{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,25]],"date-time":"2026-06-25T20:05:48Z","timestamp":1782417948742,"version":"3.54.5"},"reference-count":33,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,4,20]],"date-time":"2026-04-20T00:00:00Z","timestamp":1776643200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,4,20]],"date-time":"2026-04-20T00:00:00Z","timestamp":1776643200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100004725","name":"Ministry of Economic Affairs","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100004725","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,4,20]]},"DOI":"10.23919\/date69613.2026.11539406","type":"proceedings-article","created":{"date-parts":[[2026,6,4]],"date-time":"2026-06-04T19:53:10Z","timestamp":1780602790000},"page":"1-7","source":"Crossref","is-referenced-by-count":0,"title":["Multi-Partner Project: Advancing European Semiconductor and Chiplet Innovation Through the Bavarian Chip Design Center"],"prefix":"10.23919","author":[{"given":"Hussam","family":"Amrouch","sequence":"first","affiliation":[{"name":"Technical University of Munich,Chairs of AI Processor Design,Munich,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jehaan","family":"Joseph","sequence":"additional","affiliation":[{"name":"Technical University of Munich,Chairs of AI Processor Design,Munich,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Michael","family":"Schirmer","sequence":"additional","affiliation":[{"name":"Technical University of Munich,Chairs of Electronic Design Automation,Munich,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Johannes","family":"Geier","sequence":"additional","affiliation":[{"name":"Technical University of Munich,Chairs of Electronic Design Automation,Munich,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ulf","family":"Schlichtmann","sequence":"additional","affiliation":[{"name":"Technical University of Munich,Chairs of Electronic Design Automation,Munich,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Michael","family":"Meidinger","sequence":"additional","affiliation":[{"name":"Technical University of Munich,Chairs of Integrated Systems,Munich,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Thomas","family":"Wild","sequence":"additional","affiliation":[{"name":"Technical University of Munich,Chairs of Integrated Systems,Munich,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Andreas","family":"Herkersdorf","sequence":"additional","affiliation":[{"name":"Technical University of Munich,Chairs of Integrated Systems,Munich,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jens","family":"N\u00f6pel","sequence":"additional","affiliation":[{"name":"Technical University of Munich,Chairs of Security in Information Technology,Munich,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Georg","family":"Sigl","sequence":"additional","affiliation":[{"name":"Technical University of Munich,Chairs of Security in Information Technology,Munich,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yicheng","family":"Zhang","sequence":"additional","affiliation":[{"name":"Technical University of Munich,Chairs of Computer Architecture and Operating Systems,Munich,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Carsten","family":"Trinitis","sequence":"additional","affiliation":[{"name":"Technical University of Munich,Chairs of Computer Architecture and Operating Systems,Munich,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Aswathy Nedumpalli","family":"Sankaranarayanan","sequence":"additional","affiliation":[{"name":"Technical University of Munich,Chairs of Computer Architecture and Parallel Systems,Munich,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Martin","family":"Schulz","sequence":"additional","affiliation":[{"name":"Technical University of Munich,Chairs of Computer Architecture and Parallel Systems,Munich,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Andreas","family":"Korb","sequence":"additional","affiliation":[{"name":"Fraunhofer Institute for Applied and Integrated Security (AISEC),Garching,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Konrad","family":"Hohentanner","sequence":"additional","affiliation":[{"name":"Fraunhofer Institute for Applied and Integrated Security (AISEC),Garching,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","volume-title":"Press release: Bavaria sets the course for the future of microelectronics","year":"2025"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2926114"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/3079856.3080246"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IPDPSW.2018.00091"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18074.2021.9586216"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2019.2928962"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.3390\/electronics13081500"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO56248.2022.00046"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/3613424.3614283"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2025.3561145"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/3676641.3716013"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2021.3121346"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/LCA.2025.3554777"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/3466752.3480048"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.5555\/3291168.3291211"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2025.3556967"},{"key":"ref17","article-title":"Iree documentation and developer guides","year":"2024"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/CGO51591.2021.9370308"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/CGO.2004.1281665"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2022.3178068"},{"key":"ref21","article-title":"Introducing the coral npu: A full-stack platform for edge ai","year":"2025"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/DAC56929.2023.10247873"},{"key":"ref23","first-page":"33","article-title":"An mlir-based compilation framework for cgra application deployment","volume-title":"Applied Reconfigurable Computing. Architectures, Tools, and Applications: 21st International Symposium, ARC 2025, Seville, Spain, April 9\u201311, 2025, Proceedings","volume":"15594","author":"Atienza"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/3658617.3697563"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1145\/3352460.3358302"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2025.3529249"},{"key":"ref27","article-title":"The pulp platform: Open risc-v multi-chip research","year":"2023"},{"key":"ref28","year":"2025","journal-title":"Universal Chiplet Interconnect Express (UCIe) Specification"},{"key":"ref29","article-title":"Pulp platform: Serial link","year":"2025"},{"key":"ref30","doi-asserted-by":"crossref","DOI":"10.1109\/ITC51657.2024.00022","article-title":"Evaluating vulnerability of chiplet-based systems to contactless probing techniques","author":"Deric","year":"2024"},{"key":"ref31","article-title":"Mobilenets: Efficient convo-lutional neural networks for mobile vision applications","author":"Howard","year":"2017"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-46448-0_2"},{"key":"ref33","article-title":"cva6-sdk"}],"event":{"name":"2026 Design, Automation & Test in Europe Conference (DATE)","location":"Verona, Italy","start":{"date-parts":[[2026,4,20]]},"end":{"date-parts":[[2026,4,22]]}},"container-title":["2026 Design, Automation & Test in Europe Conference (DATE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11539023\/11539024\/11539406.pdf?arnumber=11539406","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,25]],"date-time":"2026-06-25T19:42:39Z","timestamp":1782416559000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11539406\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,4,20]]},"references-count":33,"URL":"https:\/\/doi.org\/10.23919\/date69613.2026.11539406","relation":{},"subject":[],"published":{"date-parts":[[2026,4,20]]}}}