{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,2]],"date-time":"2025-11-02T10:30:55Z","timestamp":1762079455876,"version":"build-2065373602"},"reference-count":18,"publisher":"MDPI AG","issue":"2","license":[{"start":{"date-parts":[[2014,6,24]],"date-time":"2014-06-24T00:00:00Z","timestamp":1403568000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/3.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Micromachines"],"abstract":"<jats:p>In this paper, a novel capacitance pressure sensor based on Low-Temperature Co-Fired Ceramic (LTCC) technology is proposed for pressure measurement. This approach differs from the traditional fabrication process for a LTCC pressure sensor because a 4J33 iron-nickel-cobalt alloy is applied to avoid the collapse of the cavity and to improve the performance of the sensor. Unlike the traditional LTCC sensor, the sensitive membrane of the proposed sensor is very flat, and the deformation of the sensitivity membrane is smaller. The proposed sensor also demonstrates a greater responsivity, which reaches as high as 13 kHz\/kPa in range of 0\u2013100 kPa. During experiments, the newly fabricated sensor, which is only about 6.5 cm2, demonstrated very good performance: the repeatability error, hysteresis error, and nonlinearity of the sensor are about 4.25%, 2.13%, and 1.77%, respectively.<\/jats:p>","DOI":"10.3390\/mi5020396","type":"journal-article","created":{"date-parts":[[2014,6,25]],"date-time":"2014-06-25T02:49:43Z","timestamp":1403664583000},"page":"396-407","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":15,"title":["Microfabrication of a Novel Ceramic Pressure Sensor with  High Sensitivity Based on Low-Temperature Co-Fired Ceramic (LTCC) Technology"],"prefix":"10.3390","volume":"5","author":[{"given":"Chen","family":"Li","sequence":"first","affiliation":[{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"},{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China"}]},{"given":"Qiulin","family":"Tan","sequence":"additional","affiliation":[{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"},{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1762-9246","authenticated-orcid":false,"given":"Wendong","family":"Zhang","sequence":"additional","affiliation":[{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"},{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China"}]},{"given":"Chenyang","family":"Xue","sequence":"additional","affiliation":[{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"},{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China"}]},{"given":"Yunzhi","family":"Li","sequence":"additional","affiliation":[{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"}]},{"given":"Jijun","family":"Xiong","sequence":"additional","affiliation":[{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"},{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China"}]}],"member":"1968","published-online":{"date-parts":[[2014,6,24]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"72","DOI":"10.1016\/j.matchemphys.2004.08.031","article-title":"Studies on threedimensional moulding, bonding and assembling of low-temperature-cofired ceramics for MEMS and MST applications","volume":"89","author":"Khanna","year":"2005","journal-title":"Mater. 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