{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,12]],"date-time":"2025-10-12T04:37:06Z","timestamp":1760243826972,"version":"build-2065373602"},"reference-count":14,"publisher":"MDPI AG","issue":"6","license":[{"start":{"date-parts":[[2011,6,10]],"date-time":"2011-06-10T00:00:00Z","timestamp":1307664000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/3.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>This study reports a CMOS-MEMS condenser microphone implemented using the standard thin film stacking of 0.35 \u03bcm UMC CMOS 3.3\/5.0 V logic process, and followed by post-CMOS micromachining steps without introducing any special materials. The corrugated diaphragm for the microphone is designed and implemented using the metal layer to reduce the influence of thin film residual stresses. Moreover, a silicon substrate is employed to increase the stiffness of the back-plate. Measurements show the sensitivity of microphone is \u221242 \u00b1 3 dBV\/Pa at 1 kHz (the reference sound-level is 94 dB) under 6 V pumping voltage, the frequency response is 100 Hz\u201310 kHz, and the S\/N ratio &gt;55 dB. It also has low power consumption of less than 200 \u03bcA, and low distortion of less than 1% (referred to 100 dB).<\/jats:p>","DOI":"10.3390\/s110606257","type":"journal-article","created":{"date-parts":[[2011,6,10]],"date-time":"2011-06-10T12:35:40Z","timestamp":1307709340000},"page":"6257-6269","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":38,"title":["Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate"],"prefix":"10.3390","volume":"11","author":[{"given":"Chien-Hsin","family":"Huang","sequence":"first","affiliation":[{"name":"Department of Power Mechanical Engineering, National Tsing Hua University (NTHU), Hsinchu 30013, Taiwan"},{"name":"Department of Microelectromechanical Systems, United Microelectronics Corporation (UMC), Hsinchu 30078, Taiwan"}]},{"given":"Chien-Hsing","family":"Lee","sequence":"additional","affiliation":[{"name":"Department of Device Development, Solid State System Corporation (3S), Hsinchu 30288, Taiwan"}]},{"given":"Tsung-Min","family":"Hsieh","sequence":"additional","affiliation":[{"name":"Department of Device Development, Solid State System Corporation (3S), Hsinchu 30288, Taiwan"}]},{"given":"Li-Chi","family":"Tsao","sequence":"additional","affiliation":[{"name":"Department of Device Development, Solid State System Corporation (3S), Hsinchu 30288, Taiwan"}]},{"given":"Shaoyi","family":"Wu","sequence":"additional","affiliation":[{"name":"Department of Device Development, Solid State System Corporation (3S), Hsinchu 30288, Taiwan"}]},{"given":"Jhyy-Cheng","family":"Liou","sequence":"additional","affiliation":[{"name":"Department of Device Development, Solid State System Corporation (3S), Hsinchu 30288, Taiwan"}]},{"given":"Ming-Yi","family":"Wang","sequence":"additional","affiliation":[{"name":"Department of Microelectromechanical Systems, United Microelectronics Corporation (UMC), Hsinchu 30078, Taiwan"}]},{"given":"Li-Che","family":"Chen","sequence":"additional","affiliation":[{"name":"Department of Microelectromechanical Systems, United Microelectronics Corporation (UMC), Hsinchu 30078, Taiwan"}]},{"given":"Ming-Chuen","family":"Yip","sequence":"additional","affiliation":[{"name":"Department of Power Mechanical Engineering, National Tsing Hua University (NTHU), Hsinchu 30013, Taiwan"}]},{"given":"Weileun","family":"Fang","sequence":"additional","affiliation":[{"name":"Department of Power Mechanical Engineering, National Tsing Hua University (NTHU), Hsinchu 30013, Taiwan"}]}],"member":"1968","published-online":{"date-parts":[[2011,6,10]]},"reference":[{"key":"ref_1","unstructured":"Weigold, JW, Brosnihan, TJ, Bergeron, J, and Zhang, X (2006, January 22\u201326). A MEMS Condenser Microphone for Consumer Applications. Estambul, Turkey."},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1016\/0924-4247(94)00790-X","article-title":"A review of silicon microphones","volume":"44","author":"Scheeper","year":"1994","journal-title":"Sens. Actuat. A"},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"29","DOI":"10.1016\/j.sna.2008.09.017","article-title":"Design and fabrication of a new MEMS capacitive microphone using a perforated aluminum diaphragm","volume":"149","author":"Ganji","year":"2009","journal-title":"Sens. Actuat. A"},{"key":"ref_4","unstructured":"Loeppert, PV, and Lee, SB (, January June). SiSonicTM\u2013The first commercialized MEMS microphone. Hilton Head Island, SC, USA."},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"175","DOI":"10.1016\/S0924-4247(01)00728-2","article-title":"CMOS-MEMS membrane for audio-frequency acoustic actuation","volume":"95","author":"Neumann","year":"2002","journal-title":"Sens. Actuat. A"},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"36","DOI":"10.1109\/84.285722","article-title":"The design, fabrication, and testing of corrugated silicon nitride diaphragms","volume":"3","author":"Scheeper","year":"1994","journal-title":"J. Microelectromech. Syst"},{"key":"ref_7","unstructured":"Van Mullem, CJ, Gabriel, KJ, and Fujita, H (1991, January 24\u201328). Large Deflection Performance of Surface Micromachined Corrugated Diaphragms. San Francisco, CA."},{"key":"ref_8","unstructured":"Chen, J, Liu, L, Li, Z, Tan, Z, Xu, Y, and Ma, J (2002, January 20\u201324). Single-Chip Condenser Miniature Microphone with High Sensitive Circular Corrugated Diaphragm. 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Theoretical Acoustics, McGraw-Hill."},{"key":"ref_12","doi-asserted-by":"crossref","first-page":"084509","DOI":"10.1063\/1.3000038","article-title":"Acoustic analysis and fabrication of microelectromechanical condenser microphones","volume":"104","author":"Her","year":"2008","journal-title":"J Appl Phys"},{"key":"ref_13","doi-asserted-by":"crossref","first-page":"93","DOI":"10.1109\/84.993443","article-title":"Post-CMOS processing for high-aspect-ratio integrated silicon microstructures","volume":"11","author":"Xie","year":"2002","journal-title":"J. Microelectromech. Syst"},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"535","DOI":"10.1088\/0960-1317\/15\/3\/014","article-title":"Design and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE, and bulk silicon etching processes","volume":"15","author":"Wu","year":"2005","journal-title":"J. Micromech. Microeng"}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/11\/6\/6257\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T21:56:22Z","timestamp":1760219782000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/11\/6\/6257"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,6,10]]},"references-count":14,"journal-issue":{"issue":"6","published-online":{"date-parts":[[2011,6]]}},"alternative-id":["s110606257"],"URL":"https:\/\/doi.org\/10.3390\/s110606257","relation":{},"ISSN":["1424-8220"],"issn-type":[{"type":"electronic","value":"1424-8220"}],"subject":[],"published":{"date-parts":[[2011,6,10]]}}}