{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,6]],"date-time":"2026-07-06T11:21:48Z","timestamp":1783336908168,"version":"3.54.6"},"reference-count":31,"publisher":"MDPI AG","issue":"3","license":[{"start":{"date-parts":[[2015,3,16]],"date-time":"2015-03-16T00:00:00Z","timestamp":1426464000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>A robust optimization approach for a MEMS accelerometer to minimize the effects of temperature variations is presented. The mathematical model of the accelerometer is built. The effects of temperature variations on the output performance of the accelerometer are determined, and thermal deformation of the accelerometer is analyzed. The deviations of the output capacitance and resonance frequency due to temperature fluctuations are calculated and discussed. The sensitivity analysis method is employed to determine the design variables for robust optimization and find out the key structural parameters that have most significant influence on the output capacitance and resonance frequency of the accelerometer. The mathematical model and procedure for the robust optimization of the accelerometer are proposed. The robust optimization problem is solved and discussed. The robust optimization results show that an optimized accelerometer with high sensitivity, high temperature robustness and decoupling structure is finally obtained.<\/jats:p>","DOI":"10.3390\/s150306342","type":"journal-article","created":{"date-parts":[[2015,3,16]],"date-time":"2015-03-16T11:17:39Z","timestamp":1426504659000},"page":"6342-6359","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":31,"title":["Robust Optimization of a MEMS Accelerometer Considering Temperature Variations"],"prefix":"10.3390","volume":"15","author":[{"given":"Guangjun","family":"Liu","sequence":"first","affiliation":[{"name":"School of Mechanical Engineering, Tongji University, Shanghai 200092, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Feng","family":"Yang","sequence":"additional","affiliation":[{"name":"School of Mechanical Engineering, Tongji University, Shanghai 200092, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiaofan","family":"Bao","sequence":"additional","affiliation":[{"name":"School of Mechanical Engineering, Tongji University, Shanghai 200092, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tao","family":"Jiang","sequence":"additional","affiliation":[{"name":"School of Mechanical Engineering, Tongji University, Shanghai 200092, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2015,3,16]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"383","DOI":"10.1016\/j.mejo.2005.07.005","article-title":"Simulation and optimization on the squeeze-film damping of a novel high-g accelerometer","volume":"37","author":"Yang","year":"2006","journal-title":"Microelectron. 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