{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,14]],"date-time":"2026-03-14T18:03:04Z","timestamp":1773511384094,"version":"3.50.1"},"reference-count":20,"publisher":"MDPI AG","issue":"3","license":[{"start":{"date-parts":[[2014,3,4]],"date-time":"2014-03-04T00:00:00Z","timestamp":1393891200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/3.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>An active thermal compensation system for a low temperature-bias-drift (TBD) MEMS-based gyroscope is proposed in this study. First, a micro-gyroscope is fabricated by a high-aspect-ratio silicon-on-glass (SOG) process and vacuum packaged by glass frit bonding. Moreover, a drive\/readout ASIC, implemented by the 0.25 \u00b5m 1P5M standard CMOS process, is designed and integrated with the gyroscope by directly wire bonding. Then, since the temperature effect is one of the critical issues in the high performance gyroscope applications, the temperature-dependent characteristics of the micro-gyroscope are discussed. Furthermore, to compensate the TBD of the micro-gyroscope, a thermal compensation system is proposed and integrated in the aforementioned ASIC to actively tune the parameters in the digital trimming mechanism, which is designed in the  readout ASIC. Finally, some experimental results demonstrate that the TBD of the  micro-gyroscope can be compensated effectively by the proposed compensation system.<\/jats:p>","DOI":"10.3390\/s140304290","type":"journal-article","created":{"date-parts":[[2014,3,4]],"date-time":"2014-03-04T11:26:24Z","timestamp":1393932384000},"page":"4290-4311","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":17,"title":["An Integrated Thermal Compensation System for MEMS  Inertial Sensors"],"prefix":"10.3390","volume":"14","author":[{"given":"Sheng-Ren","family":"Chiu","sequence":"first","affiliation":[{"name":"Microsystems Technology Center, Industrial Technology Research Institute, Tainan 709, Taiwan"},{"name":"Institute of Microelectronics and Department of Electrical Engineering, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 701, Taiwan"}]},{"given":"Li-Tao","family":"Teng","sequence":"additional","affiliation":[{"name":"Microsystems Technology Center, Industrial Technology Research Institute, Tainan 709, Taiwan"}]},{"given":"Jen-Wei","family":"Chao","sequence":"additional","affiliation":[{"name":"Microsystems Technology Center, Industrial Technology Research Institute, Tainan 709, Taiwan"}]},{"given":"Chung-Yang","family":"Sue","sequence":"additional","affiliation":[{"name":"Microsystems Technology Center, Industrial Technology Research Institute, Tainan 709, Taiwan"}]},{"given":"Chih-Hsiou","family":"Lin","sequence":"additional","affiliation":[{"name":"Microsystems Technology Center, Industrial Technology Research Institute, Tainan 709, Taiwan"}]},{"given":"Hong-Ren","family":"Chen","sequence":"additional","affiliation":[{"name":"Microsystems Technology Center, Industrial Technology Research Institute, Tainan 709, Taiwan"}]},{"given":"Yan-Kuin","family":"Su","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics and Department of Electrical Engineering, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 701, Taiwan"},{"name":"Department of Electronic Engineering, Kun-Shan University, Tainan 710, Taiwan"}]}],"member":"1968","published-online":{"date-parts":[[2014,3,4]]},"reference":[{"key":"ref_1","first-page":"1058","article-title":"Micromachined inertial sensors for vehicles","volume":"1","author":"Barbour","year":"1997","journal-title":"IEEE Confer. 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