{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,30]],"date-time":"2025-10-30T01:54:36Z","timestamp":1761789276500,"version":"build-2065373602"},"reference-count":37,"publisher":"MDPI AG","issue":"1","license":[{"start":{"date-parts":[[2015,12,29]],"date-time":"2015-12-29T00:00:00Z","timestamp":1451347200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Entropy"],"abstract":"<jats:p>In this study, convection flow in microchannel heat sink with offset fan-shaped reentrant cavities in sidewall filled with Fe3O4-water is numerically investigated. The effects of changing some parameters such as Reynolds number and magnetic field are considered. The nanofluid flow is laminar, steady and incompressible, while the thermo-physical properties of nanoparticles were assumed constant. A finite volume method and two phase mixture models were used to simulate the flow. The obtained results show that the frictional entropy generation increases as Reynolds number increases, while a reverse trend is observed for thermal entropy generation. By applying a non-uniform magnetic field, the entropy generation due to heat transfer decreases at first and then increases. When using the uniform magnetic field, the frictional entropy generation and thermal entropy generation is negligible. For all studied cases, the total entropy generation decreases using non-uniform magnetic fields. The results indicate that by increasing the magnetic field power, the total entropy generation decreases.<\/jats:p>","DOI":"10.3390\/e18010010","type":"journal-article","created":{"date-parts":[[2015,12,29]],"date-time":"2015-12-29T10:00:08Z","timestamp":1451383208000},"page":"10","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":16,"title":["Effect of Magnetic Field on Entropy Generation in a Microchannel Heat Sink with Offset Fan Shaped"],"prefix":"10.3390","volume":"18","author":[{"given":"Mohammad","family":"Nasiri","sequence":"first","affiliation":[{"name":"Department Mechanical Engineering, Faculty of Mechanical Engineering, University of Tabriz, Tabriz 5166616471, Iran"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mohammad","family":"Rashidi","sequence":"additional","affiliation":[{"name":"Shanghai Key Lab of Vehicle Aerodynamics and Vehicle Thermal Management Systems, Tongji University, Shanghai 201804, China"},{"name":"ENN-Tongji Clean Energy Institute of Advanced Studies, Tongji University, Shanghai 201804, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5676-8575","authenticated-orcid":false,"given":"Giulio","family":"Lorenzini","sequence":"additional","affiliation":[{"name":"Department of Industrial Engineering, University of Parma, Parma 43124, Italy"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2015,12,29]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"126","DOI":"10.1109\/EDL.1981.25367","article-title":"High-Performance Heat Sinking for VLSI","volume":"2","author":"Tuckerman","year":"1981","journal-title":"IEEE Electron Device Lett."},{"key":"ref_2","first-page":"99","article-title":"Enhancing thermal conductivity of fluids with nanoparticles","volume":"231","author":"Choi","year":"1995","journal-title":"Am. 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