{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,2]],"date-time":"2026-03-02T12:47:46Z","timestamp":1772455666066,"version":"3.50.1"},"reference-count":27,"publisher":"MDPI AG","issue":"12","license":[{"start":{"date-parts":[[2010,12,8]],"date-time":"2010-12-08T00:00:00Z","timestamp":1291766400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/3.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>We present a multisensor designed for industrial compressed air diagnostics and combining the measurement of pressure, flow, and temperature, integrated with the corresponding signal conditioning electronics in a single low-temperature co-fired ceramic (LTCC) package. The developed sensor may be soldered onto an integrated electro-fluidic platform by using standard surface mount device (SMD) technology, e.g., as a standard electronic component would be on a printed circuit board, obviating the need for both wires and tubes and thus paving the road towards low-cost integrated electro-fluidic systems. Several performance aspects of this device are presented and discussed, together with electronics design issues.<\/jats:p>","DOI":"10.3390\/s101211156","type":"journal-article","created":{"date-parts":[[2010,12,8]],"date-time":"2010-12-08T10:18:36Z","timestamp":1291803516000},"page":"11156-11173","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":30,"title":["Integrated LTCC Pressure\/Flow\/Temperature Multisensor for Compressed Air Diagnostics\u2020"],"prefix":"10.3390","volume":"10","author":[{"given":"Yannick","family":"Fournier","sequence":"first","affiliation":[{"name":"Laboratoire de Production Microtechnique (LPM), \u00c9cole Polytechnique F\u00e9d\u00e9rale de Lausanne (EPFL), Station 17, CH-1015 Lausanne, Switzerland"}]},{"given":"Thomas","family":"Maeder","sequence":"additional","affiliation":[{"name":"Laboratoire de Production Microtechnique (LPM), \u00c9cole Polytechnique F\u00e9d\u00e9rale de Lausanne (EPFL), Station 17, CH-1015 Lausanne, Switzerland"}]},{"given":"Gr\u00e9goire","family":"Boutinard-Rouelle","sequence":"additional","affiliation":[{"name":"Laboratoire de Production Microtechnique (LPM), \u00c9cole Polytechnique F\u00e9d\u00e9rale de Lausanne (EPFL), Station 17, CH-1015 Lausanne, Switzerland"}]},{"given":"Aur\u00e9lie","family":"Barras","sequence":"additional","affiliation":[{"name":"Laboratoire de Production Microtechnique (LPM), \u00c9cole Polytechnique F\u00e9d\u00e9rale de Lausanne (EPFL), Station 17, CH-1015 Lausanne, Switzerland"}]},{"given":"Nicolas","family":"Craquelin","sequence":"additional","affiliation":[{"name":"Laboratoire de Production Microtechnique (LPM), \u00c9cole Polytechnique F\u00e9d\u00e9rale de Lausanne (EPFL), Station 17, CH-1015 Lausanne, Switzerland"}]},{"given":"Peter","family":"Ryser","sequence":"additional","affiliation":[{"name":"Laboratoire de Production Microtechnique (LPM), \u00c9cole Polytechnique F\u00e9d\u00e9rale de Lausanne (EPFL), Station 17, CH-1015 Lausanne, Switzerland"}]}],"member":"1968","published-online":{"date-parts":[[2010,12,8]]},"reference":[{"key":"ref_1","unstructured":"Fournier, Y, Boutinard Rouelle, G, Craquelin, N, Maeder, T, and Ryser, P SMD pressure and flow sensor for compressed air in LTCC technology with integrated electronics. Lausanne, Switzerland."},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"222","DOI":"10.1016\/S0924-4247(00)00554-9","article-title":"Overview of low temperature co-fired ceramics tape technology for meso-system technology (MsST)","volume":"89","year":"2001","journal-title":"Sens Actuat A-Phys"},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"345","DOI":"10.1111\/j.1744-7402.2005.02039.x","article-title":"Novel microsystem applications with new techniques in low-temperature co-fired ceramics","volume":"2","author":"Peterson","year":"2005","journal-title":"Int J Appl Ceram Tec"},{"key":"ref_4","unstructured":"Hrovat, M, Belavi\u010d, D, Ur\u0161i\u010d, H, Kita, J, Holc, J, Drnov\u0161ek, S, Cilen\u0161ek, J, Zarnik, MS, and Kosec, M Thick-film pressure\/force sensors on different LTCC substrates; a characterization and evaluation. Denver, CO, USA. paper WA13."},{"key":"ref_5","unstructured":"Moos, R, and Kita, J Ceramic multilayer gas sensors\u2013\u2013an overview. Krasiczyn, Poland."},{"key":"ref_6","unstructured":"Moll, AJ Microsystems and microfluidics: why not LTCC?. Denver, CO, USA. paper KN2."},{"key":"ref_7","unstructured":"Partsch, U, Gebhardt, S, Arndt, D, Georgi, H, Neubert, H, Fleischer, D, and Gruchow, M LTCC-Based Sensors for Mechanical Quantities. Oulu, Finland."},{"key":"ref_8","first-page":"677","article-title":"Sensors and packages based on LTCC and thick-film technology for severe conditions","volume":"34","author":"Jacq","year":"2009","journal-title":"Sadhana Acad Proc Eng Sci"},{"key":"ref_9","unstructured":"Golonka, LJ LTCC microreactors. Krakow, Poland."},{"key":"ref_10","unstructured":"Maeder, T, Fournier, Y, Wiedmer, S, Birol, H, Jacq, C, and Ryser, P 3D structuration of LTCC\/thick-film sensors and fluidic devices. Denver, CO, USA. paper THA13."},{"key":"ref_11","unstructured":"Dr\u00fce, KJ, Hintz, M, M\u00fcller, J, Perrone, R, and Rentsch, S Standard- and non-standard applications of LTCC-developments and progresses. Krasiczyn, Poland."},{"key":"ref_12","unstructured":"Zimmerman, DW, Fairchild, MR, Brunner, KW, and Berlin, CW Utilizing an LTCC substrate in an under-hood engine control application. Denver, CO, USA. paper TA22."},{"key":"ref_13","unstructured":"Nishigaki, S, Goebel, U, and Roethlingshoefer, W LTCC (LFC) material systems and its application in automotive ECU\u2019s. Denver, CO, USA. paper WP32."},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"323","DOI":"10.1146\/annurev.ms.17.080187.001543","article-title":"Ceramic substrates for microelectronic packaging","volume":"17","author":"Chowdhry","year":"1987","journal-title":"Ann Rev Mat Sci"},{"key":"ref_15","first-page":"752","article-title":"Ceramics in microelectronic packaging","volume":"67","author":"Tummala","year":"1988","journal-title":"Am Ceram Soc Bull"},{"key":"ref_16","unstructured":"Annas, S Advances in low temperature co-fired ceramic (LTCC) for ever increasing microelectronic applications. New Orleans, LA, USA."},{"key":"ref_17","unstructured":"Kita, J, Rettig, F, Moos, R, Dr\u00fce, K-H, and Thust, H Hot-Plate Gas Sensors - are Ceramics Better?. Baltimore, MD, USA. paper WP13."},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"215","DOI":"10.1016\/S0924-4247(98)00238-6","article-title":"The utilization of low temperature co-fired ceramics (LTCC-ML) technology for meso-scale EMS, a simple thermistor based flow sensor","volume":"73","author":"Moffett","year":"1999","journal-title":"Sens Actuat"},{"key":"ref_19","unstructured":"Partsch, U, Arndt, D, and Georgi, H A new concept for LTCC-based pressure sensors. Denver, CO, USA. paper THA23."},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"334","DOI":"10.1016\/j.sna.2006.05.025","article-title":"Fabrication of a Millinewton Force Sensor Using Low Temperature Co-fired Ceramic (LTCC) Technology","volume":"134","author":"Birol","year":"2007","journal-title":"Sens Actuat A: Phys"},{"key":"ref_21","unstructured":"Craquelin, N, Maeder, T, Fournier, Y, and Ryser, P Low-cost LTCC-based sensors for low force ranges. Lausanne, Switzerland."},{"key":"ref_22","doi-asserted-by":"crossref","first-page":"39","DOI":"10.1039\/b109587k","article-title":"A ceramic electrochemical microreactor for the methoxylation of methyl-2-furoate with direct mass spectrometry coupling","volume":"2","author":"Mengeaud","year":"2002","journal-title":"Lab On A Chip"},{"key":"ref_23","unstructured":"Fournier, Y, Willigens, R, Maeder, T, and Ryser, P Integrated LTCC micro-fluidic modules\u2013\u2013an SMT flow sensor. Bruges, Belgium. paper P206,."},{"key":"ref_24","unstructured":"Fournier, Y, Barras, A, Boutinard Rouelle, G, Maeder, T, and Ryser, P SMD pressure and flow sensors for industrial compressed air in LTCC technology. Rimini, Italy. paper 17-S3-8."},{"key":"ref_25","doi-asserted-by":"crossref","unstructured":"Birol, H, Maeder, T, and Ryser, P (2006). Modification of Thick-film Conductors Used in IP Technology for Reduction of Warpage during Co-firing of LTCC (Low Temperature Co-fired Ceramic) Modules. Key Eng Mat, 746\u2013749. High Performance Ceramics IV.","DOI":"10.4028\/0-87849-410-3.746"},{"key":"ref_26","unstructured":"Fournier, Y, Bieri, L-S, Maeder, T, and Ryser, P Influence of lamination parameters on LTCC shrinkage under unconstrained sintering. Terme \u010cate\u017e, Slovenia."},{"key":"ref_27","doi-asserted-by":"crossref","first-page":"54","DOI":"10.4071\/1551-4897-6.1.54","article-title":"Effects of silver paste application on embedded channels in low temperature co-fired ceramics","volume":"6","author":"Kellis","year":"2009","journal-title":"J Microelectron Electron Packag"}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/10\/12\/11156\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T22:04:02Z","timestamp":1760220242000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/10\/12\/11156"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,12,8]]},"references-count":27,"journal-issue":{"issue":"12","published-online":{"date-parts":[[2010,12]]}},"alternative-id":["s101211156"],"URL":"https:\/\/doi.org\/10.3390\/s101211156","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2010,12,8]]}}}