{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,12]],"date-time":"2025-10-12T04:38:54Z","timestamp":1760243934974,"version":"build-2065373602"},"reference-count":37,"publisher":"MDPI AG","issue":"8","license":[{"start":{"date-parts":[[2010,8,10]],"date-time":"2010-08-10T00:00:00Z","timestamp":1281398400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/3.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>By combining a number of simple transducer modules, an arbitrarily complex sensing system may be produced to accommodate a wide range of applications. This work outlines a novel software architecture and knowledge representation scheme that has been developed to support this type of flexible and reconfigurable modular sensing system. Template algorithms are used to embed intelligence within each module. As modules are added or removed, the composite sensor is able to automatically determine its overall geometry and assume an appropriate collective identity. A virtual machine-based middleware layer runs on top of a real-time operating system with a pre-emptive kernel, enabling platform-independent template algorithms to be written once and run on any module, irrespective of its underlying hardware architecture. Applications that may benefit from easily reconfigurable modular sensing systems include flexible inspection, mobile robotics, surveillance, and space exploration.<\/jats:p>","DOI":"10.3390\/s100807514","type":"journal-article","created":{"date-parts":[[2010,8,10]],"date-time":"2010-08-10T11:31:12Z","timestamp":1281439872000},"page":"7514-7560","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":4,"title":["A Software Architecture for Adaptive Modular Sensing Systems"],"prefix":"10.3390","volume":"10","author":[{"given":"Andrew C.","family":"Lyle","sequence":"first","affiliation":[{"name":"Sensing and Mechatronic Systems Laboratory, Department of Mechanical and Materials Engineering, The University of Western Ontario, London, Ontario, N6A 5B9, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Michael D.","family":"Naish","sequence":"additional","affiliation":[{"name":"Sensing and Mechatronic Systems Laboratory, Department of Mechanical and Materials Engineering, The University of Western Ontario, London, Ontario, N6A 5B9, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2010,8,10]]},"reference":[{"key":"ref_1","first-page":"82","article-title":"Cramming more components onto integrated circuits","volume":"38","author":"Moore","year":"1965","journal-title":"Electronics"},{"key":"ref_2","unstructured":"Henderson, T, Hansen, C, and Bhanu, B (, January August). 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