{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,31]],"date-time":"2024-10-31T03:17:46Z","timestamp":1730344666158,"version":"3.28.0"},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,6,11]],"date-time":"2023-06-11T00:00:00Z","timestamp":1686441600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,6,11]],"date-time":"2023-06-11T00:00:00Z","timestamp":1686441600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,6,11]]},"DOI":"10.23919\/vlsitechnologyandcir57934.2023.10185404","type":"proceedings-article","created":{"date-parts":[[2023,7,24]],"date-time":"2023-07-24T13:36:33Z","timestamp":1690205793000},"page":"1-2","source":"Crossref","is-referenced-by-count":0,"title":["High Bit Cost Scalability and Reliable Cell Characteristics for 7th Generation 1Tb 4Bit\/Cell 3D-NAND Flash"],"prefix":"10.23919","author":[{"given":"Kyungmoon","family":"Kim","sequence":"first","affiliation":[{"name":"Device Solutions, Samsung Electronics Co.,,Pyeongtaek,Korea,17786"}]},{"given":"Yujeong","family":"Seo","sequence":"additional","affiliation":[{"name":"Device Solutions, Samsung Electronics Co.,,Pyeongtaek,Korea,17786"}]},{"given":"Sejun","family":"Park","sequence":"additional","affiliation":[{"name":"Device Solutions, Samsung Electronics Co.,,Pyeongtaek,Korea,17786"}]},{"given":"Woojae","family":"Jang","sequence":"additional","affiliation":[{"name":"Device Solutions, Samsung Electronics Co.,,Pyeongtaek,Korea,17786"}]},{"given":"Dongho","family":"Yoo","sequence":"additional","affiliation":[{"name":"Device Solutions, Samsung Electronics Co.,,Pyeongtaek,Korea,17786"}]},{"given":"Joonsung","family":"Lim","sequence":"additional","affiliation":[{"name":"Device Solutions, Samsung Electronics Co.,,Pyeongtaek,Korea,17786"}]},{"given":"Il-Han","family":"Park","sequence":"additional","affiliation":[{"name":"Device Solutions, Samsung Electronics Co.,,Pyeongtaek,Korea,17786"}]},{"given":"Jaeduk","family":"Lee","sequence":"additional","affiliation":[{"name":"Device Solutions, Samsung Electronics Co.,,Pyeongtaek,Korea,17786"}]},{"given":"Kyungyoon","family":"Noh","sequence":"additional","affiliation":[{"name":"Device Solutions, Samsung Electronics Co.,,Pyeongtaek,Korea,17786"}]},{"given":"Sujin","family":"Ahn","sequence":"additional","affiliation":[{"name":"Device Solutions, Samsung Electronics Co.,,Pyeongtaek,Korea,17786"}]},{"given":"Sunghoi","family":"Hur","sequence":"additional","affiliation":[{"name":"Device Solutions, Samsung Electronics Co.,,Pyeongtaek,Korea,17786"}]}],"member":"263","reference":[{"key":"ref4","first-page":"10.1.1","author":"kang","year":"2021","journal-title":"IEDM"},{"key":"ref3","first-page":"1","author":"kim","year":"2021","journal-title":"IEEE IMW"},{"key":"ref5","doi-asserted-by":"crossref","first-page":"626","DOI":"10.1109\/JEDS.2019.2920024","volume":"7","author":"wu","year":"2019","journal-title":"IEEE J Electron Devices Soc"},{"key":"ref2","first-page":"56","volume":"14","author":"yoon","year":"2022","journal-title":"IEEE SSC-M"},{"key":"ref1","first-page":"1","author":"godse","year":"2018","journal-title":"IEEE ANTS"}],"event":{"name":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","start":{"date-parts":[[2023,6,11]]},"location":"Kyoto, Japan","end":{"date-parts":[[2023,6,16]]}},"container-title":["2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10185199\/10185158\/10185404.pdf?arnumber=10185404","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,12,11]],"date-time":"2023-12-11T14:02:20Z","timestamp":1702303340000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10185404\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,6,11]]},"references-count":5,"URL":"https:\/\/doi.org\/10.23919\/vlsitechnologyandcir57934.2023.10185404","relation":{},"subject":[],"published":{"date-parts":[[2023,6,11]]}}}