{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,10]],"date-time":"2025-12-10T09:03:53Z","timestamp":1765357433815,"version":"3.37.3"},"reference-count":12,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,6,11]],"date-time":"2023-06-11T00:00:00Z","timestamp":1686441600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,6,11]],"date-time":"2023-06-11T00:00:00Z","timestamp":1686441600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100004358","name":"Samsung","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100004358","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003836","name":"IC Design Education Center","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003836","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,6,11]]},"DOI":"10.23919\/vlsitechnologyandcir57934.2023.10185328","type":"proceedings-article","created":{"date-parts":[[2023,7,24]],"date-time":"2023-07-24T17:36:33Z","timestamp":1690220193000},"page":"1-2","source":"Crossref","is-referenced-by-count":4,"title":["A Low-Voltage Area-Efficient TSV I\/O for HBM with Data Rate up to 15Gb\/s Featuring Overlapped Multiplexing Driver, ISI Compensators and QEC"],"prefix":"10.23919","author":[{"given":"Taeryeong","family":"Kim","sequence":"first","affiliation":[{"name":"Yonsei University,VLSI System Lab"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ji-Young","family":"Kim","sequence":"additional","affiliation":[{"name":"Yonsei University,VLSI System Lab"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jeonghyeok","family":"You","sequence":"additional","affiliation":[{"name":"Yonsei University,VLSI System Lab"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hohyun","family":"Chae","sequence":"additional","affiliation":[{"name":"Yonsei University,VLSI System Lab"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Byoung Mo","family":"Moon","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kyomin","family":"Sohn","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Seong-Ook","family":"Jung","sequence":"additional","affiliation":[{"name":"Yonsei University,VLSI System Lab"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"VLSI-DAT","year":"2014","author":"chung","key":"ref8"},{"key":"ref7","first-page":"884","author":"choi","year":"2018","journal-title":"JSSC"},{"key":"ref12","first-page":"463","author":"yoon","year":"2021","journal-title":"ESSCIRC"},{"key":"ref9","first-page":"318","author":"lee","year":"2016","journal-title":"ISSCC"},{"key":"ref4","first-page":"987","author":"yi","year":"2014","journal-title":"TCAS-II"},{"key":"ref3","first-page":"142","author":"liu","year":"2012","journal-title":"ISSCC"},{"key":"ref6","first-page":"152","author":"kim","year":"2022","journal-title":"VLSI"},{"key":"ref11","first-page":"340","author":"shin","year":"2020","journal-title":"ISSCC"},{"key":"ref5","first-page":"1913","author":"kim","year":"2021","journal-title":"JSSC"},{"key":"ref10","first-page":"1276","author":"song","year":"2013","journal-title":"JSSC"},{"key":"ref2","first-page":"444","author":"park","year":"2022","journal-title":"ISSCC"},{"key":"ref1","first-page":"130","author":"ryu","year":"2022","journal-title":"VLSI"}],"event":{"name":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","start":{"date-parts":[[2023,6,11]]},"location":"Kyoto, Japan","end":{"date-parts":[[2023,6,16]]}},"container-title":["2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10185199\/10185158\/10185328.pdf?arnumber=10185328","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,8,28]],"date-time":"2023-08-28T17:40:21Z","timestamp":1693244421000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10185328\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,6,11]]},"references-count":12,"URL":"https:\/\/doi.org\/10.23919\/vlsitechnologyandcir57934.2023.10185328","relation":{},"subject":[],"published":{"date-parts":[[2023,6,11]]}}}