{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,14]],"date-time":"2026-01-14T16:54:27Z","timestamp":1768409667408,"version":"3.49.0"},"reference-count":23,"publisher":"MDPI AG","issue":"9","license":[{"start":{"date-parts":[[2015,9,8]],"date-time":"2015-09-08T00:00:00Z","timestamp":1441670400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>In this paper, a pressure sensor for low pressure detection (0.5 kPa\u201340 kPa) is proposed. In one structure (No. 1), the silicon membrane is partly etched to form a crossed beam on its top for stress concentration. An aluminum layer is also deposited as part of the beam. Four piezoresistors are fabricated. Two are located at the two ends of the beam. The other two are located at the membrane periphery. Four piezoresistors connect into a Wheatstone bridge. To demonstrate the stress concentrate effect of this structure, two other structures were designed and fabricated. One is a flat membrane structure (No. 2), the  other is a structure with the aluminum beam, but without etched silicon (No. 3). The measurement results of these three structures show that the No.1 structure has the highest sensitivity, which is about 3.8 times that of the No. 2 structure and 2.7 times that of the  No. 3 structure. They also show that the residual stress in the beam has some backside effect on the sensor performance.<\/jats:p>","DOI":"10.3390\/s150922692","type":"journal-article","created":{"date-parts":[[2015,9,8]],"date-time":"2015-09-08T11:59:54Z","timestamp":1441713594000},"page":"22692-22704","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":43,"title":["Design and Application of a High Sensitivity Piezoresistive Pressure Sensor for Low Pressure Conditions"],"prefix":"10.3390","volume":"15","author":[{"given":"Huiyang","family":"Yu","sequence":"first","affiliation":[{"name":"College of Computer Science and Technology, Nanjing Tech University, No.30, South Puzhu Road, Pukou District, Nanjing, 211800, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7658-8184","authenticated-orcid":false,"given":"Jianqiu","family":"Huang","sequence":"additional","affiliation":[{"name":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, No.2 Sipailou, Xuanwu District, Nanjing 210096, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2015,9,8]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Priya, S., and Inman, D.J. (2009). Energy Harvesting Technologies, Springer Publishing Company Inc.. [1st ed.].","DOI":"10.1007\/978-0-387-76464-1"},{"key":"ref_2","doi-asserted-by":"crossref","unstructured":"Pang, C., Zhao, Z., Zhang, J., Shi, L., Du, L., Fang, Z., and Liu, Y. (2009, January 5\u20138). An advantageous fabrication technology to integrate pressure sensor into multi-sensor for micro weather station. Proceedings of the 2009 the 4th IEEE International Conference on Nano\/Micro Engineered and Molecular Systems, Shenzhen, China.","DOI":"10.1109\/NEMS.2009.5068575"},{"key":"ref_3","first-page":"28","article-title":"A novel, media-compatible pressure sensor for automotive application","volume":"117","author":"Dunbar","year":"2000","journal-title":"Sensors"},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"267","DOI":"10.1016\/j.sna.2010.05.031","article-title":"A SOI Pirani sensor with triple heat sinks","volume":"162","author":"Li","year":"2010","journal-title":"Sens. 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[1st ed.]."}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/15\/9\/22692\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T20:48:08Z","timestamp":1760215688000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/15\/9\/22692"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,9,8]]},"references-count":23,"journal-issue":{"issue":"9","published-online":{"date-parts":[[2015,9]]}},"alternative-id":["s150922692"],"URL":"https:\/\/doi.org\/10.3390\/s150922692","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2015,9,8]]}}}