{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T06:01:52Z","timestamp":1780639312258,"version":"3.54.1"},"reference-count":25,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,4,20]],"date-time":"2026-04-20T00:00:00Z","timestamp":1776643200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,4,20]],"date-time":"2026-04-20T00:00:00Z","timestamp":1776643200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,4,20]]},"DOI":"10.23919\/date69613.2026.11539746","type":"proceedings-article","created":{"date-parts":[[2026,6,4]],"date-time":"2026-06-04T19:53:10Z","timestamp":1780602790000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["Focus Session: Advanced CMOS and 5.5D Packaging: Perspectives and Challenges for Design, Reliability and Security"],"prefix":"10.23919","author":[{"given":"Hussam","family":"Amrouch","sequence":"first","affiliation":[{"name":"Technical University of Munich,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dragomir","family":"Milojevic","sequence":"additional","affiliation":[{"name":"Université Libre de Bruxelles, and IMEC"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Giorgio","family":"Di Natale","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CNRS, Grenoble INP, TIMA,Grenoble,38000"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"J\u00e9r\u00f4me","family":"Toublanc","sequence":"additional","affiliation":[{"name":"Synopsys"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454441"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51529.2024.00058"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51529.2024.00171"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.23919\/VLSITechnologyandCir57934.2023.10185227"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1038\/s44287-023-00016-3"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/iccad66269.2025.11240655"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS.2019.8854405"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2019.2893017"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3289325"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC47756.2020.9045204"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2015.7273538"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2014.343"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/2897937.2898082"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2025.3591727"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/IITC51362.2021.9537541"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JXCDC.2024.3496118"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2024.3467148"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-011-5269-9"},{"key":"ref19","article-title":"Challenges and solutions for building systems of chiplets","year":"2023"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.engappai.2024.109876"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ETS61313.2024.10567195"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2024.3368152"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/host64725.2025.11050057"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/3748258"},{"issue":"15","key":"ref25","article-title":"Chipletquake: On-die digital impedance sensing for chiplet and interposer verification","volume-title":"Sensors","volume":"25","author":"Monfared","year":"2025"}],"event":{"name":"2026 Design, Automation & Test in Europe Conference (DATE)","location":"Verona, Italy","start":{"date-parts":[[2026,4,20]]},"end":{"date-parts":[[2026,4,22]]}},"container-title":["2026 Design, Automation & Test in Europe Conference (DATE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11539023\/11539024\/11539746.pdf?arnumber=11539746","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T05:14:06Z","timestamp":1780636446000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11539746\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,4,20]]},"references-count":25,"URL":"https:\/\/doi.org\/10.23919\/date69613.2026.11539746","relation":{},"subject":[],"published":{"date-parts":[[2026,4,20]]}}}