{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,21]],"date-time":"2026-04-21T22:41:53Z","timestamp":1776811313277,"version":"3.51.2"},"reference-count":11,"publisher":"European Society of Computational Methods in Sciences and Engineering","issue":"3","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["JCM"],"published-print":{"date-parts":[[2020,9,30]]},"abstract":"<jats:p>PCB is an important component for electronic devices \u2013 Mechanical connections and electrical transmission, thermal failure is its main failure mode, the heat flow analysis and thermal design is the basis and premise to improve thermal characteristics of PCBs. In this paper, based on the principles of fluid mechanics, using the finite volume method, the thermal characteristics of the PCB is modeled, and we obtain the maximum junction temperature of the PCB, PCB\u2019s thermal distribution and effect of different ambient temperatures on the PCB thermal characteristics. The study provides a theoretical basis for the PCB thermal design.<\/jats:p>","DOI":"10.3233\/jcm-194033","type":"journal-article","created":{"date-parts":[[2020,2,11]],"date-time":"2020-02-11T10:50:16Z","timestamp":1581418216000},"page":"853-858","source":"Crossref","is-referenced-by-count":2,"title":["PCB thermal reliability characteristics analysis under ambient temperature"],"prefix":"10.66113","volume":"20","author":[{"given":"Hailong","family":"Huang","sequence":"first","affiliation":[{"name":"College of Computer Science and Artificial Intelligence, Wenzhou University, Wenzhou, Zhejiang, China"}]},{"given":"Yi","family":"Wan","sequence":"additional","affiliation":[{"name":"Xinjiang Institute of Technology, Akesu, Xingjiang, China"}]},{"given":"Kai","family":"Zhou","sequence":"additional","affiliation":[{"name":"Xinjiang Institute of Technology, Akesu, Xingjiang, China"}]}],"member":"55691","reference":[{"issue":"4","key":"10.3233\/JCM-194033_ref1","doi-asserted-by":"crossref","first-page":"699","DOI":"10.1007\/s11668-017-0296-1","article-title":"Solder selection for reflowing large ceramic substrates during PCB assembly","volume":"17","author":"Gangidi","year":"2017","journal-title":"Journal of Failure Analysis and Prevention"},{"issue":"4","key":"10.3233\/JCM-194033_ref2","doi-asserted-by":"crossref","first-page":"798","DOI":"10.1016\/j.applthermaleng.2015.11.123","article-title":"Thermal performance of a PCB embedded pulsating heat pipe for power electronics applications","volume":"98","author":"Kearney","year":"2016","journal-title":"Applied Thermal Engineering: Design, Processes, Equipment, Economics"},{"issue":"2","key":"10.3233\/JCM-194033_ref3","doi-asserted-by":"crossref","first-page":"61","DOI":"10.1080\/15502287.2018.1430074","article-title":"Fatigue failure of pb-free electronic packages under random vibration loads","volume":"19","author":"Saravanan","year":"2018","journal-title":"International Journal for Computational Methods in Engineering Science and Mechanics"},{"issue":"2","key":"10.3233\/JCM-194033_ref4","doi-asserted-by":"crossref","first-page":"138","DOI":"10.1080\/15502280701815465","article-title":"Modeling and simulation of electronic packages subjected to thermal Impact","volume":"9","author":"Sakri","year":"2018","journal-title":"International Journal for Computational Methods in Engineering Science and Mechanics"},{"issue":"804","key":"10.3233\/JCM-194033_ref5","doi-asserted-by":"crossref","first-page":"391","DOI":"10.4028\/www.scientific.net\/AMM.401-403.391","article-title":"Reliability failure analysis of PCB and its technological improvement","volume":"2668","author":"Zhu","year":"2013","journal-title":"Applied Mechanics and Materials"},{"issue":"2","key":"10.3233\/JCM-194033_ref6","doi-asserted-by":"crossref","first-page":"206","DOI":"10.1109\/TDMR.2015.2417888","article-title":"Thermal fatigue reliability analysis and structural optimization based on a robust method for microelectronics FBGA packages","volume":"15","author":"Wan","year":"2015","journal-title":"IEEE Transactions on Device and Materials Reliability"},{"key":"10.3233\/JCM-194033_ref7","doi-asserted-by":"crossref","first-page":"502","DOI":"10.1016\/j.jcp.2013.08.042","article-title":"A multilevel multiscale finite-volume method","volume":"255","author":"K\u00fcnze","year":"2013","journal-title":"Journal of Computational Physics"},{"key":"10.3233\/JCM-194033_ref8","doi-asserted-by":"crossref","first-page":"181","DOI":"10.1016\/j.cam.2018.08.025","article-title":"Superconvergence of quadratic finite volume method on triangular meshes","volume":"348","author":"Wang","year":"2019","journal-title":"Journal of Computational and Applied Mathematics"},{"issue":"4","key":"10.3233\/JCM-194033_ref9","doi-asserted-by":"crossref","first-page":"1091","DOI":"10.1016\/j.camwa.2018.10.044","article-title":"A finite volume method for Stokes problems on quadrilateral meshes","volume":"77","author":"Zhang","year":"2019","journal-title":"Computers and Mathematics with Applications"},{"key":"10.3233\/JCM-194033_ref10","doi-asserted-by":"crossref","unstructured":"H.W. Zhang, Y. Liu and J. Wang, Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading, Microelectronics Reliability 55(11) (2015), 2391\u20132395.","DOI":"10.1016\/j.microrel.2015.07.033"},{"issue":"6","key":"10.3233\/JCM-194033_ref11","doi-asserted-by":"crossref","first-page":"4697","DOI":"10.1007\/s11356-013-2392-4","article-title":"Effect of temperature and particle size on the thermal desorption of PCBs from contaminated soil","volume":"21","author":"Qi","year":"2014","journal-title":"Environmental Science and Pollution Research"}],"container-title":["Journal of Computational Methods in Sciences and Engineering"],"original-title":[],"link":[{"URL":"https:\/\/content.iospress.com\/download?id=10.3233\/JCM-194033","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,4,21]],"date-time":"2026-04-21T22:06:01Z","timestamp":1776809161000},"score":1,"resource":{"primary":{"URL":"https:\/\/journals.sagepub.com\/doi\/full\/10.3233\/JCM-194033"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,9,30]]},"references-count":11,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.3233\/jcm-194033","relation":{},"ISSN":["1472-7978","1875-8983"],"issn-type":[{"value":"1472-7978","type":"print"},{"value":"1875-8983","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020,9,30]]}}}