{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,14]],"date-time":"2026-01-14T21:01:13Z","timestamp":1768424473312,"version":"3.49.0"},"reference-count":31,"publisher":"MDPI AG","issue":"9","license":[{"start":{"date-parts":[[2015,9,2]],"date-time":"2015-09-02T00:00:00Z","timestamp":1441152000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Scientific Research Foundation for the Returned Overseas Chinese Scholars, State Education Ministry","award":["the 46th"],"award-info":[{"award-number":["the 46th"]}]},{"name":"the Foundation of Key Laboratory of Micro-Inertial Instrument and Advanced Navigation Technology, Ministry of Education, China","award":["201401"],"award-info":[{"award-number":["201401"]}]},{"name":"Key Project of NSF of Jiangsu Province","award":["BE2012740"],"award-info":[{"award-number":["BE2012740"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz wafers with a thickness of 100 \u03bcm and 300 \u03bcm, respectively. The finite element method is used to simulate the vibration mode and optimize the sensing element structure. Taking advantage of self-alignment function of the flip chip bonding process, the two parts were precisely bonded at the desired joint position via AuSn solder. Experimental demonstrations were performed on a maximum scale of  4 \u00d7 8 mm2 chip, and high sensitivity up to 9.55 Hz\/g with a DETF resonator and a Q value of 5000 in air was achieved.<\/jats:p>","DOI":"10.3390\/s150922049","type":"journal-article","created":{"date-parts":[[2015,9,3]],"date-time":"2015-09-03T03:10:43Z","timestamp":1441249843000},"page":"22049-22059","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":22,"title":["Flip Chip Bonding of a Quartz MEMS-Based Vibrating  Beam Accelerometer"],"prefix":"10.3390","volume":"15","author":[{"given":"Jinxing","family":"Liang","sequence":"first","affiliation":[{"name":"Key Laboratory of Micro-Inertial Instrument and Advanced Navigation Technology,  Ministry of Education, School of Instrument Science and Engineering, Southeast University, Nanjing 210096, China"}]},{"given":"Liyuan","family":"Zhang","sequence":"additional","affiliation":[{"name":"Key Laboratory of Micro-Inertial Instrument and Advanced Navigation Technology,  Ministry of Education, School of Instrument Science and Engineering, Southeast University, Nanjing 210096, China"}]},{"given":"Ling","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Automation, Southeast University, Nanjing 210096, China"}]},{"given":"Yuan","family":"Dong","sequence":"additional","affiliation":[{"name":"Key Laboratory of Micro-Inertial Instrument and Advanced Navigation Technology,  Ministry of Education, School of Instrument Science and Engineering, Southeast University, Nanjing 210096, China"}]},{"given":"Toshitsugu","family":"Ueda","sequence":"additional","affiliation":[{"name":"Graduate School of Information, Production and Systems, Waseda University,  Kitakyushu 808-0135, Japan"}]}],"member":"1968","published-online":{"date-parts":[[2015,9,2]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"687","DOI":"10.3390\/s150100687","article-title":"A new Z-axis resonant micro-accelerometer based on electrostatic stiffness","volume":"15","author":"Yang","year":"2015","journal-title":"Sensors"},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"640","DOI":"10.1016\/j.proeng.2014.11.569","article-title":"A differential resonant micro accelerometer for out-of-plane measurements","volume":"87","author":"Caspani","year":"2014","journal-title":"Proced. 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