{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,29]],"date-time":"2026-04-29T14:44:20Z","timestamp":1777473860072,"version":"3.51.4"},"reference-count":14,"publisher":"MDPI AG","issue":"12","license":[{"start":{"date-parts":[[2014,12,5]],"date-time":"2014-12-05T00:00:00Z","timestamp":1417737600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>An LC resonant pressure sensor with improved performance is presented in this paper. The sensor is designed with a buried structure, which protects the electrical components from contact with harsh environments and reduces the resonant-frequency drift of the sensor in high-temperature environments. The pressure-sensitive membrane of the sensor is optimized according to small-deflection-plate theory, which allows the sensor to operate in high-pressure environments. The sensor is fabricated using low-temperature co-fired ceramic (LTCC) technology, and a fugitive film is used to create a completed sealed embedded cavity without an evacuation channel. The experimental results show that the frequency drift of the sensor versus the temperature is approximately 0.75 kHz\/\u00b0C, and the responsivity of the sensor can be up to 31 kHz\/bar within the pressure range from atmospheric pressure to 60 bar.<\/jats:p>","DOI":"10.3390\/s141223337","type":"journal-article","created":{"date-parts":[[2014,12,5]],"date-time":"2014-12-05T10:20:05Z","timestamp":1417774805000},"page":"23337-23347","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":19,"title":["A High-Performance LC Wireless Passive Pressure  Sensor Fabricated Using Low-Temperature Co-Fired  Ceramic (LTCC) Technology"],"prefix":"10.3390","volume":"14","author":[{"given":"Chen","family":"Li","sequence":"first","affiliation":[{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education,  North University of China, Tai Yuan 030051, China"},{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qiulin","family":"Tan","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education,  North University of China, Tai Yuan 030051, China"},{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chenyang","family":"Xue","sequence":"additional","affiliation":[{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1762-9246","authenticated-orcid":false,"given":"Wendong","family":"Zhang","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education,  North University of China, Tai Yuan 030051, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yunzhi","family":"Li","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education,  North University of China, Tai Yuan 030051, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jijun","family":"Xiong","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education,  North University of China, Tai Yuan 030051, China"},{"name":"Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2014,12,5]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"164","DOI":"10.1109\/TEPM.2004.843109","article-title":"The changing automotive environment: High-temperature electronics","volume":"27","author":"Johnson","year":"2004","journal-title":"IEEE Trans. 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