{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,10]],"date-time":"2026-01-10T02:41:09Z","timestamp":1768012869470,"version":"3.49.0"},"reference-count":22,"publisher":"MDPI AG","issue":"7","license":[{"start":{"date-parts":[[2016,6,30]],"date-time":"2016-06-30T00:00:00Z","timestamp":1467244800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Micromachines"],"abstract":"<jats:p>To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology) production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 \u03bcm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within \u00b13%.<\/jats:p>","DOI":"10.3390\/mi7070112","type":"journal-article","created":{"date-parts":[[2016,6,30]],"date-time":"2016-06-30T14:24:28Z","timestamp":1467296668000},"page":"112","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":20,"title":["Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack"],"prefix":"10.3390","volume":"7","author":[{"given":"Shoudong","family":"Gu","sequence":"first","affiliation":[{"name":"School of Mechanical Science and Engineering, Jilin University, No. 5988, Renmin Road, Changchun 130025, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaoyang","family":"Jiao","sequence":"additional","affiliation":[{"name":"School of Mechanical Science and Engineering, Jilin University, No. 5988, Renmin Road, Changchun 130025, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jianfang","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Mechanical Science and Engineering, Jilin University, No. 5988, Renmin Road, Changchun 130025, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhigang","family":"Yang","sequence":"additional","affiliation":[{"name":"School of Mechanical Science and Engineering, Jilin University, No. 5988, Renmin Road, Changchun 130025, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hai","family":"Jiang","sequence":"additional","affiliation":[{"name":"School of Mechanical Science and Engineering, Jilin University, No. 5988, Renmin Road, Changchun 130025, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qingqing","family":"Lv","sequence":"additional","affiliation":[{"name":"School of Mechanical Science and Engineering, Jilin University, No. 5988, Renmin Road, Changchun 130025, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2016,6,30]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"126","DOI":"10.1109\/TEPM.2008.919342","article-title":"Dmaic approach to improve the capability of smt solder printing process","volume":"31","author":"Li","year":"2008","journal-title":"IEEE Trans. Electr. Packag. Manuf."},{"key":"ref_2","doi-asserted-by":"crossref","unstructured":"Becker, K.-F., Koch, M., Voges, S., Thomas, T., Fliess, M., Bauer, J., Braun, T., Aschenbrenner, R., Schneider-Ramelow, M., and Lang, K.-D. (2014, January 13\u201316). Precision jetting of solder paste\u2014A versatile tool for small volume production. Proceedings of the International Symposium on Microelectronics, San Diego, CA, USA.","DOI":"10.4071\/isom-WA31"},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"422","DOI":"10.1007\/s11633-007-0422-8","article-title":"Modeling and control of time-pressure dispensing for semiconductor manufacturing","volume":"4","author":"Chen","year":"2007","journal-title":"Int. J. Autom. Comput."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"300","DOI":"10.1109\/6104.895075","article-title":"Modeling of time-pressure fluid dispensing processes","volume":"23","author":"Chen","year":"2000","journal-title":"IEEE Trans. Electr. Packag. Manuf."},{"key":"ref_5","doi-asserted-by":"crossref","unstructured":"Peng, J., and Guiling, D. (2007, January 26\u201328). Numerical simulations of 3d flow in the archimedes pump and analysis of its influence on dispensing quality. Proceedings of the International Symposium on High Density packaging and Microsystem Integration, HDP\u201907, Shanghai, China.","DOI":"10.1109\/HDP.2007.4283608"},{"key":"ref_6","first-page":"10","article-title":"Advancements in solder paste dispensing","volume":"22","author":"Ashley","year":"2008","journal-title":"Smt Surf. Mount Technol."},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"41208-1","DOI":"10.2352\/J.ImagingSci.Technol.2009.53.4.041208","article-title":"Links between ink rheology, drop-on-demand jet formation, and printability","volume":"53","author":"Hutchings","year":"2009","journal-title":"J. Imag. Sci. Technol."},{"key":"ref_8","doi-asserted-by":"crossref","first-page":"100605","DOI":"10.1063\/1.1921249","article-title":"Droplet formation and ejection from a micromachined ultrasonic droplet generator: Visualization and scaling","volume":"17","author":"Meacham","year":"2005","journal-title":"Phys. Fluids"},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"49","DOI":"10.3390\/mi4010049","article-title":"Enhanced liquid metal micro droplet generation by pneumatic actuation based on the starjet method","volume":"4","author":"Lass","year":"2013","journal-title":"Micromachines"},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"1526","DOI":"10.3390\/mi6101436","article-title":"Observation and manipulation of a capillary jet in a centrifuge-based droplet shooting device","volume":"6","author":"Maeda","year":"2015","journal-title":"Micromachines"},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"49","DOI":"10.2217\/17460751.3.1.49","article-title":"Advanced jet protocols for directly engineering living cells: A genesis to alternative biohandling approaches for the life sciences","volume":"3","author":"Jayasinghe","year":"2008","journal-title":"Regen. Med."},{"key":"ref_12","doi-asserted-by":"crossref","first-page":"622","DOI":"10.1002\/biot.200700031","article-title":"Bio-electrosprays: A novel electrified jetting methodology for the safe handling and deployment of primary living organisms","volume":"2","author":"Irvine","year":"2007","journal-title":"Biotechnol. J."},{"key":"ref_13","unstructured":"Pierik, A. (2011). Advanced Microarray Technologies for Clinical Diagnostics, Technische Universiteit Eindhoven."},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"129","DOI":"10.1108\/13552541211212113","article-title":"Integrating stereolithography and direct print technologies for 3d structural electronics fabrication","volume":"18","author":"MacDonald","year":"2012","journal-title":"Rapid Prototyp. J."},{"key":"ref_15","doi-asserted-by":"crossref","first-page":"327","DOI":"10.1080\/10893950490516884","article-title":"Ink jet processing of metallic nanoparticle suspensions for electronic circuitry fabrication","volume":"8","author":"Szczech","year":"2004","journal-title":"Microscale Thermophys. Eng."},{"key":"ref_16","unstructured":"Nico, C. (2013, January 14\u201317). Jetting solder paste opens up new possibilities in your SMT production. Proceedings of the ICSR (Soldering and Reliability) Conference Proceedings, Toronto, ON, Canada."},{"key":"ref_17","first-page":"36","article-title":"Dispensing-solder paste jetting: A broadband solution","volume":"28","author":"Mohanty","year":"2011","journal-title":"Print. Circuit Des. Fab-Circuits Assem."},{"key":"ref_18","unstructured":"Holm, W., Nilsson, K., Berg, J., Kronstedt, J., and Sandell, H. (2012). Jetting Device and Method at a Jetting Device. (8,215,535), U.S. Patent."},{"key":"ref_19","doi-asserted-by":"crossref","first-page":"105023","DOI":"10.1088\/0964-1726\/24\/10\/105023","article-title":"Nozzle and needle during high viscosity adhesive jetting based on piezoelectric jet dispensing","volume":"24","author":"Lu","year":"2015","journal-title":"Smart Mater. Struct."},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"015033","DOI":"10.1088\/0964-1726\/17\/01\/015033","article-title":"A new type of piezostack-driven jetting dispenser for semiconductor electronic packaging: Modeling and control","volume":"17","author":"Nguyen","year":"2008","journal-title":"Smart Mater. Struct."},{"key":"ref_21","doi-asserted-by":"crossref","first-page":"182","DOI":"10.1007\/s11431-009-0329-4","article-title":"Experimental study on high viscosity fluid micro-droplet jetting system","volume":"53","author":"Shu","year":"2010","journal-title":"Sci. China Ser. E Technol. Sci."},{"key":"ref_22","doi-asserted-by":"crossref","first-page":"53","DOI":"10.1080\/01694243.2013.827091","article-title":"Simulation and experiment study on adhesive ejection behavior in jetting dispenser","volume":"28","author":"Wang","year":"2014","journal-title":"J. Adhes. Sci. Technol."}],"container-title":["Micromachines"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/2072-666X\/7\/7\/112\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T19:25:13Z","timestamp":1760210713000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/2072-666X\/7\/7\/112"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,6,30]]},"references-count":22,"journal-issue":{"issue":"7","published-online":{"date-parts":[[2016,7]]}},"alternative-id":["mi7070112"],"URL":"https:\/\/doi.org\/10.3390\/mi7070112","relation":{},"ISSN":["2072-666X"],"issn-type":[{"value":"2072-666X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2016,6,30]]}}}