{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,31]],"date-time":"2024-10-31T03:17:19Z","timestamp":1730344639359,"version":"3.28.0"},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,3,1]],"date-time":"2023-03-01T00:00:00Z","timestamp":1677628800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,3,1]],"date-time":"2023-03-01T00:00:00Z","timestamp":1677628800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,3]]},"DOI":"10.23919\/ofc49934.2023.10116222","type":"proceedings-article","created":{"date-parts":[[2023,5,19]],"date-time":"2023-05-19T17:26:19Z","timestamp":1684517179000},"page":"1-3","source":"Crossref","is-referenced-by-count":0,"title":["3.2Tb\/s Heterogeneous Photonic Integrated Circuit Chip in a Co-Packaged Optics Configuration"],"prefix":"10.23919","author":[{"given":"Damien","family":"Lambert","sequence":"first","affiliation":[{"name":"Skorpios Technologies Inc,Austin,TX,78741"}]},{"given":"Jeff","family":"Rahn","sequence":"additional","affiliation":[{"name":"Meta Platforms, Inc,Menlo Park,CA,94025"}]},{"given":"Majid","family":"Sodagar","sequence":"additional","affiliation":[{"name":"Skorpios Technologies Inc,Austin,TX,78741"}]},{"given":"Murtaza","family":"Askari","sequence":"additional","affiliation":[{"name":"Skorpios Technologies Inc,Austin,TX,78741"}]},{"given":"Paveen","family":"Apiratikul","sequence":"additional","affiliation":[{"name":"Skorpios Technologies Inc,Austin,TX,78741"}]},{"given":"John","family":"Spann","sequence":"additional","affiliation":[{"name":"Skorpios Technologies Inc,Austin,TX,78741"}]},{"given":"Thang","family":"Pham","sequence":"additional","affiliation":[{"name":"Meta Platforms, Inc,Menlo Park,CA,94025"}]},{"given":"Yishen","family":"Huang","sequence":"additional","affiliation":[{"name":"Meta Platforms, Inc,Menlo Park,CA,94025"}]},{"given":"Stephen","family":"Krasulick","sequence":"additional","affiliation":[{"name":"Skorpios Technologies Inc,Austin,TX,78741"}]}],"member":"263","reference":[{"key":"ref7","first-page":"th1c.2","article-title":"A CMOS Wafer-Scale, Monolithically Integrated WDM Platform for TB\/s Optical Interconnects","author":"li","year":"2011","journal-title":"Optical Fiber Communication Conference (Optical Society of America 2014)"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1109\/JLT.2020.3043653"},{"year":"2021","author":"document","article-title":"3.2T-Copackaged-Optics-ModulePRD-1.0","key":"ref3"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1109\/JSTQE.2010.2081350"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1364\/JOCN.10.000B25"},{"year":"2022","article-title":"Design Considerations of Optical Connectivity in a Co-Packaged or On-Board Optics Switch","key":"ref2"},{"key":"ref1","doi-asserted-by":"crossref","first-page":"77","DOI":"10.1049\/ote2.12020","article-title":"Co-packaged datacenter optics: Opportunities and challenges","volume":"15","author":"minkenberg","year":"2021","journal-title":"IET Optoelectron 2021"}],"event":{"name":"2023 Optical Fiber Communications Conference and Exhibition (OFC)","start":{"date-parts":[[2023,3,5]]},"location":"San Diego, CA, USA","end":{"date-parts":[[2023,3,9]]}},"container-title":["2023 Optical Fiber Communications Conference and Exhibition (OFC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10115459\/10115461\/10116222.pdf?arnumber=10116222","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,5,22]],"date-time":"2023-05-22T17:44:01Z","timestamp":1684777441000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10116222\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,3]]},"references-count":7,"URL":"https:\/\/doi.org\/10.23919\/ofc49934.2023.10116222","relation":{},"subject":[],"published":{"date-parts":[[2023,3]]}}}