{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,10]],"date-time":"2026-03-10T15:32:25Z","timestamp":1773156745845,"version":"3.50.1"},"reference-count":29,"publisher":"MDPI AG","issue":"12","license":[{"start":{"date-parts":[[2012,12,4]],"date-time":"2012-12-04T00:00:00Z","timestamp":1354579200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/3.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Entropy"],"abstract":"<jats:p>Parametric studies of the effects of slip irreversibility in concentrating solar power (CSP)-powered bio-digester assemblies are investigated. Complexities regarding the identification of the appropriate electro-kinetic phenomena for certain electrolyte phases are reviewed. The application of exergy analysis to the design of energy conversion devices, like solar thermal collectors, for the required heat of formation in a downdraft waste food bio-digester, is discussed. Thermal management in the silicon-based substrate of the energy system is analyzed. The rectangular-shaped micro-channels are simulated with a finite-volume, staggered coupling of the pressure-velocity fields. Entropy generation transport within the energy system is determined and coupled with the solution procedure. Consequently, the effects of channel size perturbation, Reynolds number, and pressure ratios on the thermal performance and exergy destruction are presented. A comparative analysis of the axial heat conduction for thermal management in energy conversion devices is proposed.<\/jats:p>","DOI":"10.3390\/e14122439","type":"journal-article","created":{"date-parts":[[2012,12,4]],"date-time":"2012-12-04T15:10:18Z","timestamp":1354633818000},"page":"2439-2455","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":5,"title":["Electro-Kinetic Pumping with Slip Irreversibility in Heat Exchange of CSP-Powered Bio-Digester Assemblies"],"prefix":"10.3390","volume":"14","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-6526-2728","authenticated-orcid":false,"given":"Emmanuel","family":"Ogedengbe","sequence":"first","affiliation":[{"name":"Energhx Research Group, Department of Mechanical Engineering, 353 Faculty of Engineering, University of Lagos, Akoka-Yaba, Lagos, 101017, Nigeria"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Marc","family":"Rosen","sequence":"additional","affiliation":[{"name":"Faculty of Engineering and Applied Science, University of Ontario Institute of Technology, 2000 Simcoe Street North, Oshawa, ON, L1H 7K4, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2012,12,4]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"743","DOI":"10.1109\/TCAPT.2006.885933","article-title":"Limits of Heat Removal in Microelectronic Systems","volume":"29","author":"Miner","year":"2006","journal-title":"IEEE Trans. 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