{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,12]],"date-time":"2025-10-12T04:30:06Z","timestamp":1760243406805,"version":"build-2065373602"},"reference-count":27,"publisher":"MDPI AG","issue":"1","license":[{"start":{"date-parts":[[2013,1,16]],"date-time":"2013-01-16T00:00:00Z","timestamp":1358294400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/3.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>We report a newly developed design\/fabrication module with low-cost  single-sided \u201clow-stress-silicon-nitride (LS-SiN)\/polysilicon (poly-Si)\/Al\u201d process for monolithic integration of composite sensors for sensing-network-node applications.  A front-side surface-\/bulk-micromachining process on a conventional Si-substrate is developed, featuring a multifunctional SiN\/poly-Si\/Al layer design for diverse sensing functions. The first \u201cpressure + acceleration + temperature + infrared\u201d (PATIR) composite sensor with the chip size of 2.5 mm \u00d7 2.5 mm is demonstrated. Systematic theoretical design and analysis methods are developed. The diverse sensing components include a piezoresistive absolute-pressure sensor (up to 700 kPa, with a sensitivity of 49 mV\/MPa under 3.3 V supplied voltage), a piezoresistive accelerometer (\u00b110 g, with a sensitivity of 66 \u03bcV\/g under 3.3 V and a \u22123 dB bandwidth of 780 Hz), a thermoelectric infrared  detector (with a responsivity of 45 V\/W and detectivity of 3.6 \u00d7 107 cm\u00b7Hz1\/2\/W) and a  thermistor (\u221225\u2013120 \u00b0C). This design\/fabrication module concept enables a low-cost monolithically-integrated \u201cmultifunctional-library\u201d technique. It can be utilized as a customizable tool for versatile application-specific requirements, which is very useful for small-size, low-cost, large-scale sensing-network node developments.<\/jats:p>","DOI":"10.3390\/s130101085","type":"journal-article","created":{"date-parts":[[2013,1,16]],"date-time":"2013-01-16T11:20:29Z","timestamp":1358335229000},"page":"1085-1101","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":9,"title":["Monolithic Composite \u201cPressure + Acceleration + Temperature + Infrared\u201d Sensor Using a Versatile Single-Sided \u201cSiN\/Poly-Si\/Al\u201d Process-Module"],"prefix":"10.3390","volume":"13","author":[{"given":"Zao","family":"Ni","sequence":"first","affiliation":[{"name":"State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 865 Changning Road, Shanghai 200050, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chen","family":"Yang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 865 Changning Road, Shanghai 200050, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dehui","family":"Xu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 865 Changning Road, Shanghai 200050, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hong","family":"Zhou","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 865 Changning Road, Shanghai 200050, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei","family":"Zhou","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 865 Changning Road, Shanghai 200050, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tie","family":"Li","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 865 Changning Road, Shanghai 200050, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bin","family":"Xiong","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 865 Changning Road, Shanghai 200050, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xinxin","family":"Li","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 865 Changning Road, Shanghai 200050, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2013,1,16]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"713","DOI":"10.1126\/science.1120034","article-title":"Environmental monitoring by wireless communication networks","volume":"312","author":"Hagit","year":"2006","journal-title":"Science"},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"53","DOI":"10.1038\/scientificamerican0604-84","article-title":"Smart sensors to network the world","volume":"290","author":"Culler","year":"2004","journal-title":"Sci. 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Mech. Sci. Tech."}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/13\/1\/1085\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T21:44:20Z","timestamp":1760219060000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/13\/1\/1085"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,1,16]]},"references-count":27,"journal-issue":{"issue":"1","published-online":{"date-parts":[[2013,1]]}},"alternative-id":["s130101085"],"URL":"https:\/\/doi.org\/10.3390\/s130101085","relation":{},"ISSN":["1424-8220"],"issn-type":[{"type":"electronic","value":"1424-8220"}],"subject":[],"published":{"date-parts":[[2013,1,16]]}}}