{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,1,13]],"date-time":"2024-01-13T00:40:59Z","timestamp":1705106459258},"reference-count":0,"publisher":"IOS Press","isbn-type":[{"value":"9781643684802","type":"print"},{"value":"9781643684819","type":"electronic"}],"license":[{"start":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T00:00:00Z","timestamp":1705017600000},"content-version":"unspecified","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by-nc\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,1,12]]},"abstract":"<jats:p>In order to improve the long-term service reliability of advanced electronic devices and reduce the risk of chip overheating failure in the production process, the interlayer gas-tight interconnection technology architecture is favored by researchers because of the design of gas-tight and electrical signal interconnection simultaneously achieved in a single welding. The main hermetic interconnection technology with gold convex spot or gold tin micro convex spot has the disadvantages of high production and high technical barriers, which restricts the vigorous development of the industry. This paper is based on cheap SAC305 solder paste which has been the emerging advanced electronic packaging field favorite to carry out corresponding research. With 0.75mm or 1mm wide sealing ring and size\/spacing of 0.4mm\/0.8mm, 0.6mm\/1.2mm or 0.8mm\/1.6mm substrate pad combination, with double-sided prefabricated solder process, the domestic and foreign leading gas tight interconnection index has been obtained, which is as low as 1.1e-9Pa\u00b7m3\/s. Meanwhile, the planarity is &lt;0.2\/100. There is no obvious abnormal electrical interconnection, and there is no evident index decline after environmental adaptability assessment. The number of rewelding is \u22652. This special design provides a new idea for the selection of solder and architecture design in the field of gas tight packaging.<\/jats:p>","DOI":"10.3233\/faia231236","type":"book-chapter","created":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T12:56:43Z","timestamp":1705064203000},"source":"Crossref","is-referenced-by-count":0,"title":["Hermetic Interlayer Interconnection Technology Based on SAC305 Solder Paste"],"prefix":"10.3233","author":[{"given":"Yongfang","family":"Hu","sequence":"first","affiliation":[{"name":"School of Electronic Science & Engineering, Southeast University, Nanjing, China"},{"name":"Nanjing Research Institute of Electronics Technology, Nanjing, China"}]},{"given":"Kun","family":"Yan","sequence":"additional","affiliation":[{"name":"Nanjing Research Institute of Electronics Technology, Nanjing, China"}]},{"given":"Ziyuan","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Electronic Science & Engineering, Southeast University, Nanjing, China"}]},{"given":"Liuwei","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Electronic Science & Engineering, Southeast University, Nanjing, China"}]},{"given":"Yipeng","family":"Sun","sequence":"additional","affiliation":[{"name":"School of Electronic Science & Engineering, Southeast University, Nanjing, China"},{"name":"Nanjing Research Institute of Electronics Technology, Nanjing, China"}]},{"given":"Yuefei","family":"Wang","sequence":"additional","affiliation":[{"name":"Nanjing Research Institute of Electronics Technology, Nanjing, China"}]},{"given":"Xinlong","family":"Zhang","sequence":"additional","affiliation":[{"name":"Nanjing Research Institute of Electronics Technology, Nanjing, China"}]},{"given":"Zongjie","family":"Han","sequence":"additional","affiliation":[{"name":"Nanjing Research Institute of Electronics Technology, Nanjing, China"}]},{"given":"Qingan","family":"Huang","sequence":"additional","affiliation":[{"name":"School of Electronic Science & Engineering, Southeast University, Nanjing, China"}]},{"given":"Lei","family":"Han","sequence":"additional","affiliation":[{"name":"School of Electronic Science & Engineering, Southeast University, Nanjing, China"}]}],"member":"7437","container-title":["Frontiers in Artificial Intelligence and Applications","Electronics, Communications and Networks"],"original-title":[],"link":[{"URL":"https:\/\/ebooks.iospress.nl\/pdf\/doi\/10.3233\/FAIA231236","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T12:56:44Z","timestamp":1705064204000},"score":1,"resource":{"primary":{"URL":"https:\/\/ebooks.iospress.nl\/doi\/10.3233\/FAIA231236"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,1,12]]},"ISBN":["9781643684802","9781643684819"],"references-count":0,"URL":"https:\/\/doi.org\/10.3233\/faia231236","relation":{},"ISSN":["0922-6389","1879-8314"],"issn-type":[{"value":"0922-6389","type":"print"},{"value":"1879-8314","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,1,12]]}}}