{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,12]],"date-time":"2025-10-12T04:26:16Z","timestamp":1760243176925,"version":"build-2065373602"},"reference-count":24,"publisher":"MDPI AG","issue":"12","license":[{"start":{"date-parts":[[2015,11,30]],"date-time":"2015-11-30T00:00:00Z","timestamp":1448841600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"the National High-Tech Development Program of China","award":["2013AA041106"],"award-info":[{"award-number":["2013AA041106"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>For a two-dimensional solid silicon thermal wind sensor with symmetrical structure, the wind speed and direction information can be derived from the output voltages in two orthogonal directions, i.e., the north-south and east-west. However, the output voltages in these two directions will vary linearly with the ambient temperature. Therefore, in this paper, a temperature model to study the temperature effect on the wind direction measurement has been developed. A theoretical analysis has been presented first, and then Finite Element Method (FEM) simulations have been performed. It is found that due to symmetrical structure of the thermal wind sensor, the temperature effects on the output signals in the north-south and east-west directions are highly similar. As a result, the wind direction measurement of the thermal wind sensor is approximately independent of the ambient temperature. The experimental results fit the theoretical analysis and simulation results very well.<\/jats:p>","DOI":"10.3390\/s151229771","type":"journal-article","created":{"date-parts":[[2015,11,30]],"date-time":"2015-11-30T10:57:24Z","timestamp":1448881044000},"page":"29871-29881","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":11,"title":["Temperature Effects on the Wind Direction Measurement of 2D Solid Thermal Wind Sensors"],"prefix":"10.3390","volume":"15","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-4428-6250","authenticated-orcid":false,"given":"Bei","family":"Chen","sequence":"first","affiliation":[{"name":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China"}]},{"given":"Yan-Qing","family":"Zhu","sequence":"additional","affiliation":[{"name":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China"}]},{"given":"Zhenxiang","family":"Yi","sequence":"additional","affiliation":[{"name":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China"}]},{"given":"Ming","family":"Qin","sequence":"additional","affiliation":[{"name":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0646-7635","authenticated-orcid":false,"given":"Qing-An","family":"Huang","sequence":"additional","affiliation":[{"name":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China"}]}],"member":"1968","published-online":{"date-parts":[[2015,11,30]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"565","DOI":"10.1088\/0957-0233\/1\/7\/005","article-title":"Silicon thermal flow sensor with a two-dimensional direction sensitivity","volume":"1","year":"1990","journal-title":"Meas. Sci. Technol."},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"216","DOI":"10.1109\/JIOT.2014.2319296","article-title":"2-D micromachined thermal wind sensors\u2014A review","volume":"1","author":"Zhu","year":"2014","journal-title":"IEEE Internet Things J."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"212","DOI":"10.1016\/j.sna.2004.01.053","article-title":"The temperature compensation of a thermal flow sensor by changing the slope and the ratio of resistances","volume":"114","author":"Nam","year":"2004","journal-title":"Sens. Actuators A Phys."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"1715","DOI":"10.1109\/TIM.2009.2025988","article-title":"A temperature compensation circuit for thermal flow sensors operated in constant-temperature-difference mode","volume":"59","author":"Sosna","year":"2010","journal-title":"IEEE Trans. Instrum. Meas."},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"085404","DOI":"10.1088\/0957-0233\/22\/8\/085404","article-title":"Temperature compensation for thermal anemometers using temperature sensors independent of flow sensors","volume":"22","author":"Que","year":"2011","journal-title":"Meas. Sci. Technol."},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"908","DOI":"10.1109\/JMEMS.2014.2300179","article-title":"Thermal flow-sensor drift reduction by thermopile voltage cancellation via power feedback control","volume":"23","author":"Dijkstra","year":"2014","journal-title":"J. Microelectromech. Syst."},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"1162","DOI":"10.1109\/JSEN.2010.2083651","article-title":"An offset compensation method with low residual drift for integrated thermal flow sensors","volume":"11","author":"Bruschi","year":"2011","journal-title":"IEEE Sens. J."},{"key":"ref_8","doi-asserted-by":"crossref","first-page":"7","DOI":"10.1016\/S0924-4247(98)00248-9","article-title":"Thermal flow sensor for liquids and gases based on combinations of two principles","volume":"73","author":"Ashauer","year":"1999","journal-title":"Sens. Actuators A Phys."},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"139","DOI":"10.1016\/S0924-4247(00)00370-8","article-title":"Wide range semiconductor flow sensors","volume":"85","author":"Glaninger","year":"2000","journal-title":"Sens. Actuators A Phys."},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"282","DOI":"10.1016\/j.sna.2003.10.068","article-title":"Multi-range silicon micromachined flow sensor","volume":"110","author":"Sabate","year":"2004","journal-title":"Sens. Actuators A Phys."},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"3318","DOI":"10.1109\/JSEN.2012.2219619","article-title":"MEMS thermal flow sensor with smart electronic interface circuit","volume":"12","author":"Dalola","year":"2012","journal-title":"IEEE Sens. J."},{"key":"ref_12","doi-asserted-by":"crossref","first-page":"113","DOI":"10.1016\/j.sna.2013.03.004","article-title":"Membrane-based thermal flow sensors on flexible substrates","volume":"195","author":"Sturm","year":"2013","journal-title":"Sens. Actuators A Phys."},{"key":"ref_13","first-page":"425","article-title":"High-sensivity 2-D flow sensor with an etched thermal isolation structure","volume":"21\u201323","year":"1990","journal-title":"Sens. Actuators A Phys."},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"64","DOI":"10.1016\/S0924-4247(03)00268-1","article-title":"A circular-type thermal flow direction sensor free from temperature compensation","volume":"108","author":"Kim","year":"2003","journal-title":"Sens. Actuators A Phys."},{"key":"ref_15","doi-asserted-by":"crossref","first-page":"1688","DOI":"10.1109\/JSEN.2009.2030652","article-title":"A low-power 2-D wind sensor based on integrated flow meters","volume":"9","author":"Bruschi","year":"2009","journal-title":"IEEE Sens. J."},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"3617","DOI":"10.1088\/0957-0233\/18\/11\/047","article-title":"A smart flow measurement system for flow evaluation with multiple signals in different operation modes","volume":"18","author":"Kaltsas","year":"2007","journal-title":"Meas. Sci. Technol."},{"key":"ref_17","doi-asserted-by":"crossref","first-page":"14838","DOI":"10.3390\/s121114838","article-title":"Novel air flow meter for an automobile engine using a Si sensor with porous Si thermal isolation","volume":"12","author":"Hourdakis","year":"2012","journal-title":"Sensors"},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"67","DOI":"10.1016\/j.sna.2013.11.017","article-title":"Out-of-plane MEMS-based mechanical airflow sensor co-integrated in SOI CMOS technology","volume":"206","author":"Andre","year":"2014","journal-title":"Sens. Actuators A Phys."},{"key":"ref_19","doi-asserted-by":"crossref","first-page":"990","DOI":"10.1109\/JSEN.2006.888599","article-title":"Flip-chip packaging for a two-dimensional thermal flow sensor using a copper pillar bump technology","volume":"7","author":"Sun","year":"2007","journal-title":"IEEE Sens. J."},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"15","DOI":"10.1016\/S0924-4247(02)00034-1","article-title":"A smart wind sensor using thermal sigma-delta modulation techniques","volume":"97\u201398","author":"Makinwa","year":"2002","journal-title":"Sens. Actuators A Phys."},{"key":"ref_21","doi-asserted-by":"crossref","first-page":"253","DOI":"10.1109\/JMEMS.2014.2298403","article-title":"Effects of ambi-ent humidity on a micromachined silicon thermal wind sensor","volume":"23","author":"Chen","year":"2014","journal-title":"J. Microelectromech. Syst."},{"key":"ref_22","doi-asserted-by":"crossref","unstructured":"Huang, Q.A., Chen, B., Zhu, Y.Q., and Qin, M. (2015). Modeling of temperature effects on micromachined silicon thermal wind sensors. J. Microelectromech. Syst., in press.","DOI":"10.1109\/JMEMS.2015.2464213"},{"key":"ref_23","unstructured":"Harper, C.A. (2004). Electronic Materials and Processes Handbook, McGraw-Hill Companies."},{"key":"ref_24","doi-asserted-by":"crossref","first-page":"1098","DOI":"10.1016\/j.enconman.2007.09.015","article-title":"Thermophysical and transport properties of humid air at temperature range between 0 and 100 \u00b0C","volume":"49","author":"Tsilingiris","year":"2007","journal-title":"Energy Convers. Manag."}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/15\/12\/29771\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T20:52:59Z","timestamp":1760215979000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/15\/12\/29771"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,11,30]]},"references-count":24,"journal-issue":{"issue":"12","published-online":{"date-parts":[[2015,12]]}},"alternative-id":["s151229771"],"URL":"https:\/\/doi.org\/10.3390\/s151229771","relation":{},"ISSN":["1424-8220"],"issn-type":[{"type":"electronic","value":"1424-8220"}],"subject":[],"published":{"date-parts":[[2015,11,30]]}}}