{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,30]],"date-time":"2026-04-30T17:59:18Z","timestamp":1777571958451,"version":"3.51.4"},"reference-count":46,"publisher":"MDPI AG","issue":"7","license":[{"start":{"date-parts":[[2015,7,20]],"date-time":"2015-07-20T00:00:00Z","timestamp":1437350400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Most previous research into emotion recognition used either a single modality or multiple modalities of physiological signal. However, the former method allows for limited enhancement of accuracy, and the latter has the disadvantages that its performance can be affected by head or body movements. Further, the latter causes inconvenience to the user due to the sensors attached to the body. Among various emotions, the accurate evaluation of fear is crucial in many applications, such as criminal psychology, intelligent surveillance systems and the objective evaluation of horror movies. Therefore, we propose a new method for evaluating fear based on nonintrusive measurements obtained using multiple sensors. Experimental results based on the t-test, the effect size and the sum of all of the correlation values with other modalities showed that facial temperature and subjective evaluation are more reliable than electroencephalogram (EEG) and eye blinking rate for the evaluation of fear.<\/jats:p>","DOI":"10.3390\/s150717507","type":"journal-article","created":{"date-parts":[[2015,7,20]],"date-time":"2015-07-20T09:56:54Z","timestamp":1437386214000},"page":"17507-17533","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":25,"title":["Evaluation of Fear Using Nonintrusive Measurement of Multimodal Sensors"],"prefix":"10.3390","volume":"15","author":[{"given":"Jong-Suk","family":"Choi","sequence":"first","affiliation":[{"name":"Division of Electronics and Electrical Engineering, Dongguk University, 26 Pil-dong 3-ga, Jung-gu, Seoul 100-715, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jae","family":"Bang","sequence":"additional","affiliation":[{"name":"Division of Electronics and Electrical Engineering, Dongguk University, 26 Pil-dong 3-ga, Jung-gu, Seoul 100-715, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hwan","family":"Heo","sequence":"additional","affiliation":[{"name":"Division of Electronics and Electrical Engineering, Dongguk University, 26 Pil-dong 3-ga, Jung-gu, Seoul 100-715, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kang","family":"Park","sequence":"additional","affiliation":[{"name":"Division of Electronics and Electrical Engineering, Dongguk University, 26 Pil-dong 3-ga, Jung-gu, Seoul 100-715, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2015,7,20]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Kwon, D.-S., Kwak, Y.K., Park, J.C., Chung, M.J., Jee, E.-S., Park, K.-S., Kim, H.-R., Kim, Y.-M., Park, J.-C., and Kim, E.H. 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