{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,2]],"date-time":"2026-07-02T20:31:32Z","timestamp":1783024292147,"version":"3.54.6"},"reference-count":15,"publisher":"MDPI AG","issue":"11","license":[{"start":{"date-parts":[[2014,10,30]],"date-time":"2014-10-30T00:00:00Z","timestamp":1414627200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100012149","name":"National Key Scientific Instrument and Equipment Development Projects of China","doi-asserted-by":"publisher","award":["2014YQ090709"],"award-info":[{"award-number":["2014YQ090709"]}],"id":[{"id":"10.13039\/501100012149","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>For the dimensional measurement and characterization of microsized and nanosized components, a three-dimensional microdisplacement sensing system was developed using the piezoresistive effect in silicon. The sensor was fabricated using microelectromechanical system bulk-silicon technology, and it was validated using the finite element method. A precise data acquisition circuit with an accuracy of 20 \u03bcV was designed to obtain weak voltage signals. By calibration, the sensing system was shown to have a sensitivity of  17.29 mV\/\u03bcm and 4.59 mV\/\u03bcm in the axial and lateral directions, respectively; the nonlinearity in these directions was 0.8% and 1.0% full scale, respectively. A full range of 4.6 \u03bcm was achieved in the axial direction. Results of a resolution test indicated that the sensing system had a resolution of 5 nm in the axial direction and 10 nm in the lateral direction.<\/jats:p>","DOI":"10.3390\/s141120533","type":"journal-article","created":{"date-parts":[[2014,10,30]],"date-time":"2014-10-30T11:53:25Z","timestamp":1414670005000},"page":"20533-20542","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":5,"title":["A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology"],"prefix":"10.3390","volume":"14","author":[{"given":"Junjie","family":"Wu","sequence":"first","affiliation":[{"name":"School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University,  No. 800, Dongchuan Road, Shanghai 200240, China"},{"name":"Shanghai Institute of Measurement and Testing Technology, National Center of Measurement and Testing for East China, National Center of Testing Technology, No. 1500, Zhangheng Road, Shanghai 201203, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lihua","family":"Lei","sequence":"additional","affiliation":[{"name":"Shanghai Institute of Measurement and Testing Technology, National Center of Measurement and Testing for East China, National Center of Testing Technology, No. 1500, Zhangheng Road, Shanghai 201203, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xin","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University,  No. 800, Dongchuan Road, Shanghai 200240, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiaoyu","family":"Cai","sequence":"additional","affiliation":[{"name":"Shanghai Institute of Measurement and Testing Technology, National Center of Measurement and Testing for East China, National Center of Testing Technology, No. 1500, Zhangheng Road, Shanghai 201203, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yuan","family":"Li","sequence":"additional","affiliation":[{"name":"Shanghai Institute of Measurement and Testing Technology, National Center of Measurement and Testing for East China, National Center of Testing Technology, No. 1500, Zhangheng Road, Shanghai 201203, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tao","family":"Han","sequence":"additional","affiliation":[{"name":"School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University,  No. 800, Dongchuan Road, Shanghai 200240, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2014,10,30]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"228","DOI":"10.1016\/j.precisioneng.2010.09.010","article-title":"Aspects of tactile probing on the micro scale","volume":"35","author":"Bos","year":"2011","journal-title":"Precis. 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