{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,4]],"date-time":"2026-07-04T17:05:08Z","timestamp":1783184708399,"version":"3.54.6"},"reference-count":26,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,6,11]],"date-time":"2023-06-11T00:00:00Z","timestamp":1686441600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,6,11]],"date-time":"2023-06-11T00:00:00Z","timestamp":1686441600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,6,11]]},"DOI":"10.23919\/vlsitechnologyandcir57934.2023.10185284","type":"proceedings-article","created":{"date-parts":[[2023,7,24]],"date-time":"2023-07-24T17:36:33Z","timestamp":1690220193000},"page":"1-2","source":"Crossref","is-referenced-by-count":18,"title":["First Stacked Nanosheet FeFET Featuring Memory Window of 1.8V at Record Low Write Voltage of 2V and Endurance &gt;1E11 Cycles"],"prefix":"10.23919","author":[{"given":"Yu-Rui","family":"Chen","sequence":"first","affiliation":[{"name":"Graduate Institute of Electronics Engineering,Taipei,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yi-Chun","family":"Liu","sequence":"additional","affiliation":[{"name":"Graduate Institute of Electronics Engineering,Taipei,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zefu","family":"Zhao","sequence":"additional","affiliation":[{"name":"Graduate Institute of Electronics Engineering,Taipei,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Wan-Hsuan","family":"Hsieh","sequence":"additional","affiliation":[{"name":"Graduate Institute of Electronics Engineering,Taipei,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jia-Yang","family":"Lee","sequence":"additional","affiliation":[{"name":"Graduate School of Advanced Technology,Taipei,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chien-Te","family":"Tu","sequence":"additional","affiliation":[{"name":"Graduate Institute of Electronics Engineering,Taipei,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Bo-Wei","family":"Huang","sequence":"additional","affiliation":[{"name":"Graduate Institute of Electronics Engineering,Taipei,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jer-Fu","family":"Wang","sequence":"additional","affiliation":[{"name":"Graduate Institute of Electronics Engineering,Taipei,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shee-Jier","family":"Chueh","sequence":"additional","affiliation":[{"name":"Graduate Institute of Electronics Engineering,Taipei,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yifan","family":"Xing","sequence":"additional","affiliation":[{"name":"Graduate Institute of Electronics Engineering,Taipei,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Guan-Hua","family":"Chen","sequence":"additional","affiliation":[{"name":"Graduate Institute of Photonics and Optoelectronics, National Taiwan University,Taipei,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hung-Chun","family":"Chou","sequence":"additional","affiliation":[{"name":"Graduate School of Advanced Technology,Taipei,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dong Soo","family":"Woo","sequence":"additional","affiliation":[{"name":"Graduate Institute of Electronics Engineering,Taipei,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"M. H.","family":"Lee","sequence":"additional","affiliation":[{"name":"Graduate School of Advanced Technology,Taipei,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"C. W.","family":"Liu","sequence":"additional","affiliation":[{"name":"Graduate Institute of Electronics Engineering,Taipei,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref13","author":"bae","year":"2020","journal-title":"IEEE EDL"},{"key":"ref12","author":"mulaosmanovic","year":"2019","journal-title":"IEEE EDL"},{"key":"ref15","first-page":"15t","author":"liu","year":"2021","journal-title":"VLSI"},{"key":"ref14","first-page":"681","author":"tu","year":"2019","journal-title":"IEDM"},{"key":"ref11","author":"pesic","year":"2018","journal-title":"IEEE Trans Device Mater"},{"key":"ref10","author":"tan","year":"2020","journal-title":"Device Res Conf (DRC)"},{"key":"ref2","author":"islam khan","year":"2020","journal-title":"Nature Electronics"},{"key":"ref1","first-page":"294","author":"trentzsch","year":"2016","journal-title":"IEDM"},{"key":"ref17","article-title":"Mater. Sci. Semicond. Process","author":"liu","year":"2021"},{"key":"ref16","author":"liu","year":"2021","journal-title":"IEEE TED"},{"key":"ref19","author":"chen","year":"2022","journal-title":"IEEE EDL"},{"key":"ref18","first-page":"536","article-title":"Mater. Sci. Semicond. Process","volume":"9","author":"chroneos","year":"2006"},{"key":"ref24","article-title":"ACS Appl. Electron. Mater","author":"zacharaki","year":"2022"},{"key":"ref23","author":"liu","year":"2019","journal-title":"IEEE EDL"},{"key":"ref26","author":"ni","year":"2018","journal-title":"IEEE TED"},{"key":"ref25","author":"luo","year":"2018","journal-title":"IEDM"},{"key":"ref20","author":"tan","year":"2020","journal-title":"VLSI"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2021.3096248"},{"key":"ref21","author":"dunkel","year":"2017","journal-title":"IEDM"},{"key":"ref8","author":"tan","year":"2021","journal-title":"IEEE EDL"},{"key":"ref7","article-title":"Adv. Electron. Mater","author":"sessi","year":"2020"},{"key":"ref9","author":"liao","year":"2021","journal-title":"IEEE EDL"},{"key":"ref4","author":"toprasertpong","year":"2020","journal-title":"VLSI"},{"key":"ref3","first-page":"393","author":"liao","year":"2022","journal-title":"VLSI"},{"key":"ref6","author":"zhao","year":"2023","journal-title":"submitted to VLSI"},{"key":"ref5","author":"toprasertpong","year":"2022","journal-title":"IEEE TED"}],"event":{"name":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","location":"Kyoto, Japan","start":{"date-parts":[[2023,6,11]]},"end":{"date-parts":[[2023,6,16]]}},"container-title":["2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10185199\/10185158\/10185284.pdf?arnumber=10185284","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,7,24]],"date-time":"2023-07-24T21:50:43Z","timestamp":1690235443000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10185284\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,6,11]]},"references-count":26,"URL":"https:\/\/doi.org\/10.23919\/vlsitechnologyandcir57934.2023.10185284","relation":{},"subject":[],"published":{"date-parts":[[2023,6,11]]}}}