{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T23:05:45Z","timestamp":1725491145495},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,5]]},"DOI":"10.23919\/mipro.2019.8757123","type":"proceedings-article","created":{"date-parts":[[2019,7,12]],"date-time":"2019-07-12T00:17:40Z","timestamp":1562890660000},"page":"13-18","source":"Crossref","is-referenced-by-count":0,"title":["Electrical Characterization of pure Boron-on-Germanium pin Diodes"],"prefix":"10.23919","author":[{"given":"L.","family":"Gebert","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"D.","family":"Schwarz","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.","family":"Elsayed","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J.","family":"Schulze","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.apsusc.2003.08.022"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1063\/1.2410241"},{"journal-title":"Physics of Semiconductor Devices","year":"2007","author":"sze","key":"ref6"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-18865-7"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1063\/1.4898583"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcrysgro.2006.02.019"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.apsusc.2003.08.022"},{"key":"ref2","article-title":"Characterisation of thin Boron layers grown on Silicon utilizing Molecular Beam Epitaxy for ultra-shallow pn-junctions","author":"elsayed","year":"0","journal-title":"2018 41st International Convention on Information and Communication Technology Electronics and Microelectronics (MIPRO)"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1063\/1.4932665"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ESSDERC.2008.4681752"}],"event":{"name":"2019 42nd International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","start":{"date-parts":[[2019,5,20]]},"location":"Opatija, Croatia","end":{"date-parts":[[2019,5,24]]}},"container-title":["2019 42nd International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8747288\/8756637\/08757123.pdf?arnumber=8757123","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,9,4]],"date-time":"2020-09-04T21:49:51Z","timestamp":1599256191000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8757123\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,5]]},"references-count":10,"URL":"https:\/\/doi.org\/10.23919\/mipro.2019.8757123","relation":{},"subject":[],"published":{"date-parts":[[2019,5]]}}}