{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,17]],"date-time":"2025-09-17T15:27:22Z","timestamp":1758122842612,"version":"3.28.0"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,6,11]],"date-time":"2023-06-11T00:00:00Z","timestamp":1686441600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,6,11]],"date-time":"2023-06-11T00:00:00Z","timestamp":1686441600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,6,11]]},"DOI":"10.23919\/vlsitechnologyandcir57934.2023.10185277","type":"proceedings-article","created":{"date-parts":[[2023,7,24]],"date-time":"2023-07-24T17:36:33Z","timestamp":1690220193000},"page":"1-2","source":"Crossref","is-referenced-by-count":7,"title":["Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB\/s Bandwidth with Lowest Bit Access Energy"],"prefix":"10.23919","author":[{"given":"Norio","family":"Chujo","sequence":"first","affiliation":[{"name":"Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Koji","family":"Sakui","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shinji","family":"Sugatani","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hiroyuki","family":"Ryoson","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tomoji","family":"Nakamura","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Takayuki","family":"Ohba","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology, IIR,The WOW Alliance,Yokohama,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"year":"2021","author":"takasaki","journal-title":"DPS","key":"ref4"},{"year":"2021","author":"funaki","journal-title":"ECTC","key":"ref3"},{"year":"2020","author":"sakui","journal-title":"MAM","key":"ref6"},{"key":"ref5","doi-asserted-by":"crossref","first-page":"4606","DOI":"10.1109\/TED.2020.3010894","volume":"67","author":"sugatani","year":"2020","journal-title":"TED"},{"year":"2020","author":"chujo","journal-title":"VLSI","key":"ref2"},{"year":"2015","journal-title":"JESD235","key":"ref1"}],"event":{"name":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","start":{"date-parts":[[2023,6,11]]},"location":"Kyoto, Japan","end":{"date-parts":[[2023,6,16]]}},"container-title":["2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10185199\/10185158\/10185277.pdf?arnumber=10185277","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,7,24]],"date-time":"2023-07-24T21:56:39Z","timestamp":1690235799000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10185277\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,6,11]]},"references-count":6,"URL":"https:\/\/doi.org\/10.23919\/vlsitechnologyandcir57934.2023.10185277","relation":{},"subject":[],"published":{"date-parts":[[2023,6,11]]}}}