{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,26]],"date-time":"2025-08-26T06:30:38Z","timestamp":1756189838170},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,6,29]],"date-time":"2023-06-29T00:00:00Z","timestamp":1687996800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,6,29]],"date-time":"2023-06-29T00:00:00Z","timestamp":1687996800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,6,29]]},"DOI":"10.23919\/mixdes58562.2023.10203129","type":"proceedings-article","created":{"date-parts":[[2023,8,9]],"date-time":"2023-08-09T13:23:39Z","timestamp":1691587419000},"page":"160-163","source":"Crossref","is-referenced-by-count":1,"title":["Preliminary Characterization of An Electro-Thermal Converter"],"prefix":"10.23919","author":[{"given":"Marcin","family":"Janicki","sequence":"first","affiliation":[{"name":"Łódź University of Technology,Department of Microelectronics and Computer Science,Łódź,Poland"}]},{"given":"Mariusz","family":"Jankowski","sequence":"additional","affiliation":[{"name":"Łódź University of Technology,Department of Microelectronics and Computer Science,Łódź,Poland"}]},{"given":"Michal","family":"Szermer","sequence":"additional","affiliation":[{"name":"Łódź University of Technology,Department of Microelectronics and Computer Science,Łódź,Poland"}]}],"member":"263","reference":[{"key":"ref4","first-page":"73","article-title":"Simple model for thermal spreading impedance","author":"veijola","year":"1996","journal-title":"Baltic Electronic Conference (BEC)"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1002\/pssa.2210750223"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2646798"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ICSENS.2007.4388637"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2011.6055368"}],"event":{"name":"2023 30th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","start":{"date-parts":[[2023,6,29]]},"location":"Krak\u00f3w, Poland","end":{"date-parts":[[2023,6,30]]}},"container-title":["2023 30th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10203036\/10203110\/10203129.pdf?arnumber=10203129","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,8,28]],"date-time":"2023-08-28T13:44:16Z","timestamp":1693230256000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10203129\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,6,29]]},"references-count":5,"URL":"https:\/\/doi.org\/10.23919\/mixdes58562.2023.10203129","relation":{},"subject":[],"published":{"date-parts":[[2023,6,29]]}}}