{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,8]],"date-time":"2026-02-08T05:36:48Z","timestamp":1770529008378,"version":"3.49.0"},"reference-count":14,"publisher":"MDPI AG","issue":"6","license":[{"start":{"date-parts":[[2016,5,24]],"date-time":"2016-05-24T00:00:00Z","timestamp":1464048000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100003052","name":"Ministry of Trade, Industry and Energy","doi-asserted-by":"publisher","award":["10041083"],"award-info":[{"award-number":["10041083"]}],"id":[{"id":"10.13039\/501100003052","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003695","name":"Korea Institute of Industrial Technology","doi-asserted-by":"publisher","award":["EO160031"],"award-info":[{"award-number":["EO160031"]}],"id":[{"id":"10.13039\/501100003695","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Micromachines"],"abstract":"<jats:p>Wafer-level packaging (WLP) is a next-generation semiconductor packaging technology that is important for realizing high-performance and ultra-thin semiconductor devices. However, the molding process, which is a part of the WLP process, has various problems such as a high defect rate and low predictability. Among the various defect factors, the die shift primarily determines the quality of the final product; therefore, predicting the die shift is necessary to achieve high-yield production in WLP. In this study, the die shift caused by the flow drag force of the epoxy molding compound (EMC) is evaluated from the die shift of a debonded molding wafer. Experimental and analytical methods were employed to evaluate the die shift occurring during each stage of the molding process and that resulting from the geometrical changes after the debonding process. The die shift caused by the EMC flow drag force is evaluated from the data on die movements due to thermal contraction\/expansion and warpage. The relationship between the die shift and variation in the die gap is determined through regression analysis in order to predict the die shift due to the flow drag force. The results can be used for die realignment by predicting and compensating for the die shift.<\/jats:p>","DOI":"10.3390\/mi7060095","type":"journal-article","created":{"date-parts":[[2016,5,24]],"date-time":"2016-05-24T21:53:40Z","timestamp":1464126820000},"page":"95","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":23,"title":["Compensation Method for Die Shift Caused by Flow Drag Force in Wafer-Level Molding Process"],"prefix":"10.3390","volume":"7","author":[{"given":"Simo","family":"Yeon","sequence":"first","affiliation":[{"name":"Korea Institute of Industrial Technology, 143 Hanggaulro, Sangnok-gu, Ansan-si, Gyeonggi-do 15588, Korea"}]},{"given":"Jeanho","family":"Park","sequence":"additional","affiliation":[{"name":"Korea Institute of Industrial Technology, 143 Hanggaulro, Sangnok-gu, Ansan-si, Gyeonggi-do 15588, Korea"}]},{"given":"Hye-Jin","family":"Lee","sequence":"additional","affiliation":[{"name":"Korea Institute of Industrial Technology, 143 Hanggaulro, Sangnok-gu, Ansan-si, Gyeonggi-do 15588, Korea"}]}],"member":"1968","published-online":{"date-parts":[[2016,5,24]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Brunnbauer, M., F\u00fcrgut, E., Beer, G., and Meyer, T. (2006, January 6\u20138). Embedded wafer level ball grid array (eWLB). Proceedings of the 8th Electronics Packaging Technology Conference, Singapore.","DOI":"10.1109\/EPTC.2006.342681"},{"key":"ref_2","doi-asserted-by":"crossref","unstructured":"Sun, P., Leung, V., Yang, D., Lou, R., Shi, D., and Chung, T. (2010, January 1\u20134). Development of a new package-on-package (PoP) structure for next-generation portable electronics. Proceedings of the 60th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA.","DOI":"10.1109\/ECTC.2010.5490682"},{"key":"ref_3","unstructured":"Dreiza, M., Kim, J.S., and Smith, L. (2009, January 15\u201318). Joint project for mechanical qualification of next generation high density package-on-package (PoP) with through mold via technology. Proceedings of the 17th European Microelectronics & Packaging Conference (EMPC), Rimini, Italy."},{"key":"ref_4","unstructured":"Yole D\u00e9veloppement (2010). Embedded Wafer-Level-Packages: Fan-out WLP\/Chip Embedding in Substrate, Yole D\u00e9veloppement."},{"key":"ref_5","unstructured":"Fillion, R., Woychik, C., Zhang, T., and Bitting, D. (June, January 29). Embedded chip build-up using fine line interconnect. Proceedings of the 57th Electronic Components and Technology Conference, Reno, NV, USA."},{"key":"ref_6","doi-asserted-by":"crossref","unstructured":"Ostmann, A., Manessis, D., Loeher, T., Neumann, A., and Reichl, H. (2006, January 18\u201320). Strategies for embedding of active components. Proceedings of the International Microsystems, Package, Assembly Conference, Taipei, Taiwan.","DOI":"10.1109\/IMPACT.2006.312182"},{"key":"ref_7","unstructured":"Palm, P., Moisala, J., Kivikero, A., Tuominen, R., and lihola, A. (2005, January 16\u201318). Embedding active components inside printed circuit board (PCB) a solution for miniaturization of electronics. Proceedings of the International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, USA."},{"key":"ref_8","unstructured":"Yim, M.J., Strode, R., Brand, J., Adimula, R., Zhang, J.J., and Yoo, C. (June, January 31). Ultra thin PoP top package using compression mold: Its warpage control. Proceedings of the IEEE 61st Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, USA."},{"key":"ref_9","unstructured":"Khong, C.H., Kumar, A., Zhang, X., Sharma, G., Vempati, S.R., Vaidyanathan, K., Lau, J.H.-S., and Kwong, D.L. (2009, January 26\u201329). A novel method to predict die shift during compression molding in embedded wafer level package. Proceedings of the Electronic Components and Technology Conference, San Diego, CA, USA."},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"678","DOI":"10.1109\/TCPMT.2012.2220141","article-title":"3-D numerical and experimental investigations on compression molding in multichip embedded wafer level packaging","volume":"3","author":"Ji","year":"2012","journal-title":"IEEE Trans. Compon. Packag. Manuf. Technol."},{"key":"ref_11","unstructured":"Ji, L., Kim, H.J., Che, F., Gao, S., and Pinjala, D. (2011, January 7\u20139). Numerical study of preventing flow-induced die-shift in the compression molding for embedded wafer level packaging. Proceedings of the Electronics Packaging Technology Conference (EPTC), Singapore."},{"key":"ref_12","doi-asserted-by":"crossref","first-page":"502","DOI":"10.1109\/TCPMT.2010.2100431","article-title":"Solutions strategies for die shift problem in wafer level compression molding","volume":"1","author":"Sharma","year":"2011","journal-title":"IEEE Trans. Compon. Packag. Manuf. Technol."},{"key":"ref_13","doi-asserted-by":"crossref","first-page":"1090","DOI":"10.1109\/TCPMT.2014.2316019","article-title":"Comprehensive study on the interactions of multiple die shift mechanisms during wafer level molding of multichip-embedded wafer level packages","volume":"4","author":"Ling","year":"2014","journal-title":"IEEE Trans. Compon. Packag. Manuf. Technol."},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"1647","DOI":"10.1109\/TCPMT.2013.2268192","article-title":"Investigation on die shift issues in the 12-in wafer-level compression molding process","volume":"3","author":"Bu","year":"2013","journal-title":"IEEE Trans. Compon. Packag. Manuf. Technol."}],"container-title":["Micromachines"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/2072-666X\/7\/6\/95\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T19:24:23Z","timestamp":1760210663000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/2072-666X\/7\/6\/95"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,5,24]]},"references-count":14,"journal-issue":{"issue":"6","published-online":{"date-parts":[[2016,6]]}},"alternative-id":["mi7060095"],"URL":"https:\/\/doi.org\/10.3390\/mi7060095","relation":{},"ISSN":["2072-666X"],"issn-type":[{"value":"2072-666X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2016,5,24]]}}}