International Conference on Learning Representations","author":"Dosovitskiy"},{"key":"ref24","first-page":"4171","article-title":"BERT: Pretraining of deep bidirectional transformers for language understanding","volume-title":"Proceedings of the 2019 Conference of the North American Chapter of the Association for Computational Linguistics: Human Language Technologies, Volume 1 (Long and Short Papers)","author":"Devlin"}],"event":{"name":"2026 Design, Automation & Test in Europe Conference (DATE)","location":"Verona, Italy","start":{"date-parts":[[2026,4,20]]},"end":{"date-parts":[[2026,4,22]]}},"container-title":["2026 Design, Automation & Test in Europe Conference (DATE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11539023\/11539024\/11539319.pdf?arnumber=11539319","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T05:12:03Z","timestamp":1780636323000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11539319\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,4,20]]},"references-count":24,"URL":"https:\/\/doi.org\/10.23919\/date69613.2026.11539319","relation":{},"subject":[],"published":{"date-parts":[[2026,4,20]]}}}