{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,3]],"date-time":"2025-12-03T17:50:36Z","timestamp":1764784236349,"version":"3.28.0"},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,1]]},"DOI":"10.23919\/elinfocom.2019.8706385","type":"proceedings-article","created":{"date-parts":[[2019,5,20]],"date-time":"2019-05-20T22:44:21Z","timestamp":1558392261000},"page":"1-5","source":"Crossref","is-referenced-by-count":7,"title":["Analysis of Crosstalk Noise for Coupled Microstrip Interconnect Models in High-Speed PCB Design"],"prefix":"10.23919","author":[{"given":"Raju","family":"Mudavath","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"B. Rajendra","family":"Naik","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bhaskar","family":"Gugulothu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2002.994900"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/EDL.1982.25610"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1049\/el:19960689"},{"journal-title":"PCB currents how they flow how they react","year":"2013","author":"brooks","key":"ref13"},{"journal-title":"High-Speed Digital System Design","year":"0","author":"hall","key":"ref14"},{"key":"ref15","article-title":"Empirical Equations on Electrical Parameters of Coupled Microstrip Lines for Crosstalk Estimation in Printed Circuit Board","volume":"24","author":"sohn","year":"2001","journal-title":"IEEE Tran on Advanced Packaging"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2054119"},{"key":"ref17","doi-asserted-by":"crossref","first-page":"108","DOI":"10.1109\/66.827350","article-title":"modeling of interconnect capacitance, delay, and crosstalk in vlsi","volume":"13","author":"wong","year":"2000","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"key":"ref4","article-title":"Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress","volume":"55","author":"wu","year":"2013","journal-title":"IEEE Transactions on Electromagnetic Compatibility"},{"journal-title":"Analysis of Multiconductor Transmission Lines","year":"2008","author":"paul","key":"ref3"},{"key":"ref6","doi-asserted-by":"crossref","first-page":"693","DOI":"10.1109\/5.929650","article-title":"Simulation of high-speed interconnects","volume":"89","author":"nakhla","year":"2001","journal-title":"Proc IEEE"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2014.2326798"},{"journal-title":"Signal and Power Integrity-Simplified","year":"0","author":"bogatin","key":"ref8"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2018.00344"},{"journal-title":"Analysis of Multiconductor Transmission Lines","year":"2008","author":"paul","key":"ref2"},{"key":"ref1","article-title":"Impact of cross talk on signal integrity of high speed density ceramic package for IC","author":"zhang","year":"2016","journal-title":"IEEE Electronic Packaging Technology Conference"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1002\/9780470423899"}],"event":{"name":"2019 International Conference on Electronics, Information, and Communication (ICEIC)","start":{"date-parts":[[2019,1,22]]},"location":"Auckland, New Zealand","end":{"date-parts":[[2019,1,25]]}},"container-title":["2019 International Conference on Electronics, Information, and Communication (ICEIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8698536\/8706336\/08706385.pdf?arnumber=8706385","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,8,24]],"date-time":"2020-08-24T05:09:33Z","timestamp":1598245773000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8706385\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,1]]},"references-count":17,"URL":"https:\/\/doi.org\/10.23919\/elinfocom.2019.8706385","relation":{},"subject":[],"published":{"date-parts":[[2019,1]]}}}