{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,3]],"date-time":"2026-06-03T18:39:12Z","timestamp":1780511952972,"version":"3.54.1"},"reference-count":16,"publisher":"MDPI AG","issue":"2","license":[{"start":{"date-parts":[[2014,1,30]],"date-time":"2014-01-30T00:00:00Z","timestamp":1391040000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/3.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>In response to the growing demand for in situ measurement of pressure in  high-temperature environments, a high temperature capacitive pressure sensor is presented in this paper. A high-temperature ceramic material-alumina is used for the fabrication of the sensor, and the prototype sensor consists of an inductance, a variable capacitance, and a sealed cavity integrated in the alumina ceramic substrate using a thick-film integrated technology. The experimental results show that the proposed sensor has stability at 850 \u00b0C for more than 20 min. The characterization in high-temperature and pressure environments successfully demonstrated sensing capabilities for pressure from 1 to 5 bar up to 600 \u00b0C, limited by the sensor test setup. At 600 \u00b0C, the sensor achieves a linear characteristic response, and the repeatability error, hysteresis error and zero-point drift of the sensor are 8.3%, 5.05% and 1%, respectively.<\/jats:p>","DOI":"10.3390\/s140202417","type":"journal-article","created":{"date-parts":[[2014,1,30]],"date-time":"2014-01-30T12:05:16Z","timestamp":1391083516000},"page":"2417-2430","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":43,"title":["A High Temperature Capacitive Pressure Sensor Based on Alumina Ceramic for in Situ Measurement at 600 \u00b0C"],"prefix":"10.3390","volume":"14","author":[{"given":"Qiulin","family":"Tan","sequence":"first","affiliation":[{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China"},{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chen","family":"Li","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China"},{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jijun","family":"Xiong","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China"},{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Pinggang","family":"Jia","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China"},{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1762-9246","authenticated-orcid":false,"given":"Wendong","family":"Zhang","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China"},{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jun","family":"Liu","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China"},{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chenyang","family":"Xue","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China"},{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yingping","family":"Hong","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China"},{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhong","family":"Ren","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China"},{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tao","family":"Luo","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China"},{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2014,1,30]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"164","DOI":"10.1109\/TEPM.2004.843109","article-title":"The changing automotive environment: High-temperature electronics","volume":"27","author":"Johnson","year":"2004","journal-title":"IEEE Trans. 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Soc."}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/14\/2\/2417\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T21:07:54Z","timestamp":1760216874000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/14\/2\/2417"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,1,30]]},"references-count":16,"journal-issue":{"issue":"2","published-online":{"date-parts":[[2014,2]]}},"alternative-id":["s140202417"],"URL":"https:\/\/doi.org\/10.3390\/s140202417","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2014,1,30]]}}}