{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,20]],"date-time":"2026-02-20T18:35:22Z","timestamp":1771612522924,"version":"3.50.1"},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,6,11]],"date-time":"2023-06-11T00:00:00Z","timestamp":1686441600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,6,11]],"date-time":"2023-06-11T00:00:00Z","timestamp":1686441600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001321","name":"National Research Foundation","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001321","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,6,11]]},"DOI":"10.23919\/vlsitechnologyandcir57934.2023.10185394","type":"proceedings-article","created":{"date-parts":[[2023,7,24]],"date-time":"2023-07-24T17:36:33Z","timestamp":1690220193000},"page":"1-2","source":"Crossref","is-referenced-by-count":9,"title":["Front-side and Back-side Power Delivery Network Guidelines for 2nm node High Perf Computing and Mobile SoC applications"],"prefix":"10.23919","author":[{"given":"J.","family":"Lee","sequence":"first","affiliation":[{"name":"Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J.","family":"Jeong","sequence":"additional","affiliation":[{"name":"Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S.","family":"Lee","sequence":"additional","affiliation":[{"name":"Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S.","family":"Lee","sequence":"additional","affiliation":[{"name":"Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J.","family":"Lim","sequence":"additional","affiliation":[{"name":"Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S. C.","family":"Song","sequence":"additional","affiliation":[{"name":"Google LLC,Mountain View,CA,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S.","family":"Ekbote","sequence":"additional","affiliation":[{"name":"Google LLC,Mountain View,CA,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"N.","family":"Stevens-Yu","sequence":"additional","affiliation":[{"name":"Google LLC,Mountain View,CA,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"D.","family":"Greenlaw","sequence":"additional","affiliation":[{"name":"Google LLC,Mountain View,CA,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"R.-H.","family":"Baek","sequence":"additional","affiliation":[{"name":"Pohang University of Science and Technology (POSTECH),Department of Electrical Engineering,Pohang,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref8","author":"jourdain","year":"2022","journal-title":"ECTC"},{"key":"ref7","author":"chen","year":"2022","journal-title":"VLSI"},{"key":"ref9","author":"prasad","year":"2019","journal-title":"IEDM"},{"key":"ref4","author":"gupta","year":"2021","journal-title":"IEDM"},{"key":"ref3","author":"hellings","year":"2021","journal-title":"IEDM"},{"key":"ref6","author":"chen","year":"2022","journal-title":"IEDM"},{"key":"ref5","author":"veloso","year":"2022","journal-title":"IEDM"},{"key":"ref2","author":"samavedam","year":"2020","journal-title":"IEDM"},{"key":"ref1","author":"song","year":"2021","journal-title":"IEDM"}],"event":{"name":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","location":"Kyoto, Japan","start":{"date-parts":[[2023,6,11]]},"end":{"date-parts":[[2023,6,16]]}},"container-title":["2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10185199\/10185158\/10185394.pdf?arnumber=10185394","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,7,24]],"date-time":"2023-07-24T21:38:19Z","timestamp":1690234699000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10185394\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,6,11]]},"references-count":9,"URL":"https:\/\/doi.org\/10.23919\/vlsitechnologyandcir57934.2023.10185394","relation":{},"subject":[],"published":{"date-parts":[[2023,6,11]]}}}