{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,6]],"date-time":"2025-11-06T11:42:35Z","timestamp":1762429355659,"version":"3.28.0"},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,6]]},"DOI":"10.23919\/vlsic.2019.8778132","type":"proceedings-article","created":{"date-parts":[[2019,7,29]],"date-time":"2019-07-29T19:44:52Z","timestamp":1564429492000},"page":"C64-C65","source":"Crossref","is-referenced-by-count":3,"title":["A CMOS Temperature Stabilized 2-Dimensional Mechanical Stress Sensor with 11-bit Resolution"],"prefix":"10.23919","author":[{"given":"Umidjon","family":"Nurmetov","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tobias","family":"Fritz","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ernst","family":"Mullner","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Christopher","family":"Dougherty","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Franz","family":"Kreupl","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ralf","family":"Brederlow","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","first-page":"108","author":"kuhl","year":"2011","journal-title":"ISSCC Dig"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2018.2843534"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2015.2433292"},{"key":"ref5","first-page":"2191","volume":"48 9","author":"kuhl","year":"2013","journal-title":"JSSCC"},{"key":"ref2","first-page":"1","author":"ramirez","year":"2018","journal-title":"SBCCI"},{"key":"ref1","first-page":"273","volume":"51 1","author":"mahsereci","year":"2016","journal-title":"JSSCC"}],"event":{"name":"2019 Symposium on VLSI Circuits","start":{"date-parts":[[2019,6,9]]},"location":"Kyoto, Japan","end":{"date-parts":[[2019,6,14]]}},"container-title":["2019 Symposium on VLSI Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8766307\/8777931\/08778132.pdf?arnumber=8778132","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,8,22]],"date-time":"2019-08-22T13:20:33Z","timestamp":1566480033000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8778132\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,6]]},"references-count":6,"URL":"https:\/\/doi.org\/10.23919\/vlsic.2019.8778132","relation":{},"subject":[],"published":{"date-parts":[[2019,6]]}}}