{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,24]],"date-time":"2026-03-24T04:37:09Z","timestamp":1774327029675,"version":"3.50.1"},"reference-count":21,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,6,11]],"date-time":"2023-06-11T00:00:00Z","timestamp":1686441600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,6,11]],"date-time":"2023-06-11T00:00:00Z","timestamp":1686441600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,6,11]]},"DOI":"10.23919\/vlsitechnologyandcir57934.2023.10185216","type":"proceedings-article","created":{"date-parts":[[2023,7,24]],"date-time":"2023-07-24T17:36:33Z","timestamp":1690220193000},"page":"1-2","source":"Crossref","is-referenced-by-count":6,"title":["Grain Size Reduction of Ferroelectric HZO Enabled by a Novel Solid Phase Epitaxy (SPE) Approach: Working Principle, Experimental Demonstration, and Theoretical Understanding"],"prefix":"10.23919","author":[{"given":"Dong","family":"Zhang","sequence":"first","affiliation":[{"name":"National University of Singapore (NUS),Department of Electrical and Computer Engineering,Singapore,117576"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jixuan","family":"Wu","sequence":"additional","affiliation":[{"name":"Shandong University,School of Information Science and Engineering,Qingdao,China,266237"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qiwen","family":"Kong","sequence":"additional","affiliation":[{"name":"National University of Singapore (NUS),Department of Electrical and Computer Engineering,Singapore,117576"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zuopu","family":"Zhou","sequence":"additional","affiliation":[{"name":"National University of Singapore (NUS),Department of Electrical and Computer Engineering,Singapore,117576"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Long","family":"Liu","sequence":"additional","affiliation":[{"name":"National University of Singapore (NUS),Department of Electrical and Computer Engineering,Singapore,117576"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kaizhen","family":"Han","sequence":"additional","affiliation":[{"name":"National University of Singapore (NUS),Department of Electrical and Computer Engineering,Singapore,117576"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chen","family":"Sun","sequence":"additional","affiliation":[{"name":"National University of Singapore (NUS),Department of Electrical and Computer Engineering,Singapore,117576"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaolin","family":"Wang","sequence":"additional","affiliation":[{"name":"National University of Singapore (NUS),Department of Electrical and Computer Engineering,Singapore,117576"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gan","family":"Liu","sequence":"additional","affiliation":[{"name":"National University of Singapore (NUS),Department of Electrical and Computer Engineering,Singapore,117576"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Leming","family":"Jiao","sequence":"additional","affiliation":[{"name":"National University of Singapore (NUS),Department of Electrical and Computer Engineering,Singapore,117576"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zijie","family":"Zheng","sequence":"additional","affiliation":[{"name":"National University of Singapore (NUS),Department of Electrical and Computer Engineering,Singapore,117576"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuye","family":"Kang","sequence":"additional","affiliation":[{"name":"National University of Singapore (NUS),Department of Electrical and Computer Engineering,Singapore,117576"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jiezhi","family":"Chen","sequence":"additional","affiliation":[{"name":"Shandong University,School of Information Science and Engineering,Qingdao,China,266237"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiao","family":"Gong","sequence":"additional","affiliation":[{"name":"National University of Singapore (NUS),Department of Electrical and Computer Engineering,Singapore,117576"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref13","author":"das","year":"2020","journal-title":"EDL"},{"key":"ref12","author":"gaddam","year":"2020","journal-title":"TED"},{"key":"ref15","author":"zhao","year":"2022","journal-title":"TED"},{"key":"ref14","author":"das","year":"2021","journal-title":"TED"},{"key":"ref20","author":"pe\u0161i?","year":"2016","journal-title":"AFM"},{"key":"ref11","author":"das","year":"2020","journal-title":"EDL"},{"key":"ref10","author":"liang","year":"2021","journal-title":"IEDM"},{"key":"ref21","author":"zhou","year":"2019","journal-title":"CMS"},{"key":"ref2","author":"zheng","year":"2022","journal-title":"VLSI"},{"key":"ref1","author":"aabrar","year":"2021","journal-title":"IEDM"},{"key":"ref17","author":"materlik","year":"2015","journal-title":"JAP"},{"key":"ref16","author":"wu","year":"2020","journal-title":"APL"},{"key":"ref19","author":"tang","year":"2019","journal-title":"VLSI"},{"key":"ref18","author":"park","year":"2018","journal-title":"Nanoscale"},{"key":"ref8","author":"popovici","year":"2022","journal-title":"IEDM"},{"key":"ref7","author":"zhou","year":"2022","journal-title":"IEDM"},{"key":"ref9","author":"wu","year":"2021","journal-title":"VLSI"},{"key":"ref4","author":"aabrar","year":"2022","journal-title":"VLSI"},{"key":"ref3","author":"zhou","year":"2022","journal-title":"VLSI"},{"key":"ref6","author":"fu","year":"2022","journal-title":"IEDM"},{"key":"ref5","author":"liao","year":"2019","journal-title":"EDL"}],"event":{"name":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","location":"Kyoto, Japan","start":{"date-parts":[[2023,6,11]]},"end":{"date-parts":[[2023,6,16]]}},"container-title":["2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10185199\/10185158\/10185216.pdf?arnumber=10185216","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,7,24]],"date-time":"2023-07-24T21:37:34Z","timestamp":1690234654000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10185216\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,6,11]]},"references-count":21,"URL":"https:\/\/doi.org\/10.23919\/vlsitechnologyandcir57934.2023.10185216","relation":{},"subject":[],"published":{"date-parts":[[2023,6,11]]}}}