{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,30]],"date-time":"2025-12-30T09:00:38Z","timestamp":1767085238911},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,6,27]],"date-time":"2024-06-27T00:00:00Z","timestamp":1719446400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,6,27]],"date-time":"2024-06-27T00:00:00Z","timestamp":1719446400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,6,27]]},"DOI":"10.23919\/mixdes62605.2024.10614020","type":"proceedings-article","created":{"date-parts":[[2024,8,2]],"date-time":"2024-08-02T17:20:23Z","timestamp":1722619223000},"page":"11-14","source":"Crossref","is-referenced-by-count":3,"title":["Advanced Silicon Technologies: Design Consequences of Scaling Solutions for Devices"],"prefix":"10.23919","author":[{"given":"Tomasz","family":"Brozek","sequence":"first","affiliation":[{"name":"PDF Solutions, Inc.,Santa Clara,CA,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM45625.2022.10019538"},{"key":"ref2","first-page":"2","article-title":"Semiconductor Scaling for the Next Decade Enabled by Holistic Lithography","volume-title":"Proc IEEE Elec. Dev. Tech. Manuf. Conf. (EDTM), Seoul","author":"Lercel","year":"2023"},{"key":"ref3","article-title":"75 Years of the Transistor","author":"Arokia","year":"2023","journal-title":"Wiley\/IEEE Press"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICICDT.2015.7165898"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365988"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2018.8357060"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/EDTM.2019.8731138"},{"key":"ref8","article-title":"Samsung Foundry Process Technology","author":"Ku","year":"2024","journal-title":"2024 Samsung Foundry Forum"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1117\/12.3022874"}],"event":{"name":"2024 31st International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","start":{"date-parts":[[2024,6,27]]},"location":"Gdansk, Poland","end":{"date-parts":[[2024,6,28]]}},"container-title":["2024 31st International Conference on Mixed Design of Integrated Circuits and System (MIXDES)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10613861\/10613931\/10614020.pdf?arnumber=10614020","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,8,3]],"date-time":"2024-08-03T05:31:34Z","timestamp":1722663094000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10614020\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,6,27]]},"references-count":9,"URL":"https:\/\/doi.org\/10.23919\/mixdes62605.2024.10614020","relation":{},"subject":[],"published":{"date-parts":[[2024,6,27]]}}}