{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,6]],"date-time":"2025-11-06T06:04:14Z","timestamp":1762409054237,"version":"build-2065373602"},"reference-count":34,"publisher":"MDPI AG","issue":"2","license":[{"start":{"date-parts":[[2015,1,22]],"date-time":"2015-01-22T00:00:00Z","timestamp":1421884800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>We present investigations on the impact of material-integrated sensors with the help of finite element-based modeling. A sensor (inlay) integrated with a material (matrix) is always a foreign body in the material, which can lead to a \u201cwound effect\u201d, that is degradation of the macroscopic behavior of a material. By analyzing the inlay\u2019s impact on the material in terms of mechanical load, heat conduction, stress during integration and other impacts of integration, this wound effect is analyzed. For the mechanical load, we found out that the inlay has to be at least as stretchable and bendable as the matrix. If there is a high thermal load during integration, the coefficients of the thermal expansion of the inlay have to be matched to the matrix. In the case of a high thermal load during operation, the inlay has to be as thin as possible or its thermal conductivity has to be adapted to the thermal conductivity of the matrix. To have a general view of things, the results are dimensionless and independent of the geometry. In each section, the results are illustrated by examples. Based on all of the results, we present our idea for the fabrication of future material-integrated sensors.<\/jats:p>","DOI":"10.3390\/s150202336","type":"journal-article","created":{"date-parts":[[2015,1,22]],"date-time":"2015-01-22T09:10:48Z","timestamp":1421917848000},"page":"2336-2353","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":13,"title":["Investigations on the Impact of Material-Integrated Sensors with the Help of FEM-Based Modeling"],"prefix":"10.3390","volume":"15","author":[{"given":"Gerrit","family":"Dumstorff","sequence":"first","affiliation":[{"name":"Institute of Microsensors, -Actuators, and -Systems, Microsystems Center Bremen, University of Bremen, 28359 Bremen, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Walter","family":"Lang","sequence":"additional","affiliation":[{"name":"Institute of Microsensors, -Actuators, and -Systems, Microsystems Center Bremen, University of Bremen, 28359 Bremen, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2015,1,22]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"291","DOI":"10.1177\/1045389X05050106","article-title":"Tuned Lamb wave excitation and detection with piezoelectric wafer active sensors for structural health monitoring","volume":"16","author":"Giurgiutiu","year":"2005","journal-title":"J. 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